CH673920A5 - - Google Patents
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- Publication number
- CH673920A5 CH673920A5 CH191287A CH191287A CH673920A5 CH 673920 A5 CH673920 A5 CH 673920A5 CH 191287 A CH191287 A CH 191287A CH 191287 A CH191287 A CH 191287A CH 673920 A5 CH673920 A5 CH 673920A5
- Authority
- CH
- Switzerland
- Prior art keywords
- application according
- ink jet
- deflection
- ink
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Abstract
Electronic circuits are manufactured by means of an ink jet (2) ejected from a pump (1). The ink jet passes into an electrode (3) where it receives a static electric charge which enables it to be deflected by deflection plates (V1, V2, H1, H2) controlled by a computer (5) in order to reach the substrate (4).
Description
DESCRIPTION
La fabrication des circuits électroniques hybrides et imprimés ainsi que leur développement se font actuellement de la manière suivante:
¯Pour les circuits hybrides couches épaisses, le développement consiste dans l'élaboration d'un lay-out puis d'un film photographique à l'échelle 1/1 qui servira à la réalisation des écrans de sérigraphie, la fabrication se faisant par sérigraphie sur substrat céramique, une par couche; les couches sont ensuite cuites dans un four.
¯Pour les circuits hybrides couches minces, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1, une pour chaque couche de matériaux différents, la fabrication se faisant par évaporation sous vide sur substrat céramique, une par couche suivie d'une attaque chimique sélective de chaque couche après avoir exposé une couche photo sensible servant de masque.
¯Pour les circuits imprimés, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1 qui servira dans la fabrication à exposer une couche photo sensible déposée sur le support en matière organique suivie d'une attaque chimique sélective.
Tous les travaux de développement coûtent chers et manquent de souplesse car la moindre correction ou modification du circuit oblige à tout refaire depuis le début.
La fabrication elle-même demande des investissements importants et les procédés sont longs et coûteux. Le but de l'invention est de pallier aux inconvénients cités.
A cet effet, l'application du procédé par jet d'encre pour la fabrication de circuits électroniques hybrides et imprimés selon l'invention fonctionne tel que décrit par la revendication 1.
Les appareils à jet d'encre commandés par ordinateur existent déjà comme imprimantes de textes ou de dessins sur papier ou autre support.
La figure 1 donne le principe de fabrication de circuits électroniques par jet d'encre suivant l'invention. Une pompe 1 envoie un jet d'encre très fin 2 qui, en traversant l'électrode 3, se charge d'électricité statique. Il passe ensuite entre deux paires d'électrodes de déviation Vi et V2 pour la déviation verticale, Hi et H2 pour la déviation horizontale pour finir sur le substrat 4 qui constituera le circuit électronique. La déviation du jet d'encre par les plaques de déviation vr, V2, Hl et H2 est commandée par un ordinateur 5.
Les encres nécessaires à la fabrication de circuits électroniques hybrides et imprimés par le procédé décrit plus haut seront de plusieurs catégories qui dépendent du support. Par exemple, les encres pour circuits hybrides faits sur support céramique sont à cuisson à haute température: environ 800 à 900 K, les encres pour circuits hybrides faits sur support porcelaine sont à cuisson à moyenne température: environ 600 K, les encres pour circuits imprimés faits sur support organique tel qu'époxy sont à cuisson à basse température: environ 125 à 150 K.
De plus, dans chaque catégorie, il y a trois types d'encre bien définis, à savoir:
¯des encres en matériaux électriquement conducteurs qui, après cuisson, formeront les conducteurs du circuit électronique.
¯des encres en matériaux électriquement résistants qui, après cuisson, formeront les résistances du circuit électronique.
¯des encres en matériaux électriquement isolants qui, après cuisson, formeront les couches de protection ainsi que les couches d'isolation entre les différentes couches conductrices.
Les avantages de la présente invention sont les suivants:
¯le désign du circuit se résume à l'écriture des programmes d'ordinateur pour chaque type d'encre.
¯une correction ou modification du circuit se résume par une modification du ou des programmes de l'ordinateur.
¯diminution du nombre de cuissons des encres car plusieurs couches peuvent être cuites en même temps.
¯les circuits peuvent être faits sur des substrats de formes quelconques et de dimensions importantes.
¯gain de temps dans la réalisation des circuits.
¯rendement élevé car les défauts peuvent être corrigés facilement.
¯investissements peu élevés car un appareil à jet d'encre est moins coûteux qu'une sérigraphieuse automatique, qu'un évaporateur sous vide ou qu'un aligneur de masques.
DESCRIPTION
The manufacturing and development of hybrid and printed electronic circuits is currently carried out as follows:
¯For thick-film hybrid circuits, development consists in the development of a lay-out and then a photographic film on a 1/1 scale which will be used for the realization of screen printing screens, the manufacturing being done by screen printing on a ceramic substrate, one per layer; the layers are then baked in an oven.
¯For hybrid thin-film circuits, development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.
¯For printed circuits, development consists in the development of a lay-out and then a photographic plate on a 1/1 scale which will be used in manufacturing to expose a sensitive photo layer deposited on the support in organic matter followed by a selective chemical attack.
All development work is expensive and lacks flexibility because the slightest correction or modification of the circuit means having to redo everything from the start.
Manufacturing itself requires significant investment and the processes are long and expensive. The object of the invention is to overcome the drawbacks mentioned.
To this end, the application of the ink jet method for the manufacture of hybrid and printed electronic circuits according to the invention operates as described by claim 1.
Computer-controlled inkjet devices already exist as text or design printers on paper or other media.
Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention. A pump 1 sends a very fine ink jet 2 which, while passing through the electrode 3, is charged with static electricity. It then passes between two pairs of deflection electrodes Vi and V2 for the vertical deflection, Hi and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit. The deflection of the ink jet by the deflection plates vr, V2, Hl and H2 is controlled by a computer 5.
The inks necessary for the manufacture of hybrid electronic circuits and printed by the process described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: around 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 K, inks for printed circuits made on organic support such as epoxy are cooked at low temperature: about 125 to 150 K.
In addition, in each category, there are three well-defined types of ink, namely:
¯ inks made of electrically conductive materials which, after firing, will form the conductors of the electronic circuit.
¯ inks made of electrically resistant materials which, after firing, will form the resistors of the electronic circuit.
¯ inks made of electrically insulating materials which, after firing, will form the protective layers as well as the insulation layers between the different conductive layers.
The advantages of the present invention are as follows:
The circuit design comes down to writing computer programs for each type of ink.
¯ a correction or modification of the circuit is summed up by a modification of the computer program (s).
¯ Reduction in the number of times the inks are fired because several layers can be fired at the same time.
¯the circuits can be made on substrates of any shape and large dimensions.
¯ time savings in the realization of the circuits.
¯high efficiency because faults can be corrected easily.
¯Low investments because an inkjet device is less expensive than an automatic screen printer, than a vacuum evaporator or a mask aligner.
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH191287A CH673920A5 (en) | 1987-05-19 | 1987-05-19 | |
PCT/CH1988/000090 WO1988009598A1 (en) | 1987-05-19 | 1988-05-17 | Application of the ink jet process for manufacturing hybrid and printed electronic circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH191287A CH673920A5 (en) | 1987-05-19 | 1987-05-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH673920A5 true CH673920A5 (en) | 1990-04-12 |
Family
ID=4221501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH191287A CH673920A5 (en) | 1987-05-19 | 1987-05-19 |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH673920A5 (en) |
WO (1) | WO1988009598A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0930641A3 (en) * | 1998-01-19 | 2000-02-02 | Seiko Epson Corporation | Pattern formation method and substrate manufacturing apparatus |
WO2002047447A1 (en) * | 2000-12-09 | 2002-06-13 | Xaar Technology Limited | Method of forming electrically conductive elements and patterns of such elements |
US6730357B2 (en) | 2000-03-23 | 2004-05-04 | Seiko Epson Corporation | Deposition of soluble materials |
EP1475177A1 (en) * | 2003-05-09 | 2004-11-10 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
EP1672971A1 (en) * | 2003-09-12 | 2006-06-21 | National Institute of Advanced Industrial Science and Technology | Substrate and method for manufacturing same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2718142B1 (en) * | 1994-03-31 | 1996-12-20 | Toxot Science & Appl | Inks for depositing dielectric layers by the continuous ink jet printing technique. |
DK1070444T3 (en) * | 1998-04-09 | 2002-07-22 | B R Deutschland Vertr D Bundes | Method and apparatus for making thin-layer structures |
FR2797976B1 (en) * | 1999-08-25 | 2002-03-22 | Gemplus Card Int | METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8429754D0 (en) * | 1984-11-24 | 1985-01-03 | Plessey Co Plc | Coating electrical equipment |
-
1987
- 1987-05-19 CH CH191287A patent/CH673920A5/fr not_active IP Right Cessation
-
1988
- 1988-05-17 WO PCT/CH1988/000090 patent/WO1988009598A1/en unknown
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0930641A3 (en) * | 1998-01-19 | 2000-02-02 | Seiko Epson Corporation | Pattern formation method and substrate manufacturing apparatus |
US6877853B2 (en) | 1998-01-19 | 2005-04-12 | Seiko Epson Corporation | Pattern formation method and substrate manufacturing apparatus |
US7114802B2 (en) | 1998-01-19 | 2006-10-03 | Seiko Epson Corporation | Pattern formation method and substrate manufacturing apparatus |
US6730357B2 (en) | 2000-03-23 | 2004-05-04 | Seiko Epson Corporation | Deposition of soluble materials |
WO2002047447A1 (en) * | 2000-12-09 | 2002-06-13 | Xaar Technology Limited | Method of forming electrically conductive elements and patterns of such elements |
EP1475177A1 (en) * | 2003-05-09 | 2004-11-10 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
EP1672971A1 (en) * | 2003-09-12 | 2006-06-21 | National Institute of Advanced Industrial Science and Technology | Substrate and method for manufacturing same |
EP1672971A4 (en) * | 2003-09-12 | 2009-08-19 | Nat Inst Of Advanced Ind Scien | Substrate and method for manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
WO1988009598A1 (en) | 1988-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |