CH603826A5 - - Google Patents

Info

Publication number
CH603826A5
CH603826A5 CH1583076A CH1583076A CH603826A5 CH 603826 A5 CH603826 A5 CH 603826A5 CH 1583076 A CH1583076 A CH 1583076A CH 1583076 A CH1583076 A CH 1583076A CH 603826 A5 CH603826 A5 CH 603826A5
Authority
CH
Switzerland
Application number
CH1583076A
Inventor
Peter Stevens
John M Deuber
Kathleen R Rosikiewicz
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of CH603826A5 publication Critical patent/CH603826A5/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
CH1583076A 1975-12-24 1976-12-16 CH603826A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/644,236 US4013523A (en) 1975-12-24 1975-12-24 Tin-gold electroplating bath and process

Publications (1)

Publication Number Publication Date
CH603826A5 true CH603826A5 (xx) 1978-08-31

Family

ID=24584032

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1583076A CH603826A5 (xx) 1975-12-24 1976-12-16

Country Status (12)

Country Link
US (1) US4013523A (xx)
JP (1) JPS608315B2 (xx)
BE (1) BE849410A (xx)
CA (1) CA1075191A (xx)
CH (1) CH603826A5 (xx)
DE (1) DE2658003C3 (xx)
ES (1) ES454476A1 (xx)
FR (1) FR2336496A1 (xx)
GB (1) GB1567200A (xx)
IT (1) IT1066698B (xx)
NL (1) NL164331C (xx)
SE (1) SE417728B (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3012999C2 (de) * 1980-04-03 1984-02-16 Degussa Ag, 6000 Frankfurt Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen
DE3347594A1 (de) * 1983-01-04 1984-07-12 Omi International Corp., Warren, Mich. Bad zur galvanischen abscheidung einer verschleissfesten goldlegierung und verfahren zur abscheidung einer verschleissfesten goldlegierung unter verwendung dieses bades
US4470886A (en) * 1983-01-04 1984-09-11 Omi International Corporation Gold alloy electroplating bath and process
DE3509367C1 (de) * 1985-03-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen
ATE90116T1 (de) * 1988-09-05 1993-06-15 Cockerill Sambre Sa Verfahren zur elektroplattierung zon zinn.
CH680370A5 (xx) * 1989-12-19 1992-08-14 H E Finishing Sa
DE4406434C1 (de) * 1994-02-28 1995-08-10 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Gold-Zinn-Legierungen
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
US6544397B2 (en) * 1996-03-22 2003-04-08 Ronald Redline Method for enhancing the solderability of a surface
USRE45842E1 (en) * 1999-02-17 2016-01-12 Ronald Redline Method for enhancing the solderability of a surface
US6248228B1 (en) 1999-03-19 2001-06-19 Technic, Inc. And Specialty Chemical System, Inc. Metal alloy halide electroplating baths
JP4392640B2 (ja) * 2000-10-11 2010-01-06 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
US20060237324A1 (en) * 2003-05-21 2006-10-26 Fred Hayward Pulse plating process for deposition of gold-tin alloy
CN101151401A (zh) * 2004-05-11 2008-03-26 技术公司 用于金-锡共晶合金的电镀液
WO2006078549A1 (en) * 2005-01-21 2006-07-27 Technic, Inc. Pulse plating process for deposition of gold-tin alloy
DE102005006982A1 (de) * 2005-02-15 2006-08-17 Basf Ag Verwendung nichtionischer Tenside bei der Metallgewinnung durch Elektrolyse
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
WO2019125951A1 (en) * 2017-12-18 2019-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1905105A (en) * 1930-02-20 1933-04-25 Directors Of The University Of Electrodeposition of tin-gold alloys
US3598706A (en) * 1967-12-11 1971-08-10 Trifari Krussman And Fishel In Acid gold plating baths
CH494284A (fr) * 1968-11-28 1970-07-31 Sel Rex Corp Procédé pour le dépôt électrolytique d'un alliage d'or avec au moins un autre métal commun et bain aqueux de placage pour la mise en oeuvre de ce procédé

Also Published As

Publication number Publication date
US4013523A (en) 1977-03-22
ES454476A1 (es) 1977-12-01
FR2336496B1 (xx) 1981-07-24
IT1066698B (it) 1985-03-12
BE849410A (fr) 1977-06-14
NL164331B (nl) 1980-07-15
FR2336496A1 (fr) 1977-07-22
NL7613972A (nl) 1977-06-28
JPS5281032A (en) 1977-07-07
SE7614214L (sv) 1977-06-25
DE2658003C3 (de) 1982-01-21
DE2658003B2 (de) 1980-11-27
CA1075191A (en) 1980-04-08
GB1567200A (en) 1980-05-14
JPS608315B2 (ja) 1985-03-01
SE417728B (sv) 1981-04-06
NL164331C (nl) 1980-12-15
DE2658003A1 (de) 1977-07-07

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Legal Events

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