CH548438A - Verfahren zur herstellung von mindestens stellenweise metallisierten polyamid-formkoerpern. - Google Patents

Verfahren zur herstellung von mindestens stellenweise metallisierten polyamid-formkoerpern.

Info

Publication number
CH548438A
CH548438A CH823170A CH823170A CH548438A CH 548438 A CH548438 A CH 548438A CH 823170 A CH823170 A CH 823170A CH 823170 A CH823170 A CH 823170A CH 548438 A CH548438 A CH 548438A
Authority
CH
Switzerland
Prior art keywords
production
shaped bodies
metalized
polyamide shaped
metalized polyamide
Prior art date
Application number
CH823170A
Other languages
German (de)
English (en)
Original Assignee
Stamicarbon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stamicarbon filed Critical Stamicarbon
Publication of CH548438A publication Critical patent/CH548438A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
    • C08G69/14—Lactams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polyamides (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
CH823170A 1969-06-03 1970-06-02 Verfahren zur herstellung von mindestens stellenweise metallisierten polyamid-formkoerpern. CH548438A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6908381A NL6908381A (fr) 1969-06-03 1969-06-03

Publications (1)

Publication Number Publication Date
CH548438A true CH548438A (de) 1974-04-30

Family

ID=19807080

Family Applications (1)

Application Number Title Priority Date Filing Date
CH823170A CH548438A (de) 1969-06-03 1970-06-02 Verfahren zur herstellung von mindestens stellenweise metallisierten polyamid-formkoerpern.

Country Status (9)

Country Link
US (1) US3674658A (fr)
JP (1) JPS4820629B1 (fr)
BE (1) BE751314A (fr)
CA (1) CA924971A (fr)
CH (1) CH548438A (fr)
DE (1) DE2026673A1 (fr)
FR (1) FR2049850A5 (fr)
GB (1) GB1310306A (fr)
NL (1) NL6908381A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT950406B (it) * 1972-03-21 1973-06-20 Snia Viscosa Procedimento per la produzione di poliammidi in particolare di poli caprolattame aventi migliorate caratteristiche di stampaggio per presso iniezione e relativi pro dotti
US4315045A (en) 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
US4335164A (en) 1978-12-19 1982-06-15 Crown City Plating Co. Conditioning of polyamides for electroless plating
US4431707A (en) * 1982-12-27 1984-02-14 International Business Machines Corporation Plating anodized aluminum substrates
DE4405161A1 (de) * 1994-02-18 1995-08-24 Huels Chemische Werke Ag Verfahren zur kontinuierlichen hydrolytischen Polymerisation von Laurinlactam
US6981318B2 (en) * 2002-10-22 2006-01-03 Jetta Company Limited Printed circuit board manufacturing method
JP4454931B2 (ja) * 2002-12-13 2010-04-21 キヤノン株式会社 ドットパターンを有する基板の製造方法及び柱状構造体の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2992195A (en) * 1957-11-29 1961-07-11 Swift & Co Preparing modified polyamide resins
US3410831A (en) * 1964-02-10 1968-11-12 Monsanto Co Anionic process for preparing reinforced polylactam in the presence of a coupling agent and a tetraalkyl orthosilicate
US3470139A (en) * 1965-01-14 1969-09-30 Courtaulds Ltd Polymerization of caprolactam in the presence of catalyst,initiator and a crystallization modifier
US3549306A (en) * 1966-01-06 1970-12-22 Monsanto Co Surface modified nylon fibers produced by photocatalyzed halogenation
US3556955A (en) * 1966-02-18 1971-01-19 Union Carbide Corp Process of metal plating plastics
GB1211711A (en) * 1967-03-30 1970-11-11 Ici Ltd Sulphonic acids of styrene/phenolic resins
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics

Also Published As

Publication number Publication date
BE751314A (fr) 1970-12-02
NL6908381A (fr) 1970-12-07
CA924971A (en) 1973-04-24
GB1310306A (en) 1973-03-21
US3674658A (en) 1972-07-04
DE2026673A1 (de) 1971-01-07
FR2049850A5 (fr) 1971-03-26
JPS4820629B1 (fr) 1973-06-22

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Legal Events

Date Code Title Description
PL Patent ceased