CL2012000295A1 - Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro. - Google Patents

Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro.

Info

Publication number
CL2012000295A1
CL2012000295A1 CL2012000295A CL2012000295A CL2012000295A1 CL 2012000295 A1 CL2012000295 A1 CL 2012000295A1 CL 2012000295 A CL2012000295 A CL 2012000295A CL 2012000295 A CL2012000295 A CL 2012000295A CL 2012000295 A1 CL2012000295 A1 CL 2012000295A1
Authority
CL
Chile
Prior art keywords
filter
deposition system
cathode
arc deposition
anode
Prior art date
Application number
CL2012000295A
Other languages
English (en)
Inventor
Klaus Brondum
Original Assignee
Vapor Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vapor Technologies Inc filed Critical Vapor Technologies Inc
Publication of CL2012000295A1 publication Critical patent/CL2012000295A1/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Filtro para sistema de deposición por arco que comprende cátodo alargado, ánodo y al menos un sustrato, filtro comprende número para de ensambles de conductos simétricamente colocados alrededor del cátodo alargado; y sistema de deposición.
CL2012000295A 2011-02-03 2012-02-03 Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro. CL2012000295A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/020,290 US20120199070A1 (en) 2011-02-03 2011-02-03 Filter for arc source

Publications (1)

Publication Number Publication Date
CL2012000295A1 true CL2012000295A1 (es) 2012-07-06

Family

ID=45655376

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2012000295A CL2012000295A1 (es) 2011-02-03 2012-02-03 Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro.

Country Status (10)

Country Link
US (1) US20120199070A1 (es)
EP (1) EP2485242A1 (es)
JP (1) JP2012162803A (es)
CN (1) CN102628159A (es)
AR (1) AR085130A1 (es)
BR (1) BR102012002561A2 (es)
CA (1) CA2764009A1 (es)
CL (1) CL2012000295A1 (es)
IN (1) IN2012DE00106A (es)
RU (1) RU2012103666A (es)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10304665B2 (en) 2011-09-07 2019-05-28 Nano-Product Engineering, LLC Reactors for plasma-assisted processes and associated methods
US9761424B1 (en) 2011-09-07 2017-09-12 Nano-Product Engineering, LLC Filtered cathodic arc method, apparatus and applications thereof
US9793098B2 (en) 2012-09-14 2017-10-17 Vapor Technologies, Inc. Low pressure arc plasma immersion coating vapor deposition and ion treatment
US9412569B2 (en) * 2012-09-14 2016-08-09 Vapor Technologies, Inc. Remote arc discharge plasma assisted processes
US10056237B2 (en) 2012-09-14 2018-08-21 Vapor Technologies, Inc. Low pressure arc plasma immersion coating vapor deposition and ion treatment
PL2778254T3 (pl) 2013-03-15 2016-07-29 Vapor Technologies Inc Osadzanie z fazy gazowej powłoki w plazmie niskociśnieniowego wyładowania łukowego i obróbka jonowa
CA2867451C (en) 2013-10-28 2021-06-29 Vapor Technologies, Inc. Low pressure arc plasma immersion coating vapor deposition and ion treatment
KR102215808B1 (ko) 2014-05-13 2021-02-17 아고르 알바 에쓰에이 진공 중 음극성 아크 물리 기상 증착(pvd)에서의 매크로 입자를 필터링하기 위한 방법
KR101766204B1 (ko) * 2015-10-30 2017-08-10 한국생산기술연구원 스크린을 포함하는 아크 이온 플레이팅 장치
EP3263737B1 (en) * 2016-06-29 2019-06-12 Oerlikon Surface Solutions AG, Pfäffikon Vacuum coating chamber and method for filtering macroparticles during cathodic arc evaporation
US11834204B1 (en) 2018-04-05 2023-12-05 Nano-Product Engineering, LLC Sources for plasma assisted electric propulsion
JP7278174B2 (ja) * 2019-08-23 2023-05-19 東京エレクトロン株式会社 プラズマ溶射装置及びプラズマ溶射方法
CN111074215B (zh) * 2019-12-27 2021-07-02 季华实验室 一种新型阴极电弧的颗粒过滤器
CN114481045A (zh) * 2021-12-22 2022-05-13 昆山浦元真空技术工程有限公司 电弧靶阳极辉光真空镀膜工艺及其所用的设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5269898A (en) 1991-03-20 1993-12-14 Vapor Technologies, Inc. Apparatus and method for coating a substrate using vacuum arc evaporation
DE4123274C2 (de) * 1991-07-13 1996-12-19 Leybold Ag Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung
US5997705A (en) 1999-04-14 1999-12-07 Vapor Technologies, Inc. Rectangular filtered arc plasma source
JP2005509752A (ja) * 2001-11-15 2005-04-14 アイオニック フュージョン コーポレイション イオンプラズマ蒸着装置
US7883633B2 (en) * 2003-02-14 2011-02-08 Applied Materials, Inc. Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor
US7498587B2 (en) * 2006-05-01 2009-03-03 Vapor Technologies, Inc. Bi-directional filtered arc plasma source

Also Published As

Publication number Publication date
EP2485242A1 (en) 2012-08-08
IN2012DE00106A (es) 2015-05-08
US20120199070A1 (en) 2012-08-09
CA2764009A1 (en) 2012-08-03
CN102628159A (zh) 2012-08-08
AR085130A1 (es) 2013-09-11
RU2012103666A (ru) 2013-08-10
BR102012002561A2 (pt) 2013-07-23
JP2012162803A (ja) 2012-08-30

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