CH522956A - Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung - Google Patents
Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-AnordnungInfo
- Publication number
- CH522956A CH522956A CH477470A CH477470A CH522956A CH 522956 A CH522956 A CH 522956A CH 477470 A CH477470 A CH 477470A CH 477470 A CH477470 A CH 477470A CH 522956 A CH522956 A CH 522956A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor
- production
- arrangements
- arrangement produced
- semiconductor arrangement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Rectifiers (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1916554A DE1916554B2 (de) | 1969-04-01 | 1969-04-01 | Verfahren zum Herstellen von Halbleitergleichrichteranordnungen |
Publications (1)
Publication Number | Publication Date |
---|---|
CH522956A true CH522956A (de) | 1972-05-15 |
Family
ID=5729950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH477470A CH522956A (de) | 1969-04-01 | 1970-04-01 | Verfahren zur Herstellung von Halbleiter-Anordnungen und nach diesem Verfahren hergestellte Halbleiter-Anordnung |
Country Status (7)
Country | Link |
---|---|
US (1) | US3916433A (de) |
BR (1) | BR7017351D0 (de) |
CH (1) | CH522956A (de) |
DE (1) | DE1916554B2 (de) |
ES (1) | ES377012A1 (de) |
FR (1) | FR2042218A5 (de) |
GB (1) | GB1300334A (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2278160A1 (fr) * | 1974-07-08 | 1976-02-06 | Radiotechnique Compelec | Languettes de connexion en forme de peigne pour transistors de puissance |
US4009485A (en) * | 1974-12-23 | 1977-02-22 | General Electric Company | Semiconductor pellet assembly mounted on ceramic substrate |
US4054814A (en) * | 1975-10-31 | 1977-10-18 | Western Electric Company, Inc. | Electroluminescent display and method of making |
US4478588A (en) * | 1978-03-06 | 1984-10-23 | Amp Incorporated | Light emitting diode assembly |
US4247864A (en) * | 1978-03-06 | 1981-01-27 | Amp Incorporated | Light emitting diode assembly |
DE3245762A1 (de) * | 1982-03-13 | 1983-09-22 | Brown, Boveri & Cie Ag, 6800 Mannheim | Halbleiterbauelement in modulbauweise |
US4979017A (en) * | 1989-02-23 | 1990-12-18 | Adam Mii | Semiconductor element string structure |
US5761028A (en) * | 1996-05-02 | 1998-06-02 | Chrysler Corporation | Transistor connection assembly having IGBT (X) cross ties |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3702954A (en) * | 1967-07-21 | 1972-11-14 | Siemens Ag | Semiconductor component and method of its production |
US3500136A (en) * | 1968-01-24 | 1970-03-10 | Int Rectifier Corp | Contact structure for small area contact devices |
US3569797A (en) * | 1969-03-12 | 1971-03-09 | Bendix Corp | Semiconductor device with preassembled mounting |
-
1969
- 1969-04-01 DE DE1916554A patent/DE1916554B2/de active Granted
-
1970
- 1970-02-05 US US008996A patent/US3916433A/en not_active Expired - Lifetime
- 1970-02-18 ES ES377012A patent/ES377012A1/es not_active Expired
- 1970-03-10 BR BR217351/70A patent/BR7017351D0/pt unknown
- 1970-03-27 FR FR7011113A patent/FR2042218A5/fr not_active Expired
- 1970-03-31 GB GB05121/70A patent/GB1300334A/en not_active Expired
- 1970-04-01 CH CH477470A patent/CH522956A/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ES377012A1 (es) | 1972-05-16 |
GB1300334A (en) | 1972-12-20 |
DE1916554B2 (de) | 1974-07-04 |
BR7017351D0 (pt) | 1973-01-16 |
FR2042218A5 (de) | 1971-02-05 |
DE1916554A1 (de) | 1971-02-11 |
US3916433A (en) | 1975-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |