CL2012000295A1 - Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro. - Google Patents
Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro.Info
- Publication number
- CL2012000295A1 CL2012000295A1 CL2012000295A CL2012000295A CL2012000295A1 CL 2012000295 A1 CL2012000295 A1 CL 2012000295A1 CL 2012000295 A CL2012000295 A CL 2012000295A CL 2012000295 A CL2012000295 A CL 2012000295A CL 2012000295 A1 CL2012000295 A1 CL 2012000295A1
- Authority
- CL
- Chile
- Prior art keywords
- filter
- deposition system
- cathode
- arc deposition
- anode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Filtro para sistema de deposición por arco que comprende cátodo alargado, ánodo y al menos un sustrato, filtro comprende número para de ensambles de conductos simétricamente colocados alrededor del cátodo alargado; y sistema de deposición.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/020,290 US20120199070A1 (en) | 2011-02-03 | 2011-02-03 | Filter for arc source |
Publications (1)
Publication Number | Publication Date |
---|---|
CL2012000295A1 true CL2012000295A1 (es) | 2012-07-06 |
Family
ID=45655376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CL2012000295A CL2012000295A1 (es) | 2011-02-03 | 2012-02-03 | Filtro para un sistema de deposición por arco, que comprende un cátodo alargado, ánodo, y al menos un substrato y un número par de ensambles de conductos simétricamente colocados alrededor alternativamente conectados a la parte superior e inferior del cátodo; y sistema de deposición por arco que comprende dicho filtro. |
Country Status (10)
Country | Link |
---|---|
US (1) | US20120199070A1 (es) |
EP (1) | EP2485242A1 (es) |
JP (1) | JP2012162803A (es) |
CN (1) | CN102628159A (es) |
AR (1) | AR085130A1 (es) |
BR (1) | BR102012002561A2 (es) |
CA (1) | CA2764009A1 (es) |
CL (1) | CL2012000295A1 (es) |
IN (1) | IN2012DE00106A (es) |
RU (1) | RU2012103666A (es) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10304665B2 (en) | 2011-09-07 | 2019-05-28 | Nano-Product Engineering, LLC | Reactors for plasma-assisted processes and associated methods |
US9761424B1 (en) | 2011-09-07 | 2017-09-12 | Nano-Product Engineering, LLC | Filtered cathodic arc method, apparatus and applications thereof |
US9793098B2 (en) | 2012-09-14 | 2017-10-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
US9412569B2 (en) * | 2012-09-14 | 2016-08-09 | Vapor Technologies, Inc. | Remote arc discharge plasma assisted processes |
US10056237B2 (en) | 2012-09-14 | 2018-08-21 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
PL2778254T3 (pl) | 2013-03-15 | 2016-07-29 | Vapor Technologies Inc | Osadzanie z fazy gazowej powłoki w plazmie niskociśnieniowego wyładowania łukowego i obróbka jonowa |
CA2867451C (en) | 2013-10-28 | 2021-06-29 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
KR102215808B1 (ko) | 2014-05-13 | 2021-02-17 | 아고르 알바 에쓰에이 | 진공 중 음극성 아크 물리 기상 증착(pvd)에서의 매크로 입자를 필터링하기 위한 방법 |
KR101766204B1 (ko) * | 2015-10-30 | 2017-08-10 | 한국생산기술연구원 | 스크린을 포함하는 아크 이온 플레이팅 장치 |
EP3263737B1 (en) * | 2016-06-29 | 2019-06-12 | Oerlikon Surface Solutions AG, Pfäffikon | Vacuum coating chamber and method for filtering macroparticles during cathodic arc evaporation |
US11834204B1 (en) | 2018-04-05 | 2023-12-05 | Nano-Product Engineering, LLC | Sources for plasma assisted electric propulsion |
JP7278174B2 (ja) * | 2019-08-23 | 2023-05-19 | 東京エレクトロン株式会社 | プラズマ溶射装置及びプラズマ溶射方法 |
CN111074215B (zh) * | 2019-12-27 | 2021-07-02 | 季华实验室 | 一种新型阴极电弧的颗粒过滤器 |
CN114481045A (zh) * | 2021-12-22 | 2022-05-13 | 昆山浦元真空技术工程有限公司 | 电弧靶阳极辉光真空镀膜工艺及其所用的设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5269898A (en) | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
DE4123274C2 (de) * | 1991-07-13 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung |
US5997705A (en) | 1999-04-14 | 1999-12-07 | Vapor Technologies, Inc. | Rectangular filtered arc plasma source |
JP2005509752A (ja) * | 2001-11-15 | 2005-04-14 | アイオニック フュージョン コーポレイション | イオンプラズマ蒸着装置 |
US7883633B2 (en) * | 2003-02-14 | 2011-02-08 | Applied Materials, Inc. | Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
US7498587B2 (en) * | 2006-05-01 | 2009-03-03 | Vapor Technologies, Inc. | Bi-directional filtered arc plasma source |
-
2011
- 2011-02-03 US US13/020,290 patent/US20120199070A1/en not_active Abandoned
-
2012
- 2012-01-11 IN IN106DE2012 patent/IN2012DE00106A/en unknown
- 2012-01-25 CA CA2764009A patent/CA2764009A1/en not_active Abandoned
- 2012-02-01 CN CN2012100224376A patent/CN102628159A/zh active Pending
- 2012-02-02 JP JP2012020522A patent/JP2012162803A/ja active Pending
- 2012-02-02 RU RU2012103666/05A patent/RU2012103666A/ru not_active Application Discontinuation
- 2012-02-03 EP EP12153870A patent/EP2485242A1/en not_active Withdrawn
- 2012-02-03 BR BRBR102012002561-2A patent/BR102012002561A2/pt not_active IP Right Cessation
- 2012-02-03 AR ARP120100355A patent/AR085130A1/es not_active Application Discontinuation
- 2012-02-03 CL CL2012000295A patent/CL2012000295A1/es unknown
Also Published As
Publication number | Publication date |
---|---|
EP2485242A1 (en) | 2012-08-08 |
IN2012DE00106A (es) | 2015-05-08 |
US20120199070A1 (en) | 2012-08-09 |
CA2764009A1 (en) | 2012-08-03 |
CN102628159A (zh) | 2012-08-08 |
AR085130A1 (es) | 2013-09-11 |
RU2012103666A (ru) | 2013-08-10 |
BR102012002561A2 (pt) | 2013-07-23 |
JP2012162803A (ja) | 2012-08-30 |
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