CH469101A - Method for producing uniform thin layers of high quality from dielectric material by cathode sputtering and apparatus for carrying out the method - Google Patents
Method for producing uniform thin layers of high quality from dielectric material by cathode sputtering and apparatus for carrying out the methodInfo
- Publication number
- CH469101A CH469101A CH1810266A CH1810266A CH469101A CH 469101 A CH469101 A CH 469101A CH 1810266 A CH1810266 A CH 1810266A CH 1810266 A CH1810266 A CH 1810266A CH 469101 A CH469101 A CH 469101A
- Authority
- CH
- Switzerland
- Prior art keywords
- carrying
- dielectric material
- high quality
- thin layers
- uniform thin
- Prior art date
Links
- 239000003989 dielectric material Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/085—Vapour deposited
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Vapour Deposition (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51482765A | 1965-12-20 | 1965-12-20 | |
US51485365A | 1965-12-20 | 1965-12-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH469101A true CH469101A (en) | 1969-02-28 |
Family
ID=27058328
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1810466A CH471241A (en) | 1965-12-20 | 1966-12-16 | Method for producing uniform thin layers of high quality from conductive or semiconducting materials and apparatus for carrying out the method |
CH1810266A CH469101A (en) | 1965-12-20 | 1966-12-16 | Method for producing uniform thin layers of high quality from dielectric material by cathode sputtering and apparatus for carrying out the method |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1810466A CH471241A (en) | 1965-12-20 | 1966-12-16 | Method for producing uniform thin layers of high quality from conductive or semiconducting materials and apparatus for carrying out the method |
Country Status (9)
Country | Link |
---|---|
US (1) | US3525680A (en) |
JP (1) | JPS4327930B1 (en) |
BE (1) | BE690690A (en) |
CH (2) | CH471241A (en) |
DE (2) | DE1515309B2 (en) |
FR (1) | FR1505162A (en) |
GB (2) | GB1118758A (en) |
NL (1) | NL6617765A (en) |
SE (1) | SE334083B (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3968018A (en) * | 1969-09-29 | 1976-07-06 | Warner-Lambert Company | Sputter coating method |
US3916523A (en) * | 1969-09-29 | 1975-11-04 | Warner Lambert Co | Coated razor blade |
US3904506A (en) * | 1972-11-13 | 1975-09-09 | Shatterproof Glass Corp | Apparatus for continuous production of sputter-coated glass products |
US3860507A (en) * | 1972-11-29 | 1975-01-14 | Rca Corp | Rf sputtering apparatus and method |
US3925182A (en) * | 1973-09-25 | 1975-12-09 | Shatterproof Glass Corp | Method for continuous production of sputter-coated glass products |
US4170662A (en) * | 1974-11-05 | 1979-10-09 | Eastman Kodak Company | Plasma plating |
US4043889A (en) * | 1976-01-02 | 1977-08-23 | Sperry Rand Corporation | Method of and apparatus for the radio frequency sputtering of a thin film |
FR2371524A1 (en) * | 1976-11-18 | 1978-06-16 | Alsthom Atlantique | PROCESS FOR DEPOSITING A THIN LAYER BY DECOMPOSITION OF A GAS IN A PLASMA |
JPS6037188B2 (en) * | 1981-08-27 | 1985-08-24 | 三菱マテリアル株式会社 | sputtering equipment |
US4498071A (en) * | 1982-09-30 | 1985-02-05 | Dale Electronics, Inc. | High resistance film resistor |
GB2140460B (en) * | 1983-05-27 | 1986-06-25 | Dowty Electronics Ltd | Insulated metal substrates |
US4693805A (en) * | 1986-02-14 | 1987-09-15 | Boe Limited | Method and apparatus for sputtering a dielectric target or for reactive sputtering |
AU2003195A (en) * | 1994-06-21 | 1996-01-04 | Boc Group, Inc., The | Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3021271A (en) * | 1959-04-27 | 1962-02-13 | Gen Mills Inc | Growth of solid layers on substrates which are kept under ion bombardment before and during deposition |
US3233137A (en) * | 1961-08-28 | 1966-02-01 | Litton Systems Inc | Method and apparatus for cleansing by ionic bombardment |
US3347772A (en) * | 1964-03-02 | 1967-10-17 | Schjeldahl Co G T | Rf sputtering apparatus including a capacitive lead-in for an rf potential |
-
1965
- 1965-12-20 US US514853A patent/US3525680A/en not_active Expired - Lifetime
-
1966
- 1966-10-08 JP JP6598366A patent/JPS4327930B1/ja active Pending
- 1966-11-15 GB GB51035/66A patent/GB1118758A/en not_active Expired
- 1966-11-17 GB GB51467/66A patent/GB1118759A/en not_active Expired
- 1966-12-05 BE BE690690D patent/BE690690A/xx unknown
- 1966-12-08 FR FR8196A patent/FR1505162A/en not_active Expired
- 1966-12-12 SE SE16985/66A patent/SE334083B/xx unknown
- 1966-12-13 DE DE1966J0032487 patent/DE1515309B2/en not_active Ceased
- 1966-12-15 DE DE19661515310 patent/DE1515310A1/en active Pending
- 1966-12-16 CH CH1810466A patent/CH471241A/en not_active IP Right Cessation
- 1966-12-16 CH CH1810266A patent/CH469101A/en unknown
- 1966-12-19 NL NL6617765A patent/NL6617765A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE1515310A1 (en) | 1969-08-14 |
NL6617765A (en) | 1967-06-21 |
DE1515309A1 (en) | 1969-07-31 |
GB1118758A (en) | 1968-07-03 |
GB1118759A (en) | 1968-07-03 |
FR1505162A (en) | 1967-12-08 |
DE1515309B2 (en) | 1977-11-10 |
JPS4327930B1 (en) | 1968-12-02 |
BE690690A (en) | 1967-05-16 |
US3525680A (en) | 1970-08-25 |
SE334083B (en) | 1971-04-05 |
CH471241A (en) | 1969-04-15 |
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