CH528148A - Method for producing an electrical circuit arrangement - Google Patents

Method for producing an electrical circuit arrangement

Info

Publication number
CH528148A
CH528148A CH1480070A CH1480070A CH528148A CH 528148 A CH528148 A CH 528148A CH 1480070 A CH1480070 A CH 1480070A CH 1480070 A CH1480070 A CH 1480070A CH 528148 A CH528148 A CH 528148A
Authority
CH
Switzerland
Prior art keywords
producing
electrical circuit
circuit arrangement
arrangement
electrical
Prior art date
Application number
CH1480070A
Other languages
German (de)
Inventor
Andrew Burns John
Coucoulas Alexander
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of CH528148A publication Critical patent/CH528148A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/222Completing of printed circuits by adding non-printed jumper connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142Metallic substrates having insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381Crossover interconnections, e.g. bridge stepovers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CH1480070A 1969-10-08 1970-10-06 Method for producing an electrical circuit arrangement CH528148A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86485669A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
CH528148A true CH528148A (en) 1972-09-15

Family

ID=25344227

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1480070A CH528148A (en) 1969-10-08 1970-10-06 Method for producing an electrical circuit arrangement

Country Status (10)

Country Link
JP (1) JPS509342B1 (en)
BE (1) BE757162A (en)
CH (1) CH528148A (en)
DE (1) DE2049163C3 (en)
ES (1) ES384535A1 (en)
FR (1) FR2065090A5 (en)
GB (1) GB1315510A (en)
IE (1) IE34642B1 (en)
NL (1) NL145718B (en)
SE (1) SE365068B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377737U (en) * 1976-11-26 1978-06-28
DE2823881C3 (en) * 1978-05-31 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Process for the production of electrical thin-film circuits for the production of integrated conductor track crossings
EP0015100B1 (en) * 1979-02-26 1983-08-17 National Research Development Corporation Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US5699224A (en) * 1995-10-25 1997-12-16 Rohm Co., Ltd. Thick-film capacitor and chip-type composite electronic component utilizing the same
CN107086095B (en) * 2017-06-22 2023-05-16 中国船舶重工集团公司第七0三研究所 Resistance load kuppe

Also Published As

Publication number Publication date
GB1315510A (en) 1973-05-02
SE365068B (en) 1974-03-11
FR2065090A5 (en) 1971-07-23
DE2049163C3 (en) 1978-07-06
NL145718B (en) 1975-04-15
BE757162A (en) 1971-03-16
DE2049163A1 (en) 1971-04-22
ES384535A1 (en) 1974-06-01
IE34642L (en) 1971-04-08
IE34642B1 (en) 1975-07-09
JPS509342B1 (en) 1975-04-11
DE2049163B2 (en) 1977-11-10
NL7014581A (en) 1971-04-14

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Legal Events

Date Code Title Description
PL Patent ceased