CH590559A5 - - Google Patents

Info

Publication number
CH590559A5
CH590559A5 CH1097675A CH1097675A CH590559A5 CH 590559 A5 CH590559 A5 CH 590559A5 CH 1097675 A CH1097675 A CH 1097675A CH 1097675 A CH1097675 A CH 1097675A CH 590559 A5 CH590559 A5 CH 590559A5
Authority
CH
Switzerland
Application number
CH1097675A
Original Assignee
Nippert Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippert Co filed Critical Nippert Co
Publication of CH590559A5 publication Critical patent/CH590559A5/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4878Mechanical treatment, e.g. deforming
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49908Joining by deforming
    • Y10T29/49915Overedge assembling of seated part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • Y10T29/49908Joining by deforming
    • Y10T29/49925Inward deformation of aperture or hollow body wall
    • Y10T29/49934Inward deformation of aperture or hollow body wall by axially applying force
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00Joints and connections
    • Y10T403/49Member deformed in situ
    • Y10T403/4991Both members deformed

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CH1097675A 1974-10-03 1975-08-25 CH590559A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US511939A US3918625A (en) 1974-10-03 1974-10-03 Method of making a double extruded semiconductor joint

Publications (1)

Publication Number Publication Date
CH590559A5 true CH590559A5 (xx) 1977-08-15

Family

ID=24037049

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1097675A CH590559A5 (xx) 1974-10-03 1975-08-25

Country Status (11)

Country Link
US (1) US3918625A (xx)
JP (1) JPS5731297B2 (xx)
CA (1) CA1027259A (xx)
CH (1) CH590559A5 (xx)
DE (1) DE2529789C3 (xx)
DK (1) DK445375A (xx)
FR (1) FR2287106A1 (xx)
GB (1) GB1525122A (xx)
IT (1) IT1036425B (xx)
NL (1) NL176413C (xx)
SE (1) SE408352B (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4192063A (en) * 1975-12-10 1980-03-11 Yoshio Sato Method for manufacturing a base of a semi-conductor device
US4049185A (en) * 1977-03-11 1977-09-20 The Nippert Company Method of forming double extruded mount
US4624303A (en) * 1985-04-29 1986-11-25 The Nippert Company Heat sink mounting and method of making
US4985978A (en) * 1988-03-01 1991-01-22 Textron Inc. Method for assembling a self-clinching fastening structure
US6453558B1 (en) * 2001-04-06 2002-09-24 Arvinmeritor, Inc. Method of locking together exhaust components
US7247564B2 (en) * 2004-06-28 2007-07-24 Hewlett-Packard Development Company, L.P. Electronic device
US10446351B2 (en) * 2017-06-06 2019-10-15 Littelfuse, Inc. Electrical contact assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2419469A (en) * 1943-04-24 1947-04-22 Gen Electric Manufacturing method for electrical contacts
US3042428A (en) * 1954-04-05 1962-07-03 Gen Electric Copper-aluminum tubular connector
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
NL120008C (xx) * 1959-05-15
NL270996A (xx) * 1960-11-09
US3198874A (en) * 1961-01-23 1965-08-03 Standard Pressed Steel Co Semi-conductor housings and method of making the same
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
NL142278B (nl) * 1964-06-20 1974-05-15 Philips Nv Werkwijze voor het vervaardigen van een bodem van een voor een halfgeleidende inrichting bestemde omhulling en bodem, vervaardigd volgens deze werkwijze.
NL7115486A (xx) * 1970-11-16 1972-05-18

Also Published As

Publication number Publication date
NL7510492A (nl) 1976-04-06
DE2529789A1 (de) 1976-04-15
FR2287106B1 (xx) 1982-05-28
FR2287106A1 (fr) 1976-04-30
NL176413B (nl) 1984-11-01
JPS5148276A (xx) 1976-04-24
GB1525122A (en) 1978-09-20
NL176413C (nl) 1985-04-01
DK445375A (da) 1976-04-04
IT1036425B (it) 1979-10-30
SE408352B (sv) 1979-06-05
JPS5731297B2 (xx) 1982-07-03
US3918625A (en) 1975-11-11
DE2529789B2 (de) 1980-07-03
SE7506919L (sv) 1976-04-04
CA1027259A (en) 1978-02-28
DE2529789C3 (de) 1981-12-10

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Legal Events

Date Code Title Description
PL Patent ceased