CH566643A5 - - Google Patents
Info
- Publication number
- CH566643A5 CH566643A5 CH1450973A CH1450973A CH566643A5 CH 566643 A5 CH566643 A5 CH 566643A5 CH 1450973 A CH1450973 A CH 1450973A CH 1450973 A CH1450973 A CH 1450973A CH 566643 A5 CH566643 A5 CH 566643A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/083—Deburring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
- B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Pressure Sensors (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1450973A CH566643A5 (fr) | 1973-10-11 | 1973-10-11 | |
DE2354854A DE2354854C2 (de) | 1973-10-11 | 1973-11-02 | Verfahren und Vorrichtung zur Herstellung eines scheibenförmigen Halbleiterkörpers |
DE19737339254U DE7339254U (de) | 1973-10-11 | 1973-11-02 | Vorrichtung zur hohlkehlenfoermigen anschraegung der mantelflaeche eines halbleiterkoerpers |
JP11544074A JPS5611225B2 (fr) | 1973-10-11 | 1974-10-07 | |
GB4368574A GB1460645A (en) | 1973-10-11 | 1974-10-09 | Method and apparatus for producing a semiconductor component |
US05/514,251 US3953941A (en) | 1973-10-11 | 1974-10-11 | Method and apparatus for making a groove in a semi-conductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1450973A CH566643A5 (fr) | 1973-10-11 | 1973-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH566643A5 true CH566643A5 (fr) | 1975-09-15 |
Family
ID=4401415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1450973A CH566643A5 (fr) | 1973-10-11 | 1973-10-11 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3953941A (fr) |
JP (1) | JPS5611225B2 (fr) |
CH (1) | CH566643A5 (fr) |
DE (2) | DE7339254U (fr) |
GB (1) | GB1460645A (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4031667A (en) * | 1976-03-29 | 1977-06-28 | Macronetics, Inc. | Apparatus for contouring edge of semiconductor wafers |
DE2656070C2 (de) * | 1976-12-10 | 1983-12-08 | Kraftwerk Union AG, 4330 Mülheim | Vorrichtung zum Einarbeiten von Ringnuten um eine mit Dehnungsmeßstreifen versehene Meßstelle |
US4247579A (en) * | 1979-11-30 | 1981-01-27 | General Electric Company | Method for metallizing a semiconductor element |
DE3124947C2 (de) * | 1981-06-25 | 1985-12-05 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren und Vorrichtung zum Herstellen einer Hohlkehle in der Mantelfläche des Aktivteils eines Leistungshalbleiterbauelements |
JPS61108170A (ja) * | 1984-10-31 | 1986-05-26 | ゼネラル・エレクトリツク・カンパニイ | 電力半導体装置に2重正ベベル溝を形成する方法 |
DE3769909D1 (de) * | 1986-10-22 | 1991-06-13 | Bbc Brown Boveri & Cie | Verfahren zum anbringen einer umlaufenden hohlkehle am rand einer halbleiterscheibe eines leistungshalbleiter-bauelements. |
US5010694A (en) * | 1989-08-01 | 1991-04-30 | Advanced Technology Systems, Inc. | Fluid cutting machine |
JPH04277625A (ja) * | 1991-03-05 | 1992-10-02 | Murata Mfg Co Ltd | チップ型電子部品の加工方法 |
GB2264659B (en) * | 1992-02-29 | 1995-05-24 | Rolls Royce Plc | Abrasive fluid jet machining |
US5704824A (en) * | 1993-10-12 | 1998-01-06 | Hashish; Mohamad | Method and apparatus for abrasive water jet millins |
FR2789224B1 (fr) * | 1999-01-28 | 2003-10-03 | St Microelectronics Sa | Dressage de bord d'une plaquette semiconductrice |
US6705925B1 (en) * | 2000-10-20 | 2004-03-16 | Lightwave Microsystems | Apparatus and method to dice integrated circuits from a wafer using a pressurized jet |
JP5793014B2 (ja) * | 2011-07-21 | 2015-10-14 | 株式会社不二製作所 | 硬質脆性材料基板の側部研磨方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2886026A (en) * | 1957-08-20 | 1959-05-12 | Texas Instruments Inc | Method of and apparatus for cutting a semiconductor crystal |
BE628619A (fr) * | 1962-02-20 | |||
US3262234A (en) * | 1963-10-04 | 1966-07-26 | Int Rectifier Corp | Method of forming a semiconductor rim by sandblasting |
GB1057214A (en) * | 1965-05-11 | 1967-02-01 | Standard Telephones Cables Ltd | Improvements in or relating to semiconductor devices |
US3589081A (en) * | 1967-08-21 | 1971-06-29 | Pennwalt Corp | Abrading method |
GB1226880A (fr) * | 1968-03-21 | 1971-03-31 | ||
CH504783A (de) * | 1969-06-20 | 1971-03-15 | Siemens Ag | Verfahren zum Abtrennen eines Körpers von einem scheibenförmigen Kristall und Vorrichtung zur Durchführung dieses Verfahrens |
SE358838B (fr) * | 1971-12-01 | 1973-08-13 | Ingenjoers Fa Hebe Ab |
-
1973
- 1973-10-11 CH CH1450973A patent/CH566643A5/xx not_active IP Right Cessation
- 1973-11-02 DE DE19737339254U patent/DE7339254U/de not_active Expired
- 1973-11-02 DE DE2354854A patent/DE2354854C2/de not_active Expired
-
1974
- 1974-10-07 JP JP11544074A patent/JPS5611225B2/ja not_active Expired
- 1974-10-09 GB GB4368574A patent/GB1460645A/en not_active Expired
- 1974-10-11 US US05/514,251 patent/US3953941A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB1460645A (en) | 1977-01-06 |
DE7339254U (de) | 1976-01-08 |
DE2354854C2 (de) | 1985-10-24 |
DE2354854A1 (de) | 1975-04-30 |
US3953941A (en) | 1976-05-04 |
JPS5067592A (fr) | 1975-06-06 |
JPS5611225B2 (fr) | 1981-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |