CH80998A - Welding for aluminum - Google Patents

Welding for aluminum

Info

Publication number: CH80998A
Authority: CH; Switzerland
Prior art keywords: welding; aluminum
Prior art date: 1918-08-09

Application number

CH80998A

Other languages

French (fr)

Inventor

Gustave Ferriere

Siegfried Pfyffer

Original Assignee

Gustave Ferriere

Siegfried Pfyffer

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1918-08-09

Filing date

1918-08-09

Publication date

1920-01-02

1918-08-09 Application filed by Gustave Ferriere, Siegfried Pfyffer filed Critical Gustave Ferriere

1920-01-02 Publication of CH80998A publication Critical patent/CH80998A/en

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Conductive Materials (AREA)

CH80998A 1918-08-09 1918-08-09 Welding for aluminum CH80998A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
CH131299X		1918-08-09

Publications (1)

Publication Number	Publication Date
CH80998A true CH80998A (en)	1920-01-02

Family

ID=32660997

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH80998A CH80998A (en)	1918-08-09	1918-08-09	Welding for aluminum

Country Status (2)

Country	Link
CH (1)	CH80998A (en)
GB (1)	GB131299A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0251611A2 (en) *	1986-07-03	1988-01-07	Engelhard Corporation	Low toxicity corrosion resistant solder
EP0704272A1 (en) *	1994-09-30	1996-04-03	AT&T Corp.	Lead-free alloys for use in solder bonding

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0058802A1 (en) *	1980-12-19	1982-09-01	Universal Solder Company (Pty) Limited	Solder
GB8807730D0 (en) *	1988-03-31	1988-05-05	Cookson Group Plc	Low toxicity soldering compositions
GB9103018D0 (en) *	1991-02-13	1991-03-27	Lancashire Fittings Ltd	Lead free soft solder for stainless steel
US6652990B2 (en)	1992-03-27	2003-11-25	The Louis Berkman Company	Corrosion-resistant coated metal and method for making the same
US6080497A (en)	1992-03-27	2000-06-27	The Louis Berkman Company	Corrosion-resistant coated copper metal and method for making the same
US6794060B2 (en)	1992-03-27	2004-09-21	The Louis Berkman Company	Corrosion-resistant coated metal and method for making the same
EP0612578A1 (en) *	1993-02-22	1994-08-31	AT&T Corp.	An Article comprising a pb-free solder having improved mechanical properties
US5320272A (en) *	1993-04-02	1994-06-14	Motorola, Inc.	Tin-bismuth solder connection having improved high temperature properties, and process for forming same
TW251249B (en) *	1993-04-30	1995-07-11	At & T Corp
JP2805595B2 (en) *	1994-11-02	1998-09-30	三井金属鉱業株式会社	Lead-free solder alloy
DE69632866T2 (en) *	1995-09-29	2005-07-14	Matsushita Electric Industrial Co., Ltd., Kadoma	LEAD-FREE LOT
JP3220635B2 (en)	1996-02-09	2001-10-22	松下電器産業株式会社	Solder alloy and cream solder
WO1997047425A1 (en) *	1996-06-12	1997-12-18	International Business Machines Corporation	Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
US6784086B2 (en)	2001-02-08	2004-08-31	International Business Machines Corporation	Lead-free solder structure and method for high fatigue life
US6805974B2 (en)	2002-02-15	2004-10-19	International Business Machines Corporation	Lead-free tin-silver-copper alloy solder composition

1918
- 1918-08-09 CH CH80998A patent/CH80998A/en unknown
1919
- 1919-08-11 GB GB19750/19A patent/GB131299A/en not_active Expired

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0251611A2 (en) *	1986-07-03	1988-01-07	Engelhard Corporation	Low toxicity corrosion resistant solder
EP0251611A3 (en) *	1986-07-03	1989-05-31	Engelhard Corporation	Low toxicity corrosion resistant solder
EP0704272A1 (en) *	1994-09-30	1996-04-03	AT&T Corp.	Lead-free alloys for use in solder bonding
US5698160A (en) *	1994-09-30	1997-12-16	Lucent Technologies Inc.	Lead-free alloys for use in solder bonding

Also Published As

Publication number	Publication date
GB131299A (en)	1900-01-01

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