CH540568A - Method for forming ohmic contacts on the surface of a metal-insulator-semiconductor component - Google Patents
Method for forming ohmic contacts on the surface of a metal-insulator-semiconductor componentInfo
- Publication number
- CH540568A CH540568A CH927571A CH927571A CH540568A CH 540568 A CH540568 A CH 540568A CH 927571 A CH927571 A CH 927571A CH 927571 A CH927571 A CH 927571A CH 540568 A CH540568 A CH 540568A
- Authority
- CH
- Switzerland
- Prior art keywords
- insulator
- metal
- semiconductor component
- ohmic contacts
- forming ohmic
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5050670A | 1970-06-29 | 1970-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH540568A true CH540568A (en) | 1973-08-15 |
Family
ID=21965622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH927571A CH540568A (en) | 1970-06-29 | 1971-06-24 | Method for forming ohmic contacts on the surface of a metal-insulator-semiconductor component |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS516502B1 (en) |
BE (1) | BE769169A (en) |
CH (1) | CH540568A (en) |
DE (1) | DE2128360A1 (en) |
ES (2) | ES392536A1 (en) |
FR (1) | FR2096553B1 (en) |
GB (1) | GB1307667A (en) |
NL (1) | NL7108904A (en) |
SE (1) | SE370144B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19828846A1 (en) * | 1998-06-27 | 1999-12-30 | Micronas Intermetall Gmbh | Process for coating a substrate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5371802U (en) * | 1976-11-17 | 1978-06-15 | ||
DE3011660A1 (en) * | 1980-03-26 | 1981-10-01 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Back contact formation for semiconductor device - includes vapour deposited titanium, palladium, tin and indium layers of specified thickness |
-
1971
- 1971-05-25 GB GB1687771A patent/GB1307667A/en not_active Expired
- 1971-06-08 DE DE19712128360 patent/DE2128360A1/en active Pending
- 1971-06-21 FR FR7122433A patent/FR2096553B1/fr not_active Expired
- 1971-06-22 ES ES392536A patent/ES392536A1/en not_active Expired
- 1971-06-24 CH CH927571A patent/CH540568A/en not_active IP Right Cessation
- 1971-06-28 SE SE830771A patent/SE370144B/xx unknown
- 1971-06-28 NL NL7108904A patent/NL7108904A/xx not_active Application Discontinuation
- 1971-06-28 JP JP4709771A patent/JPS516502B1/ja active Pending
- 1971-06-28 BE BE769169A patent/BE769169A/en unknown
- 1971-10-30 ES ES396549A patent/ES396549A1/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19828846A1 (en) * | 1998-06-27 | 1999-12-30 | Micronas Intermetall Gmbh | Process for coating a substrate |
DE19828846C2 (en) * | 1998-06-27 | 2001-01-18 | Micronas Gmbh | Process for coating a substrate |
US6294218B1 (en) | 1998-06-27 | 2001-09-25 | Micronas Gmbh | Process for coating a substrate |
Also Published As
Publication number | Publication date |
---|---|
NL7108904A (en) | 1971-12-31 |
ES392536A1 (en) | 1973-10-01 |
ES396549A1 (en) | 1974-04-16 |
BE769169A (en) | 1971-11-03 |
FR2096553B1 (en) | 1976-09-03 |
JPS516502B1 (en) | 1976-02-28 |
SE370144B (en) | 1974-09-30 |
DE2128360A1 (en) | 1972-01-13 |
GB1307667A (en) | 1973-02-21 |
FR2096553A1 (en) | 1972-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |