CA928243A - Process for metal plating of substrates - Google Patents

Process for metal plating of substrates

Info

Publication number: CA928243A
Authority: CA; Canada
Prior art keywords: substrates; metal plating; plating; metal
Prior art date: 1967-09-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

CA030566A

Inventor

K. Lee Sung

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hooker Chemical Corp

Original Assignee

Hooker Chemical Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1967-09-28

Filing date

1968-09-20

Publication date

1973-06-12

1968-09-20 Application filed by Hooker Chemical Corp filed Critical Hooker Chemical Corp

1973-02-13 Priority to CA163,659A priority Critical patent/CA947459A/en

1973-06-12 Application granted granted Critical

1973-06-12 Publication of CA928243A publication Critical patent/CA928243A/en

Status Expired legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Application Of Or Painting With Fluid Materials (AREA)
Paints Or Removers (AREA)
Electroplating Methods And Accessories (AREA)

CA030566A 1967-09-28 1968-09-20 Process for metal plating of substrates Expired CA928243A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
CA163,659A CA947459A (en)	1967-09-28	1973-02-13	Metal plating compositions

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date
US67133767A	1967-09-28	1967-09-28
US69412267A	1967-12-28	1967-12-28
US75953168A	1968-08-02	1968-08-02

Publications (1)

Publication Number	Publication Date
CA928243A true CA928243A (en)	1973-06-12

Family

ID=27418226

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA030566A Expired CA928243A (en)	1967-09-28	1968-09-20	Process for metal plating of substrates

Country Status (6)

Country	Link
BE (1)	BE721575A (en)
CA (1)	CA928243A (en)
CH (2)	CH554963A (en)
GB (1)	GB1251214A (en)
NL (1)	NL152028B (en)
SE (3)	SE373390B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN113549213A (en) *	2021-08-20	2021-10-26	贺州学院	Nylon microsphere for activation-free chemical plating process and preparation method thereof

1968
- 1968-09-11 GB GB1251214D patent/GB1251214A/en not_active Expired
- 1968-09-20 CA CA030566A patent/CA928243A/en not_active Expired
- 1968-09-27 CH CH1449668A patent/CH554963A/xx unknown
- 1968-09-27 BE BE721575D patent/BE721575A/xx unknown
- 1968-09-27 NL NL6813897A patent/NL152028B/en unknown
- 1968-09-27 CH CH1449668D patent/CH1449668A4/xx unknown
- 1968-09-27 SE SE1485671A patent/SE373390B/en unknown
- 1968-09-27 SE SE1308968A patent/SE353925B/xx unknown
1974
- 1974-09-19 SE SE7411800A patent/SE7411800L/xx unknown

Also Published As

Publication number	Publication date
CH1449668A4 (en)	1974-04-30
BE721575A (en)	1969-03-27
DE1796254A1 (en)	1972-03-23
NL6813897A (en)	1969-04-01
CH554963A (en)	1974-10-15
GB1251214A (en)	1971-10-27
SE373390B (en)	1975-02-03
SE353925B (en)	1973-02-19
DE1796254B2 (en)	1977-03-03
NL152028B (en)	1977-01-17
SE7411800L (en)	1974-09-19

Publication	Publication Date	Title
CA970324A (en)	1975-07-01	Process for metal plating of substrates
CA931108A (en)	1973-07-31	Process for the electrodeposition of metals
CA928243A (en)	1973-06-12	Process for metal plating of substrates
AU431241B2 (en)	1970-03-12	Improved process of metal plating non-metallic substrates
CA970323A (en)	1975-07-01	Double-dip process for metal plating of substrates
AU4308568A (en)	1970-03-12	Improved process of metal plating non-metallic substrates
AU2328870A (en)	1972-06-15	Process of a1 plating
CA704806A (en)	1965-03-02	Process of metal plating
YU288470A (en)	1978-09-18	Process for the electroless deposition of metal
IL34975A (en)	1975-08-31	Metal plating of substrates
CA564177A (en)	1958-10-07	Metal deposition process
CA773455A (en)	1967-12-12	Process for stabilizing autocatalytic metal plating solutions
CA927219A (en)	1973-05-29	Metal plating of substrates
AU451823B2 (en)	1972-01-27	Metal plating of substrates
AU432661B2 (en)	1971-01-21	Metal plating of substrates
CA816656A (en)	1969-07-01	Deposition method of refractory metal
CA753214A (en)	1967-02-21	Metal coating process
CA753553A (en)	1967-02-28	Process for the electroless coating of metals or metal articles
AU5812869A (en)	1971-01-21	Metal plating of substrates
AU1799570A (en)	1972-01-27	Metal plating of substrates
CA762091A (en)	1967-06-27	Method of depositing metal
CA734891A (en)	1966-05-24	Metal plating process
CA718375A (en)	1965-09-21	Metal plating process
CA712114A (en)	1965-06-22	Metal plating process
CA787906A (en)	1968-06-18	Metal plating process