CA2752100A1 - Improved method for producing a laminated layer composite - Google Patents

Abstract

The present invention relates to a method for producing a laminated layer composite, wherein at least one base layer (3) and at least one further layer (4), with a component (1) located in between, are laminated from two thermoplastic materials having different Vicat softening temperatures B/50 in two stages into a layer composite.
The invention further relates to a layer design suitable for said method, to a laminated layer composite produced according to said method, and to a security and/or value document comprising such a laminated layer composite.

Description

IMPROVED METHOD FOR PRODUCING A LAMINATED LAYER
COMPOSITE

The present invention relates to a process for producing a laminated multi-layer composite in which at least one base layer and at least one further layer, between which a component is placed, consisting of two thermoplastic materials having different Vicat softening points B/50 are laminated in two stages to form a multi-layer composite. The invention also relates to a suitable laminar structure for this process, a laminated multi-layer composite produced by this process and a security and/or value document containing such a laminated multi-layer composite.

ID cards are security and/or value documents which are attracting growing interest.
Such ID cards generally contain multiple layers which can preferably consist of identical or different thermoplastic materials. Such ID cards can also contain within their structure a component, preferably an electronic component, such as a chip or an antenna for example. Such electronic components are preferably positioned in the middle part of an ID card. In its simplest form such a middle part of an ID
card has at least one base layer, to which the component is applied, and at least one but preferably several further layer(s) designed to embed the component in the thermoplastic(s) (interlayers), and optionally at least one top layer on this (these) further layer(s). These layers are preferably processed by lamination to form an inseparable multi-layer composite.

According to the current prior art there are two possibilities for laminating such multi-layer composites, for example for the middle part of a security and/or value document with an integrated component:

1. The further layer(s) (interlayer(s)) is (are) punched out so that the gap separates the component to be embedded (cf. Figure 1).

2. The further layer(s) (interlayer(s)) is (are) not punched out.

Figure 1 shows a schematic view of a laminar structure with the component to be embedded in the form of a chip (1) and an antenna (2), a base layer (3) onto which this component is applied, three interlayers (4) which together are approximately the same height as the chip and are punched out around the chip, and a top layer (5).
Punching out the interlayers around the chip creates a small gap into which the softened material is pressed during the lamination process under application of the laminating pressure P
(cf. Figure 2). This breaks the connection between the antenna and the chip.
Moreover, the additional step of punching out the interlayers is disadvantageous because the size of the punched out area has to be adjusted to the component to be integrated in each case, making standardised production on an industrial scale more difficult.

Figure 3 shows a schematic view of a laminar structure with the component to be embedded in the form of a chip (1) and an antenna (2), a base layer (3) onto which this component is applied, three interlayers (4) which together are approximately the same height as the chip and are not punched out around the chip, and a top layer (5).
Laying the interlayers on top of the chip likewise creates a small gap into which the softened material can be pressed during the lamination process under application of the laminating pressure P. This again breaks the connection between the antenna and the chip.

Therefore neither possibility is suitable for producing multi-layer composites having functioning integrated components.

There was therefore still a need for a process for producing a laminated multi-layer composite having an embedded component wherein the serviceability of the component is not destroyed or considerably reduced by the lamination process.

The object of the present invention was therefore to find and provide a process for producing a laminated multi-layer composite having an integrated component wherein the serviceability of the component is not destroyed or considerably reduced by the lamination process.

This object was achieved by laminating a laminar structure having at least one base layer of a thermoplastic, polymeric material having a Vicat softening point B/50(base) and a component applied to this base layer, at least one further layer of a thermoplastic, polymeric material having a Vicat softening point B/50(layer) lower than the Vicat softening point B/50(base) and optionally at least one top layer of a thermoplastic, polymeric material, in a two-stage lamination process, wherein the first lamination stage is performed at a temperature above the Vicat softening point B/50(layer) which is a maximum of 5 C above the Vicat softening point B/50(base), and the second lamination stage is performed at a temperature above the Vicat softening point B/50(bae).

The present invention therefore provides a process for producing a laminated multi-layer composite, characterised in that a laminar structure containing - at least one base layer of a thermoplastic, polymeric material having a Vicat softening point B/50(base) - at least one further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer) than the thermoplastic, polymeric material of the base layer - optionally at least one top layer of a thermoplastic, polymeric material, wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer), a) is laminated in a first stage at a temperature above the Vicat softening point B/50(layei) which is a maximum of 5 C above the Vicat softening point B/50(baSe) and b) is laminated in a second stage at a temperature above the Vicat softening point B/50(base).

The laminating temperature of the second stage b) of the process according to the invention is preferably higher than the laminating temperature of the first stage a).
Lamination is further preferably performed in a first stage a) of the process according to the invention at a temperature above the Vicat softening point B/50(1ayer) and below the Vicat softening point B/50(base)=

The process according to the invention offers the advantage that through the use of a thermoplastic having a lower Vicat softening point B/50 for the further layer(s), only this (these) further layer(s) is (are) softened in the first lamination stage and surround the component to be embedded completely before the base layer is softened in the second layer to form the complete multi-layer composite. This avoids any loss of serviceability of the component as found in processes of the prior art.
Within the context of the invention the Vicat softening point B/50 of a thermoplastic is the Vicat softening point B/50 in accordance with ISO 306 (50 N; 50 C/h).

The Vicat softening point B/50(layer) is preferably at least 5 C lower, preferably at least 10 C lower, than the Vicat softening point B/50(base).

By way of example the component can preferably be at least one electronic component or at least one (volume) hologram. The electronic component(s) can for example be integrated circuits, thick-film circuits, circuits comprising multiple discrete active and passive electronic components, sensors, chip modules, displays, batteries, coils, capacitors, printed conductors and/or contact points.

The thermoplastic polymeric material for both the base layer and the further layer(s) can mutually independently preferably be at least one thermoplastic selected from polymers of ethylene-unsaturated monomers and/or polycondensates of bifunctional reactive compounds and/or polyaddition products of bifunctional reactive compounds. For certain applications it can be advantageous and therefore preferable to use a transparent thermoplastic. The thermoplastic of the layer(s) containing at least one thermoplastic and the layer(s) containing at least one thermoplastic and at least one laser-sensitive additive can be the same or different.

Particularly suitable thermoplastics are polycarbonates or copolycarbonates based on diphenols, poly- or copolyacrylates and poly- or copolymethacrylates such as for example and preferably polymethyl methacrylate (PMMA), polymers or copolymers with styrene such as for example and preferably polystyrene (PS) or polystyrene acrylonitrile (SAN), thermoplastic polyurethanes, and polyolefms such as for example and preferably polypropylene types or polyolefins based on cyclic olefins (e.g. TOPAS , Hoechst), polyvinyl chloride, poly- or copolycondensates of terephthalic acid such as for example and preferably poly- or copolyethylene terephthalate (PET or CoPET), glycol-modified PET (PETG), glycol-modified poly-or copolycyclohexane dimethylene terephthalate (PCTG) or poly- or copolybutylene terephthalate (PBT or CoPBT), poly- or copolycondensates of naphthalene dicarboxylic acid such as for example and preferably polyethylene glycol naphthalate (PEN), poly- or copolycondensate(s) of at least one cycloalkyl dicarboxylic acid such as for example and preferably polycyclohexane dimethanol cyclohexane dicarboxylic acid (PCCD), polysulfones (PSU) or mixtures of the above.

Preferred thermoplastics are polyurethanes, polycarbonates or copolycarbonates or blends containing at least one polyurethane, polycarbonate or copolycarbonate.
Polycarbonate or copolycarbonate blends containing at least one polycarbonate or copolycarbonate are particularly preferred. Preferred blends are those containing at least one polycarbonate or copolycarbonate and at least one poly- or copolycondensate of terephthalic acid, naphthalene dicarboxylic acid or a cycloalkyl dicarboxylic acid, preferably cyclohexane dicarboxylic acid. Polycarbonates or copolycarbonates are most particularly preferred, in particular those having average molecular weights Mw of 500 to 100,000, preferably 10,000 to 80,000, particularly preferably 15,000 to 40,000, or blends thereof with at least one poly- or copolycondensate of terephthalic acid having average molecular weights Mme, of 10,000 to 200,000, preferably 26,000 to 120,000.

Polyalkylene terephthalates are suitable in preferred embodiments of the invention as poly- or copolycondensates of terephthalic acid. Suitable polyalkylene terephthalates are for example reaction products of aromatic dicarboxylic acids or reactive derivatives thereof (for example dimethyl esters or anhydrides) and aliphatic, cycloaliphatic or araliphatic diols and mixtures of these reaction products.
Preferred polyalkylene terephthalates can be produced by known methods from terephthalic acid (or reactive derivatives thereof) and aliphatic or cycloaliphatic diols having 2 to 10 C atoms (Kunststoff-Handbuch, Vol. VIII, p. 695 ff, Carl Hanser Verlag, Munich 1973).

Preferred polyalkylene terephthalates contain at least 80 mol%, preferably 90 mol%
terephthalic acid radicals, relative to the dicarboxylic acid component, and at least 80 mol%, preferably at least 90 mol% ethylene glycol and/or butanediol-1,4 and/or 1,4-cyclohexane dimethanol radicals, relative to the diol component.

The preferred polyalkylene terephthalates can contain in addition to terephthalic acid esters up to 20 mol% of radicals of other aromatic dicarboxylic acids having 8 to 14 C atoms or aliphatic dicarboxylic acids having 4 to 12 C atoms, such as for example radicals of phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, 4,4'-diphenyl dicarboxylic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, cyclohexane diacetic acid.

The preferred polyalkylene terephthalates can contain in addition to ethylene or butanediol-1,4 glycol radicals up to 80 mol% of other aliphatic diols having 3 to 12 C atoms or cycloaliphatic diols having 6 to 21 C atoms, for example radicals of propanediol-1,3, 2-ethylpropanediol-1,3, neopentyl glycol, pentanediol-1,5, hexanediol-1,6, cyclohexane dimethanol-1,4, 3-methylpentanediol-2,4, 2-methylpentanediol-2,4, 2,2,4-trimethylpentanediol-1,3 and 2-ethylhexanediol-1,6, 2,2-diethylpropanediol-1,3, hexanediol-2,5, 1,4-di-([beta]-hydroxyethoxy)-benzene, 2,2-bis-(4-hydroxycyclohexyl)propane, 2,4-dihydroxy-1,1,3,3-tetramethy-lcyclobutane, 2,2-bis-(3 -[beta] -hydroxyethoxyphenyl)propane and 2,2-bis-(4-hydroxypropoxyphenyl)propane (cf. DE-OS 24 07 674, 24 07 776, 27 15 932).

The polyalkylene terephthalates can be branched by incorporating relatively small amounts of trihydric or tetrahydric alcohols or tribasic or tetrabasic carboxylic acids, as described for example in DE-OS 19 00 270 and US-PS 3 692 744. Examples of preferred branching agents are trimesic acid, trimellitic acid, trimethylol ethane and propane and pentaerythritol.

No more than 1 mol% of the branching agent, relative to the acid component, is preferably used.

Polyalkylene terephthalates produced solely from terephthalic acid and reactive derivatives thereof (for example dialkyl esters thereof) and ethylene glycol and/or butanediol-1,4 and/or 1,4-cyclohexane dimethanol radicals and mixtures of these polyalkylene terephthalates are particularly preferred.

Preferred polyalkylene terephthalates are also copolyesters produced from at least two of the aforementioned acid components and/or from at least two of the aforementioned alcohol components, particularly preferred copolyesters being poly(ethylene glycol/butanediol-1,4) terephthalates.

By preference the polyalkylene terephthalates preferably used as the component have an intrinsic viscosity of approximately 0.4 to 1.5 dl/g, preferably 0.5 to 1.3 dl/g, measured in each case in phenol/o-dichlorobenzene (1:1 parts by weight) at 25 C.

In particularly preferred embodiments of the invention the blend of at least one polycarbonate or copolycarbonate with at least one poly- or copolycondensate of terephthalic acid is a blend of at least one polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate. Such a blend of polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate can preferably be a blend with 1 to 90 wt.% polycarbonate or copolycarbonate and 99 to 10 wt.% poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate, preferably with 1 to 90 wt.% polycarbonate and 99 to wt.% polybutylene terephthalate or glycol-modified polycyclohexane dimethylene terephthalate, the proportions adding to 100 wt.%. Such a blend of polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate can particularly preferably be a blend with 20 to 85 wt.% polycarbonate or copolycarbonate and 80 to 15 wt.% poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate, preferably with to 85 wt.% polycarbonate and 80 to 15 wt.% polybutylene terephthalate or glycol-modified polycyclohexane dimethylene terephthalate, the proportions adding to 100 wt.%. Such a blend of polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate can most particularly preferably be a blend with 35 to 80 wt.% polycarbonate or copolycarbonate and 65 to 20 wt.% poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexane dimethylene terephthalate, preferably with 35 to 80 wt.% polycarbonate and 65 to wt.% polybutylene terephthalate or glycol-modified polycyclohexane dimethylene terephthalate, the proportions adding to 100 wt.%. In most particularly preferred embodiments the blends can be blends of polycarbonate and glycol-modified polycyclohexane dimethylene terephthalate in the aforementioned compositions.

In preferred embodiments aromatic polycarbonates or copolycarbonates are particularly suitable as polycarbonates or copolycarbonates.

The polycarbonates or copolycarbonates can be linear or branched in a known manner.

The production of these polycarbonates can take place inter alia in a known manner from diphenols, carbonic acid derivatives, optionally chain terminators and optionally branching agents. Details of the production of polycarbonates have been set out in many patent specifications over the last 40 years or so. By way of example reference is made here only to Schnell, "Chemistry and Physics of Polycarbonates", Polymer Reviews, Volume 9, Interscience Publishers, New York, London, Sydney 1964, to D. Freitag, U. Grigo, P. R. Muller, H. Nouvertne', BAYER AG, "Polycarbonates" in Encyclopedia of Polymer Science and Engineering, Volume 11, Second Edition, 1988, pages 648-718, and finally to Drs. U. Grigo, K. Kirchner and P. R. Muller "Polycarbonate" in Becker/Braun, Kunststoff-Handbuch, Volume 3/1, Polycarbonate, Polyacetale, Polyester, Celluloseester, Carl Hanser Verlag Munich, Vienna 1992, pages 117-299.

Production of the polycarbonates or copolycarbonates can take place in a known manner by the interfacial polycondensation process, for example.

According to this process the phosgenation of a disodium salt of a diphenol (or a mixture of various diphenols) in an aqueous-alkaline solution (or suspension) takes place in the presence of an inert organic solvent or mixture of solvents which forms a second phase. The oligocarbonates formed, which are mainly in the organic phase, are condensed using suitable catalysts to form high-molecular-weight polycarbonates dissolved in the organic phase. The organic phase is finally separated off and the polycarbonate isolated therefrom by means of various processing steps.

However, production of the polycarbonates or copolycarbonates can also take place in a known manner by the melt ester interchange process, for example.

Suitable diphenols can for example be dihydroxyaryl compounds having the general formula (I) HO-Z-OH (I) wherein Z is an aromatic radical having 6 to 34 C atoms, which can contain one or more optionally substituted aromatic nuclei and aliphatic or cycloaliphatic radicals or alkylaryls or heteroatoms as binding links.

Examples of suitable dihydroxyaryl compounds are: dihydroxybenzenes, dihydroxydiphenyls, bis-(hydroxyphenyl) alkanes, bis-(hydroxyphenyl) cycloalkanes, bis-(hydroxyphenyl) aryls, bis-(hydroxyphenyl) ethers, bis-(hydroxyphenyl) ketones, bis-(hydroxyphenyl) sulfides, bis-(hydroxyphenyl) sulfones, bis-(hydroxyphenyl) sulfoxides, 1,1'-bis-(hydroxyphenyl) diisopropylbenzenes, and the alkylated, ring-alkylated and ring-halogenated compounds thereof.

These and other suitable dihydroxyaryl compounds are described for example in DE-A 3 832 396, FR-A 1 561 518, in H. Schnell, Chemistry and Physics- of Polycarbonates, Interscience Publishers, New York 1964, p. 28 ff.; p.102 if.
and in D.G. Legrand, J.T. Bendler, Handbook of Polycarbonate Science and Technology, Marcel Dekker New York 2000, p. 72 ff.

Preferred dihydroxyaryl compounds are for example resorcinol, 4,4'-dihydroxydiphenyl, bis-(4-hydroxyphenyl)methane, bis-(3,5-dimethyl-4-hydroxyphenyl)methane, bis-(4-hydroxyphenyl) diphenylmethane, 1,1-bis-(4-hydroxyphenyl)-1-phenylethane, 1, 1 -bis-(4-hydroxyphenyl)- 1 -(1 -naphthyl)ethane, 1, 1 -bis-(4-hydroxyphenyl)- 1-(2-naphthyl)ethane, 2,2-bis-(4-hydroxyphenyl)propane, 2,2-bis-(3-methyl-4-hydroxyphenyl)propane, 2,2-bis-(3,5-dimethyl-4-hydroxyphenyl)propane, 2,2-bis-(4-hydroxyphenyl)-1-phenylpropane, 2,2-bis-(4-hydroxyphenyl)-hexafluoropropane, 2,4-bis-(4-hydroxyphenyl)-2-methylbutane, 2,4-bis-(3, 5-dimethyl-4-hydroxyphenyl)-2-methylbutane, 1,1-bis-(4-hydroxyphenyl)cyclohexane, 1,1-bis-(3, 5-dimethyl-4-hydroxyphenyl)cyclohexane, 1, 1 -bis-(4-hydroxyphenyl)-4-methylcyclohexane, 1,3-bis-[2-(4-hydroxyphenyl)-propyl]benzene, 1, l'-bis-(4-hydroxyphenyl)-3-diisopropylbenzene, 1,1'-bis-(4-hydroxyphenyl)-4-diisopropylbenzene, 1,3-bis-[2-(3,5-dimethyl-4-hydroxyphenyl)-2-propyl]-benzene, bis-(4-hydroxyphenyl)ether, bis-(4-hydroxyphenyl)sulfide, bis-(4-hydroxyphenyl)sulfone, bis-(3,5-dimethyl-4-hydroxyphenyl)sulfone and 2,2',3,3'-tetrahydro-3,3,3',3'-tetramethyl-1,1'-spirobi-[1H-indene]-5,5'-diol or dihydroxydiphenyl cycloalkanes having the formula (Ia) R' R' HO C \ OH
((X)) R
RZ Z
R~/ \p4 (Ia) wherein R' and R2 independently of each other denote hydrogen, halogen, preferably chlorine or bromine, C1-C8 alkyl, C5-C6 cycloalkyl, C6-C10 aryl, preferably phenyl, and C7-C12 aralkyl, preferably phenyl-C1-C4 alkyl, in particular benzyl, m denotes a whole number from 4 to 7, preferably 4 or 5, R3 and R4 which can be chosen individually for each X, independently of each other denote hydrogen or C1-C6 alkyl and X denotes carbon, with the proviso that on at least one X atom R3 and R4 both denote alkyl. In formula (la) R3 and R4 are preferably both alkyl on one or two X atoms, in particular on just one X atom.

The preferred alkyl radical for radicals R3 and R4 in formula (la) is methyl.
The X
atoms in the alpha position to the diphenyl-substituted C atom (C-1) are preferably not dialkyl substituted, whereas alkyl disubstitution in the beta position to C-1 is preferred.

Particularly preferred dihydroxydiphenyl cycloalkanes having formula (la) are those having 5 and 6 C-ring X atoms in the cycloaliphatic radical (m = 4 or 5 in formula (Ia)), for example the diphenols having formulae (lb) to (Id), R R' HO H

(Ia-1) R' R' HO C OH

(la-2) R R
HO / OH
C

(la-3) A most particularly preferred dihydroxydiphenyl cycloalkane having the formula (Ia) is 1, 1 -bis-(4-hydroxyphenyl)-3,3,5 -trimethylcyclohexane (formula (la-1) where Rl and R2 are equal to H).

Such polycarbonates can be produced in accordance with EP-A 359 953 from dihydroxydiphenyl cycloalkanes having the formula (Ia).

Particularly preferred dihydroxyaryl compounds are resorcinol, 4,4'-dihydroxydiphenyl, bis-(4-hydroxyphenyl)diphenylmethane, 1,1-bis-(4-hydroxyphenyl)- l-phenylethane, bis-(4-hydroxyphenyl)-1-(1-naphthyl)ethane, bis-(4-hydroxyphenyl)-1-(2-naphthyl)ethane, 2,2-bis-(4-hydroxyphenyl)propane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 1,1-bis-(4-hydroxyphenyl)cyclohexane, 1,1-bis-(3,5-dimethyl-4-hydroxyphenyl)cyclohexane, 1,1-bis-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 1,1'-bis-(4-hydroxyphenyl)-3-diisopropylbenzene and 1,1'-bis-(4-hydroxyphenyl)-4-diisopropylbenzene.

Most particularly preferred dihydroxyaryl compounds are 4,4'-dihydroxydiphenyl and 2,2-bis-(4-hydroxyphenyl) propane.

Both one dihydroxyaryl compound with formation of homopolycarbonates and also various dihydroxyaryl compounds with formation of copolycarbonates can be used.
Both one dihydroxyaryl compound having formula (I) or (la) with formation of homopolycarbonates and also several dihydroxyaryl compounds having formula (I) and/or (la) with formation of copolycarbonates can be used. The various dihydroxyaryl compounds can be connected together either randomly or in blocks.
In the case of copolycarbonates of dihydroxyaryl compounds having formula (I) and (la) the molar ratio of dihydroxyaryl compounds having formula (la) to the other dihydroxyaryl compounds having formula (I) which can optionally also be used is preferably between 99 mol% (la) to 1 mol% (I) and 2 mol% (la) to 98 mol% (I), preferably between 99 mol% (Ia) to 1 mol% (I) and 10 mol% (1a) to 90 mol% (I) and in particular between 99 mol% (Ia) to I mol% (I) and 30 mol% (1a) to 70 mol%
(I).

A most particularly preferred copolycarbonate can be produced using 1,1-bis-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane and 2,2-bis-(4-hydroxyphenyl)propane as dihydroxyaryl compounds having formula (Ia) and (I).

Suitable carbonic acid derivatives for production by the melt ester interchange process can for example be diaryl carbonates having the general formula (II), R
O

R' R' R"
R"
(II) wherein R, R' and R" are the same or different and independently of one another denote hydrogen, linear or branched C1-C34 alkyl, C7-C34 alkylaryl or C6-C34 aryl, R can also denote -COO-R"', wherein R"' denotes hydrogen, linear or branched C1-C34 alkyl, C7-C34 alkylaryl or C6-C34 aryl.

Preferred diaryl carbonates are for example diphenyl carbonate, methylphenyl phenyl carbonates and di(methylphenyl) carbonates, 4-ethylphenyl phenyl carbonate, di-(4-ethylphenyl) carbonate, 4-n-propylphenyl phenyl carbonate, di-(4-n-propylphenyl) carbonate, 4-isopropylphenyl phenyl carbonate, di-(4-isopropylphenyl) carbonate, 4-n-butylphenyl phenyl carbonate, di-(4-n-butylphenyl) carbonate, 4-isobutylphenyl phenyl carbonate, di-(4-isobutylphenyl) carbonate, tert-butylphenyl phenyl carbonate, di-(4-tert-butylphenyl) carbonate, 4-n-pentylphenyl phenyl carbonate, di-(4-n-pentylphenyl) carbonate, 4-n-hexylphenyl phenyl carbonate, di-(4-n-hexylphenyl) carbonate, 4-isooctylphenyl phenyl carbonate, di-(4-isooctylphenyl) carbonate, 4-n-nonylphenyl phenyl carbonate, di-(4-n-nonylphenyl) carbonate, 4-cyclohexylphenyl phenyl carbonate, di-(4-cyclohexyiphenyl) carbonate, 4-(1-methyl-l-phenylethyl) phenyl phenyl carbonate, di-[4-(1-methyl-l-phenylethyl) phenyl] carbonate, biphenyl-4-yl phenyl carbonate, di-(biphenyl-4-yl) carbonate, 4-(1-naphthyl)phenyl phenyl carbonate, 4-(2-naphthyl)phenyl phenyl carbonate, di-[4-(1-naphthyl)phenyl] carbonate, di-[4-(2-naphthyl)phenyl] carbonate, 4-phenoxyphenyl phenyl carbonate, di-(4-phenoxyphenyl) carbonate, 3-pentadecylphenyl phenyl carbonate, di-(3-pentadecylphenyl) carbonate, 4-tritylphenyl phenyl carbonate, di-(4-tritylphenyl) carbonate, methylsalicylate phenyl carbonate, di(methylsalicylate) carbonate, ethylsalicylate phenyl carbonate, di(ethylsalicylate) carbonate, n-propylsalicylate phenyl carbonate, di-(n-propylsalicylate) carbonate, isopropylsalicylate phenyl carbonate, di(isopropylsalicylate) carbonate, n-butylsalicylate phenyl carbonate, di-(n-butylsalicylate) carbonate, isobutylsalicylate phenyl carbonate, di(isobutylsalicylate) carbonate, tert-butylsalicylate phenyl carbonate, di-(tert-butylsalicylate) carbonate, di(phenylsalicylate) carbonate and di(benzylsalicylate) carbonate.

Particularly preferred diaryl compounds are diphenylcarbonate, 4-tert-butylphenyl phenyl carbonate, di-(4-tert-butylphenyl) carbonate, biphenyl-4-yl phenyl carbonate, di(biphenyl-4-yl) carbonate, 4-(1-methyl-l-phenylethyl) phenyl phenyl carbonate, di-[4-(1-methyl-l-phenylethyl) phenyl] carbonate and di(methylsalicylate) carbonate.

Diphenyl carbonate is most particularly preferred.

Both one diaryl carbonate and also various diaryl carbonates can be used.

One or more monohydroxyaryl compound(s) that have not been used to produce the diaryl carbonate(s) used, for example, can additionally be used as chain terminators for controlling or modifying the terminal groups. Suitable examples are those having the general formula (III) RA
A OH
RB RC
(III) wherein RA denotes linear or branched CI-C34 alkyl, C1-C34 alkoxy, C7-C34 alkylaryl, C6-C34 aryl or -COO-RD, wherein RD denotes hydrogen, linear or branched C1-C34 alkyl, C7-C34 alkylaryl or C6-C34 aryl, and R B , Rc are the same or different and independently of each other denote hydrogen, linear or branched C1-C34 alkyl, C7-C34 alkylaryl or C6-C34 aryl.

Such monohydroxyaryl compounds are for example 1-, 2- or 3-methylphenol, 2,4-dimethylphenol, 4-etylphenol, 4-n-propylphenol, 4-isopropylphenol, 4-n-butylphenol, 4-isobutylphenol, 4-tert-butylphenol, 4-n-pentylphenol, 4-n-hexylphenol, 4-isooctylphenol, 4-n-nonylphenol, 3-pentadecylphenol, 4-cyclohexylphenol, 4-(1-methyl-l-phenylethyl)phenol, 4-phenylphenol, 4-phenoxyphenol, 4-(1-naphthyl)phenol, 4-(2-naphthyl)phenol, 4-tritylphenol, methylsalicylate, ethylsalicylate, n-propylsalicylate, isopropylsalicylate, n-butylsalicylate, isobutylsalicylate, tert-butylsalicylate, phenylsalicylate and bennylsalicylate.

4-tert-Butylphenol, 4-isooctylphenol and 3-pentadecylphenol are preferred.
Particularly preferably suitable for the polycarbonates or copolycarbonates for the further layer(s) having a lower Vicat softening point B/50(jayer) are monohydroxyaryl compound(s) having the general formula (III), wherein RA denotes linear or branched C10-C25 alkyl, C10-C25 alkoxy or C10-C25 alkyl-substituted aryl and RB and Rc are the same or different and independently of each other denote hydrogen, linear or branched C10-C25 alkyl, C10-C25 alkoxy or C10-C25 alkyl-substituted aryl.
"C10-C25 alkyl-substituted aryl" preferably denotes here a phenyl or naphthyl radical substituted with C10-C25 alkyl.

Such monohydroxyaryl compounds are for example n-decyl, n-undecyl, n-dodecyl, n-tridecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl or n-octadecyl phenol. The phenols can carry these substituents in the o-, m- or p-position.

n-Dodecyl phenol and 3-pentadecyl phenol are most particularly preferred.

Suitable polycarbonates or copolycarbonates for the further layer(s) having a lower Vicat softening point B/50(layer) can particularly preferably contain more than 80 mol%, in particular more than 90 mol%, relative to the total amount of chain terminators used, of terminal groups having the general formula (III), wherein RA
denotes linear or branched C10-C25 alkyl, C10-C25 alkoxy or C10-C25 alkyl-substituted aryl and RB and Rc are the same or different and independently of each other denote hydrogen, linear or branched Clo-C25 alkyl, C10-C25 alkoxy or C10-C25 alkyl-substituted aryl. However, in suitable polycarbonates or copolycarbonates for the further layer(s) having a lower Vicat softening point B/5 (layer), up to 40 mol%, relative to the total amount of chain terminators used, of the terminal groups can also be formed from other chain terminators having the general formula (III).

The content of terminal groups can be measured by means of NMR spectroscopy, for example, by integration of aliphatic protons. A more accurate analysis involves the alkaline total saponification of the polycarbonate or copolycarbonate and a subsequent HPLC analysis, a corresponding calibration with the pure substance, e.g.
4-n-pentadecyl phenol, being performed beforehand.

The chain terminators having the general formula (111) are preferably used in the production of the polycarbonates or copolycarbonates in a total amount of 0.1 to mol%, relative to mols of diphenols.

Suitable branching agents can be compounds having three or more functional groups, preferably those having three or more hydroxyl groups. Trisphenols, quaternary phenols or acid chlorides of tricarboxylic or tetracarboxylic acids are conventionally used, and also mixtures of polyphenols or acid chlorides.

Suitable compounds having three or more phenolic hydroxyl groups are for example phloroglucinol, 4,6-dimethyl-2,4,6-tri-(4-hydroxyphenyl)heptene-2, 4,6-dimethyl-2,4,6-tri-(4-hydroxyphenyl)heptane, 1,3,5-tri-(4-hydroxyphenyl)benzene, 1,1,1-tri-(4-hydroxyphenyl)ethane, tri-(4-hydroxyphenyl)phenylmethane, 2,2-bis-(4,4-bis-(4-hydroxyphenyl)cyclohexyl]propane, 2,4-bis-(4-hydroxyphenyl isopropyl)phenol and tetra-(4-hydroxyphenyl)methane.

Other suitable compounds having three or more functional groups are for example 2,4-dihydroxybenzoic acid, trimesic acid (trichloride), cyanuric acid trichloride and 3,3 -bis-(3 -methyl-4 -hydroxyphenyl) -2-oxo-2, 3 -d ihydro indo le .

Preferred branching agents are 3,3-bis-(3-methyl-4-hydroxyphenyl)-2-oxo-2,3-dihydroindole and 1,1,1-tri-(4-hydroxyphenyl)ethane.

Various additives can be added to the thermoplastic polymeric materials The addition of additives serves to extend the useful life or the colour (stabilisers), to simplify processing (e.g. release agents, flow control agents, antistatics) or to adjust the polymer properties to particular loads (impact modifiers, such as rubbers;
dyes, glass fibres).

These additives can be added to the polymer melt individually or in any mixtures or multiple different mixtures, either directly during isolation of the polymers or after the melting of pellets in a compounding step. The additives or mixtures thereof can be added to the polymer melt in the form of a solid, i.e. as a powder, or as a melt.
Another method of introduction is the use of masterbatches or mixtures of masterbatches of additives or additive mixtures.

For example, laser-sensitive additives can be added to promote writeability with laser engraving. Examples of such laser-sensitive additives include laser marking additives, i.e. those consisting of an absorber in the wavelength range of the laser to be used, preferably in the wavelength range of ND:YAG lasers (neodymium-doped yttrium-aluminium-garnet laser). Such laser marking additives and their use in moulding compositions are described for example in WO-A 2004/50766 and WO-A
2004/50767 and are available commercially from DSM under the trade name Micabs . Other absorbers which are suitable as laser-sensitive additives are carbon black, coated layered silicates as described for example in DE-A-195 22 397 and available commercially under the trade name Lazerflair , antimony-doped tin oxide as described for example in US 6,693,657 and available commercially under the trade name Mark-itTm and phosphor-containing tin-copper mixed oxides as described for example in WO-A 2006/042714.

Laser-sensitive additives for the laser engraving of a dark inscription on a light substrate are preferred. Particularly preferred laser-sensitive additives within the context of the invention are black pigments. A most particularly preferred laser-sensitive additive is carbon black.

Fillers, for example, can alternatively or additionally be added to the thermoplastic polymeric materials. By way of example the filler can preferably be at least one coloured pigment and/or at least one other filler to create translucency in the filled layers, such as for example conventional inorganic pigments, in particular metals or metal oxides such as aluminium oxides, silica, titanites, and alkaline metal salts such as carbonates or sulfates of calcium or barium, particularly preferably a white pigment, most particularly preferably titanium dioxide, zirconium dioxide or barium sulfate, in a preferred embodiment titanium dioxide.

The specified fillers are preferably added to the thermoplastics in amounts of 2 to 45 wt.%, particularly preferably 5 to 30 wt.%, relative to the total weight of filler and thermoplastic, before shaping into the plastic film, which can be done by extrusion or coextrusion, for example.

Further known additives, such as for example antistatics, IR absorbers, metal coding dots, glass fibres marked with fluorescent dyes, etc., can also be added to the thermoplastic polymeric materials.

The laminar structure for the process according to the invention preferably has at least one top layer and the thermoplastic, polymeric material of the top layer preferably has a Vicat softening point B/50(top layer) which is higher than the Vicat softening point B/50(layer)-The aforementioned thermoplastic, polymeric materials are also suitable for the top layer(s).

The Vicat softening point B/50(top layer) is preferably at least 5 C higher, preferably at least 10 C higher, than the Vicat softening point B/50(layer).

For the process according to the invention the laminar structure to be laminated is produced in such a way that a corresponding film stack is formed from films of the various thermoplastic, polymeric materials having the various Vicat softening points B/50 and this is then laminated in two stages according to the invention. The component to be embedded is applied to the film used to produce the base layer before the film stack is formed.

The component can be fixed to the film used to produce the base layer prior to formation of the film stack by known means, such as for example lamination, welding, clamping, press-fitting, gluing and/or printing, in order to prevent its position from changing during the lamination process. However, the component can also simply be laid on the base layer without being fixed in place.

In preferred embodiments of the process according to the invention the laminar structure is heated in a first lamination stage to a temperature which is 5 to 30 C, preferably 5 to 15 C, above the Vicat softening point B/50(layer) and a maximum of C above but preferably below the Vicat softening point B/50(base), as a result of which the further layer(s) containing at least one polycarbonate or copolycarbonate having a lower Vicat softening point B/50(layer) soften(s). As the base and top layer(s) do not soften or do not soften completely at this temperature, a gentle encapsulation of the core occurs with no cracking (see the schematic view in Figure 4). Then the laminar structure is laminated at a temperature which is above, preferably 5 to 50 C, particularly preferably 10 to 40 C, most particularly preferably 20 to 35 C
above the Vicat softening point B/50(base) (see the schematic view in Figure 5). The laminating pressure in the first lamination stage for gentle encapsulation is preferably 2 to 100 N/cm2, in the second lamination stage during heating and cooling preferably 100 to 400 N/cm2. Particularly preferred is a pressure of 10 to 30 N/cm2 in the first lamination stage for gentle encapsulation and a pressure of 150 to 350 N/cm2 in the second lamination stage with heating and cooling. Depending on the number of films to be laminated in the film stack, the lamination time can preferably be between several minutes and more than one hour. Depending on the number of films to be laminated in the film stack a lamination time of I to 30 minutes is preferred.

Figure 4 shows a schematic view of a film stack having a base layer (3), a component to be embedded in the form of a chip (1) and an antenna (2), two interlayers (4) which together are approximately the same height as the chip (1), and a top layer (5), which film stack is laminated in the first stage of the process according to the invention by the application of pressure with a first laminating pressure P at a temperature T above the Vicat softening point B/50(layer) and a maximum of 5 C above but preferably below the Vicat softening point B/50(base).
Figure 5 shows a schematic view of the film stack laminated as shown in Figure 4, which in the second stage of the process according to the invention is laminated by the application of pressure with a second laminating pressure P at a temperature T
above the Vicat softening point B/50(bae).

The present invention also provides a laminar structure containing - at least one base layer of a thermoplastic, polymeric material having a Vicat softening point B/50(base) - at least one further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer) than the thermoplastic, polymeric material of the base layer - optionally at least one top layer of a thermoplastic, polymeric material, wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer).

The laminar structure is preferably a film stack of corresponding films and the electronic component between the film used to produce the base layer and the -optionally first - further layer, wherein the component may or may not be fixed to the base layer.

The individual films can be produced from the aforementioned thermoplastic, polymeric materials by extrusion or coextrusion. These processes are known to the person skilled in the art and are adequately described in the literature.

The thickness of the suitable films is preferably 5 to 1000 m, particularly preferably 5 to 850 m.

The films can be smooth on one or both sides or matt or textured on one or both sides.

Multiple layers of the laminar structure according to the invention can also be introduced into the film stack in the form of a coextruded film.

The process according to the invention can be used to produce laminated multi-layer composites containing functioning components from the laminar structure according to the invention.

The present invention thus also provides a laminated multi-layer composite obtainable by the process according to the invention.

The layers in the multi-layer composite or laminar structure according to the invention can consist of identical or different materials. Even if layers largely consist of the same thermoplastic, polymeric material, within the meaning of the present invention they are still different layers if for example they are applied in separate process stages, contain different additives or have different properties.

The expression "at least one layer" means that the multi-layer composite or laminar structure according to the invention can have one or more such layers.

The laminated multi-layer composite according to the invention can be part of security and/or value documents.

The present invention therefore also provides a security and/or value document containing at least one laminated multi-layer composite according to the invention.
The security and/or value document can for example be a data carrier in the form of cards and identification documents, such as for example smart ID cards, chip cards in general, debit cards, credit cards, health insurance cards, passports, RFID
tags, driving licences, etc.

The security and/or value document according to the invention can additionally have further additional layers intended to offer UV protection, protection against mechanical damage - such as for example scratch-resistant coatings - etc. Such layers can optionally also be applied subsequently to the laminated multi-layer composite according to the invention. This can be done for example by gluing or by means of a further lamination stage.

The invention is illustrated below by means of examples. These examples are intended to illustrate the invention by way of example and should not be regarded as a limitation.

Examples Example 1: Production of polycarbonate pellets for production of the further layer(s) having a low Vicat softening point B/500awr) 40 1 of methylene chloride were added to a nitrogen-inerted solution of 4566 g (20 mol) of bisphenol A and 3520 g (88 mol) of sodium hydroxide in 40 1 of water.
3556 g (40 mol) of phosgene were introduced at a pH of 12.5 to 13.5 and 20 C.
To prevent the pH from dropping below 12.5, 30% sodium hydroxide solution (approx.
7000 g) was added during phosgenation. On completion of phosgenation and after rinsing with nitrogen, 258 g (0.85 mol) of m-pentadecyl phenol dissolved in 1 1 of dichloromethane were added. The mixture was stirred for a further 10 minutes, 22.6 g (0.2 mol) of N-ethyl piperidine were added and stirring was continued for 1 hour. After separating off the aqueous phase the organic phase was acidified with phosphoric acid and washed with distilled water until neutral and free from salts.
After exchanging the solvent for chlorobenzene the product was extruded at 290 C
and 80 rpm at 0.1 mbar in an evaporating extruder and pelletised in a pelletiser.

Example 2: Compounding of a masterbatch for production of the base layer containing a thermoplastic and a white pigment as filler Production of a masterbatch for production of the layer containing a thermoplastic and a white pigment as filler took place with a conventional twin-screw compounding extruder (ZSK 32) at conventional polycarbonate processing temperatures of 250 to 330 C.

A masterbatch having the following composition was compounded and then pelletised:

= Makrolori 3108 polycarbonate from Bayer MaterialScience AG in a proportion of 85 wt.%

= Titanium dioxide (Kronos 2230 from Kronos Titan) as a white pigment filler in a proportion of 15 wt.%.

Example 3: Production of the corresponding films Films were extruded from the pellets according to Example 1, the masterbatch according to Example 2 and pure Makrolon 3108 polycarbonate from Bayer MaterialScience AG. The polycarbonate films each had a width of 350 mm.

A plant comprising - a Stork extruder with a screw having a diameter (D) of 37 mm and a length of 24xD. The screw has a vent zone;

- a slit die with a width of 350 mm;
- a die orifice gap of 0.8 mm;

- a take-off unit;

- a winding station was used for this purpose.

From the nozzle the melt was fed to the casting roll and then to the cooling roll, with the rolls at the temperatures specified in Table 1. The film was then passed through a take-off unit and then wound.

Table 1 Process parameters Temperature of cylinder 1 230 C
Temperature of cylinder 2 235 C
Temperature of cylinder 3 240 C
Temperature of vent zone 240 C
Temperature of nozzle 1 240 C
Temperature of nozzle 2 240 C
Temperature of nozzle 3 240 C
Extruder speed 30 rpm Temperature of casting roll 100 C
Temperature of cooling roll 100 C
Current consumption of extruder 16.5 A
Melt pressure 80 bar Films of thickness 100 gm were produced from the pellets according to Example 1.
Films of thickness 105 gm and 150 gm were produced from the masterbatch according to Example 2.

Films of thickness 100 gm were produced from Makrolon 3108.

Example 4: Production of a laminated multi-layer composite by the process according to the invention A film stack consisting of - a 150 gm thick film from the masterbatch according to Example 2 for a first base layer (Vicat softening point B/50(be) = 148.1 C), - a 105 gm thick film from the masterbatch according to Example 2 for a second base layer (Vicat softening point B/50(base) = 148.1 C), - a component in the form of antenna and chip on this film for the second base layer, - two 100 m thick films from the pellets according to Example 1 for two further layers (Vicat softening point B/50(layer) = 133.1 C), - a 105 m thick film from the masterbatch according to Example 2 for a top layer (Vicat softening point B/50(t p layer) = 148.1 C), was produced.

The further layers were produced with transparent material and the base and top layers with white material in order to be able to detect the material flow in microscopy images.

The film stack was then laminated in the press in a first lamination stage at a temperature of 140 C and a pressure of 15 N/cm2 for 10 minutes. Then the press was heated up to a temperature of 180 C and the pre-laminated laminar structure was exposed to a pressure of 300 N/cm2 in a second stage for 2 minutes. Then the laminated multi-layer composite was cooled down to a temperature of 40 C at a pressure of 300 N/cm2 and then removed from the press.

The connection between the antenna and the chip was still functioning even after the lamination process.

Comparative example 5: Production of a laminated multi-layer composite A film stack consisting of a 150 m thick film from the masterbatch according to Example 2 for a first base layer (Vicat softening point B/50(base) = 148.1 C), - a 105 m thick film from the masterbatch according to Example 2 for a second base layer (Vicat softening point B/50(base) = 148.1 C), - a component in the form of antenna and chip on this film for the second base layer, - two 100 m thick films of Makrolon 3108 for two further layers (Vicat softening point B/50(layer) = 149.0 C), wherein gaps in the approximate size of the chip to be embedded were punched out of these films, - a 105 m thick film from the masterbatch according to Example 2 for a top layer (Vicat softening point B/50(t P layer) = 148.1 C), was produced.

The further layers were produced with transparent material and the base and top layers with white material in order to be able to detect the material flow in microscopy images.

The film stack was then laminated in the press in a first lamination stage at a temperature of 140 C and a pressure of 15 N/cm2 for 10 minutes. Then the press was heated up to a temperature of 180 C and the pre-laminated laminar structure was exposed to a pressure of 300 N/cm2 in a second stage for 2 minutes. Then the laminated multi-layer composite was cooled down to a temperature of 40 C at a pressure of 300 N/cm2 and then removed from the press.

The base and top layers were pressed into the punched gap during the lamination process. The antenna was stretched extensively and the connection between the antenna and chip was broken and no longer functioning.

The examples show that with the process according to the invention the component in the form of a chip and antenna was not destroyed during the lamination process and was subsequently still operational.

Claims (11)

1. Process for producing a laminated multi-layer composite, characterised in that a laminar structure containing - at least one base layer of a thermoplastic, polymeric material having a Vicat softening point B/50(base) - at least one further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer) than the thermoplastic, polymeric material of the base layer - optionally at least one top layer of a thermoplastic, polymeric material, wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer), a) is laminated in a first stage at a temperature above the Vicat softening point B/50(layer) which is a maximum of 5°C above the Vicat softening point B/50(base) and b) is laminated in a second stage at a temperature above the Vicat softening point B/50(base).

2. Process according to claim 1, characterised in that lamination is performed in a first stage a) at a temperature above the Vicat softening point B/50(layer) and below the Vicat softening point B/50(base).

3. Process according to claim 1 or 2, characterised in that the Vicat softening point B/50(layer) is at least 5°C lower, preferably at least 10°C lower, than the Vicat softening point B/50(base).

4. Process according to at least one of claims 1 to 3, characterised in that the thermoplastic, polymeric material of the base layer is at least one thermoplastic selected from polymers of ethylene-unsaturated monomers and/or polycondensates of bifunctional reactive compounds or mixtures thereof, preferably one or more polycarbonate(s) or copolycarbonate(s) based on diphenols, poly- or copolyacrylate(s) and poly- or copolymethacrylate(s), polymer(s) or copolymer(s) with styrene, polyurethane(s), and polyolefin(s), polyvinyl chloride, poly- or copolycondensate(s) of terephthalic acid, poly-or copolycondensate(s) of naphthalene dicarboxylic acid, poly- or copolycondensate(s) of at least one cycloalkyl dicarboxylic acid, polysulfones or mixtures thereof, particularly preferably polycarbonate, polyurethane or mixtures containing at least one of these thermoplastics, most particularly preferably polycarbonate or mixtures containing polycarbonate.

5. Process according to at least one of claims 1 to 4, characterised in that the thermoplastic, polymeric material of the further layer is at least one thermoplastic selected from polymers of ethylene-unsaturated monomers and/or polycondensates of bifunctional reactive compounds or mixtures thereof, preferably one or more polycarbonate(s) or copolycarbonate(s) based on diphenols, poly- or copolyacrylate(s) and poly- or copolymethacrylate(s), polymer(s) or copolymer(s) with styrene, polyurethane(s), and polyolefin(s), polyvinyl chloride, poly- or copolycondensate(s) of terephthalic acid, poly-or copolycondensate(s) of naphthalene dicarboxylic acid, poly- or copolycondensate(s) of at least one cycloalkyl dicarboxylic acid, polysulfones or mixtures thereof, particularly preferably polycarbonate, polyurethane or mixtures containing at least one of these thermoplastics, most particularly preferably polycarbonate or mixtures containing polycarbonate.

6. Process according to at least one of claims 1 to 5, characterised in that the component is at least one electronic component or a (volume) hologram.

7. Process according to claim 6, characterised in that the electronic component(s) are integrated circuits, thick-film circuits, circuits comprising multiple discrete active and passive electronic components, sensors, chip modules, displays, batteries, coils, capacitors, printed conductors and/or contact points.

8. Process according to at least one of claims 1 to 7, characterised in that the laminar structure has at least one top layer and the thermoplastic material of the top layer has a Vicat softening point B/50(top layer) which is higher than the Vicat softening point B/50(layer).

9. Laminar structure containing - at least one base layer of a thermoplastic, polymeric material having a Vicat softening point B/50(base) - at least one further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer) than the thermoplastic, polymeric material of the base layer - optionally at least one top layer of a thermoplastic, polymeric material, wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening point B/50(layer).

10. Laminated multi-layer composite obtainable by a process according to at least one of claims 1 to 8.

11. Security and/or value document containing at least one laminated multi-layer composite according to claim 10.