CH673920A5 - - Google Patents

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Publication number
CH673920A5
CH673920A5 CH191287A CH191287A CH673920A5 CH 673920 A5 CH673920 A5 CH 673920A5 CH 191287 A CH191287 A CH 191287A CH 191287 A CH191287 A CH 191287A CH 673920 A5 CH673920 A5 CH 673920A5
Authority
CH
Switzerland
Prior art keywords
application according
ink jet
deflection
ink
substrate
Prior art date
Application number
CH191287A
Other languages
French (fr)
Inventor
Rino Doriguzzi
Original Assignee
Rino Doriguzzi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rino Doriguzzi filed Critical Rino Doriguzzi
Priority to CH191287A priority Critical patent/CH673920A5/fr
Priority to PCT/CH1988/000090 priority patent/WO1988009598A1/en
Publication of CH673920A5 publication Critical patent/CH673920A5/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0091Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105Using an electrical field; Special methods of applying an electric potential

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)

Abstract

Electronic circuits are manufactured by means of an ink jet (2) ejected from a pump (1). The ink jet passes into an electrode (3) where it receives a static electric charge which enables it to be deflected by deflection plates (V1, V2, H1, H2) controlled by a computer (5) in order to reach the substrate (4).

Description

       

  
 



   DESCRIPTION



   La fabrication des circuits électroniques hybrides et imprimés ainsi que leur développement se font actuellement de la manière suivante:
 ¯Pour les circuits hybrides couches épaisses, le développement consiste dans l'élaboration d'un lay-out puis d'un film photographique à l'échelle 1/1 qui servira à la réalisation des écrans de sérigraphie, la fabrication se faisant par sérigraphie sur substrat céramique, une par couche; les couches sont ensuite cuites dans un four.



   ¯Pour les circuits hybrides couches minces, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1, une pour chaque couche de matériaux différents, la fabrication se faisant par évaporation sous vide sur substrat céramique, une par couche suivie d'une attaque chimique sélective de chaque couche après avoir exposé une couche photo sensible servant de masque.



   ¯Pour les circuits imprimés, le développement consiste dans l'élaboration d'un lay-out puis d'une plaque photographique à l'échelle 1/1 qui servira dans la fabrication à exposer une couche photo sensible déposée sur le support en matière organique suivie d'une attaque chimique sélective.



   Tous les travaux de développement coûtent chers et manquent de souplesse car la moindre correction ou modification du circuit oblige à tout refaire depuis le début.



   La fabrication elle-même demande des investissements importants et les procédés sont longs et coûteux. Le but de l'invention est de pallier aux inconvénients cités.



   A cet effet, l'application du procédé par jet d'encre pour la fabrication de circuits électroniques hybrides et imprimés selon l'invention fonctionne tel que décrit par la revendication 1.



   Les appareils à jet d'encre commandés par ordinateur existent déjà comme imprimantes de textes ou de dessins sur papier ou autre support.



   La figure   1    donne le principe de fabrication de circuits électroniques par jet d'encre suivant l'invention. Une pompe   1    envoie un jet d'encre très fin 2 qui, en traversant l'électrode 3, se charge d'électricité statique. Il passe ensuite entre deux paires d'électrodes de déviation   Vi    et V2 pour la déviation verticale,   Hi    et H2 pour la déviation horizontale pour finir sur le substrat 4 qui constituera le circuit électronique. La déviation du jet d'encre par les plaques de déviation   vr,    V2, Hl et H2 est commandée par un ordinateur 5.



   Les encres nécessaires à la fabrication de circuits électroniques hybrides et imprimés par le procédé décrit plus haut seront de plusieurs catégories qui dépendent du support. Par exemple, les encres pour circuits hybrides faits sur support céramique sont à cuisson à haute température: environ 800 à   900 K,    les encres pour circuits hybrides faits sur support porcelaine sont à cuisson à moyenne température: environ   600 K,    les encres pour circuits imprimés faits sur support organique tel qu'époxy sont à cuisson à basse température: environ 125 à   150 K.   



   De plus, dans chaque catégorie, il y a trois types d'encre bien définis, à savoir:
 ¯des encres en matériaux électriquement conducteurs qui, après cuisson, formeront les conducteurs du circuit électronique.



   ¯des encres en matériaux électriquement résistants qui, après cuisson, formeront les résistances du circuit électronique.



   ¯des encres en matériaux électriquement isolants qui, après cuisson, formeront les couches de protection ainsi que les couches d'isolation entre les différentes couches conductrices.



   Les avantages de la présente invention sont les suivants:
   ¯le    désign du circuit se résume à l'écriture des programmes d'ordinateur pour chaque type d'encre.



   ¯une correction ou modification du circuit se résume par une modification du ou des programmes de l'ordinateur.



   ¯diminution du nombre de cuissons des encres car plusieurs couches peuvent être cuites en même temps.



   ¯les circuits peuvent être faits sur des substrats de formes quelconques et de dimensions importantes.



   ¯gain de temps dans la réalisation des circuits.



   ¯rendement élevé car les défauts peuvent être corrigés facilement.



   ¯investissements peu élevés car un appareil à jet d'encre est moins coûteux qu'une sérigraphieuse automatique, qu'un évaporateur sous vide ou qu'un aligneur de masques. 



  
 



   DESCRIPTION



   The manufacturing and development of hybrid and printed electronic circuits is currently carried out as follows:
 ¯For thick-film hybrid circuits, development consists in the development of a lay-out and then a photographic film on a 1/1 scale which will be used for the realization of screen printing screens, the manufacturing being done by screen printing on a ceramic substrate, one per layer; the layers are then baked in an oven.



   ¯For hybrid thin-film circuits, development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.



   ¯For printed circuits, development consists in the development of a lay-out and then a photographic plate on a 1/1 scale which will be used in manufacturing to expose a sensitive photo layer deposited on the support in organic matter followed by a selective chemical attack.



   All development work is expensive and lacks flexibility because the slightest correction or modification of the circuit means having to redo everything from the start.



   Manufacturing itself requires significant investment and the processes are long and expensive. The object of the invention is to overcome the drawbacks mentioned.



   To this end, the application of the ink jet method for the manufacture of hybrid and printed electronic circuits according to the invention operates as described by claim 1.



   Computer-controlled inkjet devices already exist as text or design printers on paper or other media.



   Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention. A pump 1 sends a very fine ink jet 2 which, while passing through the electrode 3, is charged with static electricity. It then passes between two pairs of deflection electrodes Vi and V2 for the vertical deflection, Hi and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit. The deflection of the ink jet by the deflection plates vr, V2, Hl and H2 is controlled by a computer 5.



   The inks necessary for the manufacture of hybrid electronic circuits and printed by the process described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: around 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 K, inks for printed circuits made on organic support such as epoxy are cooked at low temperature: about 125 to 150 K.



   In addition, in each category, there are three well-defined types of ink, namely:
 ¯ inks made of electrically conductive materials which, after firing, will form the conductors of the electronic circuit.



   ¯ inks made of electrically resistant materials which, after firing, will form the resistors of the electronic circuit.



   ¯ inks made of electrically insulating materials which, after firing, will form the protective layers as well as the insulation layers between the different conductive layers.



   The advantages of the present invention are as follows:
   The circuit design comes down to writing computer programs for each type of ink.



   ¯ a correction or modification of the circuit is summed up by a modification of the computer program (s).



   ¯ Reduction in the number of times the inks are fired because several layers can be fired at the same time.



   ¯the circuits can be made on substrates of any shape and large dimensions.



   ¯ time savings in the realization of the circuits.



   ¯high efficiency because faults can be corrected easily.



   ¯Low investments because an inkjet device is less expensive than an automatic screen printer, than a vacuum evaporator or a mask aligner.


    

Claims (7)

REVENDICATIONS 1. Application du procédé dans lequel on utilise un jet d'encre (2) issu d'une pompe (i) lequel passant dans une électrode (3) se charge d'électricité statique pouvant ainsi être dévié par des plaques de déviation (Vi, V2, Hi, H2) commandées par ordinateur (5) pour atteindre un substrat (4) pour fabriquer un circuit électronique hybride ou imprimé.  CLAIMS    1. Application of the method in which an ink jet (2) from a pump (i) is used which passing through an electrode (3) is charged with static electricity which can thus be deflected by deflection plates (Vi , V2, Hi, H2) controlled by computer (5) to reach a substrate (4) for manufacturing a hybrid or printed electronic circuit. 2. Application suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux électriquement conducteurs.  2. Application according to claim 1 characterized in that the ink used is made of electrically conductive materials. 3. Application suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux électriquement résistants.  3. Application according to claim 1 characterized in that the ink used is made of electrically resistant materials. 4. Application suivant revendication 1 caractérisée par le fait que l'encre utilisée est en matériaux isolants.  4. Application according to claim 1 characterized in that the ink used is made of insulating materials. 5. Application suivant revendication 1 caractérisée par le fait que la déviation du jet d'encre (2) se fait par champ électrique.  5. Application according to claim 1 characterized in that the deflection of the ink jet (2) is done by electric field. 6. Application suivant revendication 1 caractérisée par le fait que la déviation du jet d'encre (2) se fait par champ magné- tique.  6. Application according to claim 1 characterized in that the deflection of the ink jet (2) is done by magnetic field. 7. Application suivant revendication 1 caractérisée par le fait que le substrat (4) est en matériaux céramiques, organiques chargés ou non, anorganiques ou métalliques.  7. Application according to claim 1 characterized in that the substrate (4) is made of ceramic, organic materials, loaded or not, inorganic or metallic.
CH191287A 1987-05-19 1987-05-19 CH673920A5 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (en) 1987-05-19 1987-05-19
PCT/CH1988/000090 WO1988009598A1 (en) 1987-05-19 1988-05-17 Application of the ink jet process for manufacturing hybrid and printed electronic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (en) 1987-05-19 1987-05-19

Publications (1)

Publication Number Publication Date
CH673920A5 true CH673920A5 (en) 1990-04-12

Family

ID=4221501

Family Applications (1)

Application Number Title Priority Date Filing Date
CH191287A CH673920A5 (en) 1987-05-19 1987-05-19

Country Status (2)

Country Link
CH (1) CH673920A5 (en)
WO (1) WO1988009598A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930641A3 (en) * 1998-01-19 2000-02-02 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
WO2002047447A1 (en) * 2000-12-09 2002-06-13 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements
US6730357B2 (en) 2000-03-23 2004-05-04 Seiko Epson Corporation Deposition of soluble materials
EP1475177A1 (en) * 2003-05-09 2004-11-10 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
EP1672971A1 (en) * 2003-09-12 2006-06-21 National Institute of Advanced Industrial Science and Technology Substrate and method for manufacturing same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142B1 (en) * 1994-03-31 1996-12-20 Toxot Science & Appl Inks for depositing dielectric layers by the continuous ink jet printing technique.
DK1070444T3 (en) * 1998-04-09 2002-07-22 B R Deutschland Vertr D Bundes Method and apparatus for making thin-layer structures
FR2797976B1 (en) * 1999-08-25 2002-03-22 Gemplus Card Int METHOD FOR MANUFACTURING HYBRID CHIP CARDS AND CHIP CARDS OBTAINED BY SAID METHOD

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8429754D0 (en) * 1984-11-24 1985-01-03 Plessey Co Plc Coating electrical equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930641A3 (en) * 1998-01-19 2000-02-02 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US6877853B2 (en) 1998-01-19 2005-04-12 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US7114802B2 (en) 1998-01-19 2006-10-03 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US6730357B2 (en) 2000-03-23 2004-05-04 Seiko Epson Corporation Deposition of soluble materials
WO2002047447A1 (en) * 2000-12-09 2002-06-13 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements
EP1475177A1 (en) * 2003-05-09 2004-11-10 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
EP1672971A1 (en) * 2003-09-12 2006-06-21 National Institute of Advanced Industrial Science and Technology Substrate and method for manufacturing same
EP1672971A4 (en) * 2003-09-12 2009-08-19 Nat Inst Of Advanced Ind Scien Substrate and method for manufacturing same

Also Published As

Publication number Publication date
WO1988009598A1 (en) 1988-12-01

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