CA2746730C - Electric power source device - Google Patents
Electric power source device Download PDFInfo
- Publication number
- CA2746730C CA2746730C CA2746730A CA2746730A CA2746730C CA 2746730 C CA2746730 C CA 2746730C CA 2746730 A CA2746730 A CA 2746730A CA 2746730 A CA2746730 A CA 2746730A CA 2746730 C CA2746730 C CA 2746730C
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- Prior art keywords
- power source
- space
- source device
- air
- electric power
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- 239000003990 capacitor Substances 0.000 claims abstract description 51
- 238000005192 partition Methods 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
- Dc-Dc Converters (AREA)
Abstract
A housing 2 of an electric power source device 1 has a front face panel 21 having formed therein an air inlet hole 33, a rear face panel 22, two side face panels 23, 24, a bottom plate 25, a top plate 26 having formed therein an air discharge opening 36, and a partition plate 28. The partition plate 28 partitions the space in the housing 2 into a front face-side space 30 and a rear face-side space 31. The partition plate 28 has a front-rear air flow opening 32 for interconnecting the spaces 30, 31. The electric power source device 1 has, in the front face-side space 30, capacitors 56, heat sinks 52 having cooling holes 53 formed therein, semiconductor elements 51 placed on the surfaces of the heat sinks 52. The electric power source device 1 also has an air discharger 81 capable of discharging air in the rear face-side space 31 to the outside of the housing 2, and a guide member 91 for interconnecting the air flow opening 32 and one opening of the cooling hole 53.
Description
DESCRIPTION
ELECTRIC POWER SOURCE DEVICE
TECHNICAL FIELD
[0001]The present invention relates to an electric power source device having electrical components such as semiconductor devices, capacitors, and the like in its housing.
BACKGROUND ART
ELECTRIC POWER SOURCE DEVICE
TECHNICAL FIELD
[0001]The present invention relates to an electric power source device having electrical components such as semiconductor devices, capacitors, and the like in its housing.
BACKGROUND ART
[0002] A conventional electric power source device has a plurality of vertically arranged power conversion units in a housing standing on a floor. The power conversion units each have electronic components, such as a plurality of semiconductor devices and a plurality of electrolytic capacitors, mounted in a planar fashion on a substrate parallel to the floor surface.
[0003] These electronic components generate heat during operation of the electric power source device. Therefore, a fan fixed to the housing is used to cause cooling airflow to flow onto the power conversion units in a planar fashion to thereby cool the electronic components (refer to, e.g., Patent Document 1).
Note that, for enhancing heat radiation performance, the semiconductor devices are generally mounted on the substrate through a heat sink in which cooling holes are formed so as to allow cooling airflow generated by the fan to pass therethrough.
PATENT DOCUMENT 1: Japanese Patent Application Laid-Open Publication No. 11-27930 DISCLOSURE OF THE INVENTION
PROBLEMS TO BE SOLVED BY THE INVENTION
Note that, for enhancing heat radiation performance, the semiconductor devices are generally mounted on the substrate through a heat sink in which cooling holes are formed so as to allow cooling airflow generated by the fan to pass therethrough.
PATENT DOCUMENT 1: Japanese Patent Application Laid-Open Publication No. 11-27930 DISCLOSURE OF THE INVENTION
PROBLEMS TO BE SOLVED BY THE INVENTION
[0004] In the above electric power source device, the flow path resistance of the cooling holes of the heat sink is high, so that the cooling airflow generated by the fan is difficult to pass through the cooling holes of the heat sink. Thus, cooling effect for the semiconductor devices mounted on the heat sink is low.
[0005] Further, in the above electric power source device, the electronic components such as the semiconductor devices and the electrolytic capacitors have a great need for maintenance.
However, these electronic components are mounted on the substrate parallel to the floor surface and thus workability at the time of maintenance is low.
MEANS FOR SOLVING THE PROBLEMS
However, these electronic components are mounted on the substrate parallel to the floor surface and thus workability at the time of maintenance is low.
MEANS FOR SOLVING THE PROBLEMS
[0006] In order to solve the problem described above, according to the present invention, there is provided an electric power source device having a housing raised from a floor surface, the device comprising: a housing including: a front face panel having an air inlet hole through which air outside the housing can be passed inside the housing; a rear face panel disposed opposite to the front face panel; two side face panels constituting a tubular body together with the front and rear face panels; a front-rear partition plate disposed so as to partition a space within the housing into a front face-side space and a rear face-side space and having a front-rear air flow opening through which the front face-side space and the rear face-side space communicate with each other; a top plate disposed on upper end surface of the tubular body and having an air discharge opening formed in an upper portion of the rear face-side space; an air discharger disposed at the air discharge opening so as to discharge air in the rear face-side space outside the housing; a plurality of capacitors vertically arranged on a surface of front side of the front-rear partition plate; a plurality of heat sinks arranged on the surface of front side of the front-rear partition plate and between the front-rear air flow opening and the capacitors and having cooling holes penetrating therethrough from capacitor side to front-rear air flow opening side; a plurality of semiconductor devices vertically arranged on the surface of the front side of the heat sinks; and a guide member through which the front-rear air flow opening and opening portions of the cooling holes on side of the front-rear air flow opening communicate with each other.
ADVANTAGES OF THE INVENTION
[00071 According to the present invention, the air in the front face-side space flows into the rear face-side space through the cooling holes of the heat sinks, thereby effectively cooling the semiconductor devices. In addition, the semiconductor devices and the electrolytic capacitors having a great need for maintenance are arranged in the front face-side space, which I
improves workability at the time of maintenance.
BRIEF DESCRIPTION OF THE DRAWINGS
[00081 FIG. 1 is a perspective view of the front side of an electric power source device according to a first embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed.
FIG. 2 is a perspective view of the rear side of the electric power source device of FIG. 1, in which a rear face panel of the electric power source device has been removed.
FIG. 3 is a schematic front view of the electric power source device of FIG. 1, in which a part of the front face panel has been cut away and in which the main airflow is illustrated.
FIG. 4 is a cross-sectional view as viewed in the direction of arrow IV-IV of FIG. 3.
FIG. 5 is a perspective view of the front side of the electric power source device according to a second embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed.
FIG. 6 is a perspective view of the rear side of the electric power source device of FIG. 5, in which a rear face panel of the electric power source device has been removed.
FIG. 7 is a schematic front view of the electric power source device of FIG. 5, in which a part of the front face panel has been cut away and in which the main airflow is illustrated.
FIG. 8 is a cross-sectional view as viewed in the direction of arrow VIII-VIII of FIG. 7.
FIG. 9 is a view of the electric power source device according to a third embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
FIG. 10 is a view of the electric power source device according to a fourth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
FIG. 11 is a view of the electric power source device according to a fifth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
EXPLANATION OF REFERENCE SYMBOLS
[0009]
1: electric power source device; 2: housing; 3: floor surface;
21: front face panel; 22: rear face panel; 23, 24: side face panels; 25: bottom plate; 26: top plate; 27: upper-lower partition plate; 28: front-rear partition plate; 29: lower space; 30: front face-side space; 31: rear face-side space; 32:
front-rear air flow opening; 33: opened air inlet hole; 34:
grating; 35: leg portion; 36: air discharge opening; 37: leg portion; 51: semiconductor device; 52: heat sink; 53: cooling hole; 54: opening of cooling hole on side near front-rear air flow opening; 55: opening of cooling hole on side near electrolytic capacitor; 56: electrolytic capacitor 61: AC reactor; 62: DC reactor; 63: control transformer; 64:
supporting plate; 71: circuit breaker; 72: filter capacitor;
73: main circuit connection wiring; 81: air discharger; 82: fan;
91: guide member; 92: standing plate; 93: end plate; 94:
parallel plate BEST MODE FOR CARRYING OUT THE INVENTION
[0010]
(First Embodiment) An electric power source device according to a first embodiment of the present invention will be described using FIGS. 1 to 4. FIG. 1 is a perspective view of the front side of an electric power source device according to the first embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed. FIG. 2 is a perspective view of the rear side of the electric power source device of FIG. 1, in which a rear face panel of the electric power source device has been removed. FIG. 3 is a schematic front view of the electric power source device of FIG.
1, in which a part of the front face panel has been cut away and in which the main airflow is illustrated. FIG. 4 is a cross sectional view as viewed in the direction of arrow IV-IV of FIG. 3.
[0011] An electric power source device 1 according to the first embodiment of the present invention has a configuration in which electrical components such as semiconductor devices 51 and electrolytic capacitors 56 are mounted in a housing 2. The electric power source device 1 is mainly featured by this mounting structure.
[0012] First, a structure of a housing 2 will be described. The housing 2 is raised vertically relative to a floor surface 3 on which the electric power source device 1 is installed. A space for mounting the electrical components is formed inside the housing 2. The outer shape of the housing 2 is constituted by mutually facing front and rear face panels 21 and 22, mutually facing two side face panels 23 and 24, a bottom plate 25, and a top plate 26 so as to be formed into a rectangular solid vertically extending relative to the floor surface 3. The housing 2 has inside thereof an upper-lower partition plate 27 and a front-rear partition plate 28.
[0013] The upper-lower partition plate 27 is disposed horizontally so as to partition the space within the housing 2 into upper and lower sides, thereby forming an upper space and a lower space 29 in the housing 2. An upper-lower vent (not illustrated) is formed in the range where the upper-lower partition plate 27 contacts a rear face-side space 31 (to be described later), and the lower space 29 and the rear face-side space 31 communicate with each other through the upper-lower vent.
[00141 The front-rear partition plate 28 is disposed vertically so as to partition the upper space into front and rear sides, thereby forming a front face-side space 30 and a rear face-side space 31 in the housing 2. Front-rear air flow openings 32 are formed so as to vertically extend on both lateral side portions of the front-rear partition plate 28. The front face-side space 30 and the rear face-side space 31 communicate with each other through the front-rear air flow openings 32.
[00151The front face panel 21 is removably attached to the housing 2 in consideration of convenience at the time of mounting the electrical components in the front face-side space 30. An opened air inlet hole 33 is formed so as to extend from the lower portion of a range where the front face panel 21 contacts the front face-side space 30 to the upper portion of a range where the front face panel 21 contacts the lower space 29.
Through the air inlet hole 33, a space outside the housing 2 communicates with the front face-side space 30 and the lower space 29. A grating 34 for preventing electrical shock is attached to the air inlet hole 33.
[00161 The rear face panel 22 is removably attached to the housing 2 in consideration of convenience at the time of mounting the electrical components in the rear face-side space 31.
The rear face panel 22 is formed of magnetic metal in order to prevent radiation noise from leaking outside the housing 2.
[00171 Leg portions 35 extend from the lower surface of the bottom plate 25. The leg portions 35 are bolted to the floor surface 3, whereby the electric power source device 1 is fixed to the floor surface 3.
[0018]An air discharge opening 36 is formed on the top plate 26 in a range where the top plate 26 contacts the rear face-side space 31. Through the air discharge opening 36, the rear face-side space 31 and the space outside the housing 2 communicates with each other.
[0019] An electrical component mounting structure will next be described. The electric power source device 1 has, inside the housing 2, semiconductor devices 51, heat sinks 52, electrolytic capacitors 56, AC reactors 61, DC reactors 62, control transformers 63, circuit breakers 71, filter capacitors 72, and main circuit connection wirings 73.
[0020] The semiconductor devices 51, the heat sinks 52, and the electrolytic capacitors 56 are housed in the front face-side space 30. The plurality of electrolytic capacitors 56 are vertically arranged on the front surface of the front-rear partition plate 28 at the center portion in the width direction of the front-rear partition plate 28. In the example illustrated in FIGS. 1 to 4, 24 electrolytic capacitors 56 are arranged in two lines. Each electrolytic capacitor 56 is constituted by a cylindrical main portion 57 and a terminal portion 58 protruding from one end portion thereof and is attached to the front-rear partition plate 28 by means of a supporting member 59 such that the main portion 57 is raised relative to the front-rear partition plate 28.
[0021] The plurality of heat sinks 52 are vertically arranged on the front surface of the front-rear partition plate 28 and between the front-rear air flow openings 32 and the electrolytic capacitors 56 . In the example illustrated in FIGS. 1 to 4, eight heat sinks 52 are arranged in two lines between the 24 electrolytic capacitors 56 and the two front-rear air flow openings 32. Each heat sink 52 is formed into a plate body and has a plurality of cooling holes 53 penetrating the inside thereof in a planar direction. Each heat sink 52 is arranged such that the cooling holes 53 extend in the width direction.
[00221 The plurality of semiconductor devices 51 are vertically arranged on the front side surface of the plurality of heat sinks 52. In the example illustrated in FIGS. 1 to 4, 16 semiconductor devices 51 are arranged in two lines on eight heat sinks 52.
Heat generated from the semiconductor devices 51 is radiated mainly through the heat sinks 52.
[00231 The AC reactors 61, the DC reactors 62, and the control transformers 63 are housed in the rear face-side space 31. The plurality of AC reactors 61 are arranged on and above the upper-lower partition plate 27. A supporting plate 64 is provided above the plurality of AC reactors 61. The supporting plate 64 is attached to the two side face panels 23 and 24 so as to be parallel to the floor surface 3. The plurality of DC rectors 62 and the plurality of control transformers 63 are arranged on and the supporting plate 64.
[0024) The circuit breakers 71, the filter capacitors 72, and the main circuit connection wirings 73 are housed in the lower space .. .. ... .... J. .: ...., ..... ....__,. ... ao. .,...,;. ,.srasa.... õ.,..
~amawõbv. -:..-, r....w .... ... :.. .. _, _._. ...
29. The circuit breakers 71 are provided at the center portion of the bottom plate 25 in the forward-rear direction. The filter capacitors 72 are provided on the rear side of the bottom plate 25, and the main circuit connection wirings 73 are provided on the front side of the bottom plate 25.
[0025] Next, an air discharger 81 and a guide member 91 will be described. The air discharger 81 is attached to the top plate 26 so as to cover the air discharge opening 36 formed in the top plate 26. The air discharger 81 has a fan 82 capable of discharging the air in the rear face-side space 31 outside the housing 2. That is, when the fan 82 rotates, the space within the housing 2 assumes a negative pressure. Accordingly, the air outside the housing 2 flows into the housing 2 through the air inlet hole 33, and the air in the housing 2 flows out through the air discharge opening 36.
[00261The guide member 91 is a member for guiding the air in the front face-side space 30 to the rear face-side space 31 so as to allow the air in the front face-side space 30 to flow into the rear face-side space 31 after passing through the cooling holes 53.
[0027] Specifically, the guide member 91 is constituted by standing plates 92, end plates 93, and parallel plates 94, and is attached to the front-rear partition plate 28. The standing plates 92 are plate-like members extending from lateral end portions of the front-rear air flow opening 32 on the far-sides from the heat sinks 52 to the front sides by a length corresponding to the thickness of the heat sinks 52. The end plates 93 are plate-like members extending from vertical both end portions of the front-rear air flow opening 32 to the front sides by a length corresponding to the thickness of the heat sinks 52. The parallel plates 94 are plate-like members extending parallel to the front-rear partition plate 28 from end portions of the standing plates 92 and the end plates 93 to the semiconductor device 51 side surface of the heat sinks 52.
[0028] That is, the guide member 91 integrally covers the front-rear air flow opening 32 and the openings 55 of the cooling holes 53 on the near-side from the front-rear air flow opening 32 so as to make the front-rear air flow opening 32 and the cooling holes 53 communicate with each other. With the existence of the guide member 91, the air fed from the front face-side space 30 to the rear face-side space 31 is forced to pass through the cooling holes 53.
[0029] The airflow into the housing 2 generated when the fan 82 rotates will be described. Since the opened air inlet hole 33 is formed so as to extend from the lower portion of the front face-side space 30 to the upper portion of the lower space 29, the air outside the housing 2 passes thorough the air inlet hole 33 and then flows simultaneously in the front face-side space 30 and the lower space 29.
[0030] Since the rear face-side space 31 assumes a negative pressure, the air in the front face-side space 30 passes through the front-rear air flow opening 32 and flows into the rear face-side space 31. At this time, with the existence of the guide member 91, the air fed from the front face-side space 30 to the rear face-side space 31 is forced to pass through the cooling holes 53 of the heat sinks 52. When passing through the cooling holes 53, the air enters the cooling holes 53 from their openings (openings on the side near the electrolytic capacitors 56) 54 on the side of the electrolytic capacitors 56 and flows out of the cooling holes 53 from the openings (openings on the side near the front-rear air flow openings 32) 55 on the side of the front-rear air flow opening vents 32.
[0031]That is, the air in the front face-side space 30 is collected at the electrolytic capacitors 56 side openings 54 to cool the adjacent electrolytic capacitors 56 (refer to FIG. 3). Further, the air directed to the rear face-side space 31 passes through the cooling holes 53 of the heat sinks 52 to cool the semiconductor devices 51 through the heat sinks 52.
[0032] The air that has flowed into the rear face-side space 31 from the front face-side space 30 rises while rotating in the rear face-side space 31 and is then discharged outside the housing 2.
Assuming that the fan 82 rotates in the counterclockwise direction, the air in the rear face-side space 31 rises while rotating in the counterclockwise direction (refer to FIG. 4). At this time, the air in the rear face-side space 31 cools the AC
reactors 61, the DC reactors 62, and the control transformers 63 arranged in the rear face-side space 31.
[0033] Meanwhile, the air in the lower space 29 passes through the upper-lower vent and flows into the rear face-side space 31, since the rear face-side space 31 assumes a negative pressure.
At this time, the air in the lower space 29 cools the circuit breakers 71 and the filter capacitors 72 provided in the lower space 29.
[0034] The air that has flowed into the rear face-side space 31 from the lower space 29 rises while rotating in the rear face-side space 31 as described above to cool the AC reactors 61, the DC
reactors 62, and the control transformers 63 and is then discharged outside the housing 2.
[0035] Hereinafter, effects of the electric power source device according to the first embodiment of the present invention will be described. According to the present embodiment, the air in the front face-side space 30 passes through the cooling holes 53 of the heat sinks 52 and flows into the rear face-side space 31.
Thus, it is possible to effectively cool the semiconductor devices 51 which are highly required to be cooled. Further, the air in the front face-side space 30 is collected at the opening portions 54 of the cooling holes 53 on the side near the electrolytic capacitors 56, so that it is possible to effectively cool the electrolytic capacitors 56 adjacent to the openings 54.
[0036] Further, the main air that has flowed into the front face-side space 30 flows therein so as to cool the electrolytic capacitors 56, the semiconductor devices 51, the AC reactors 61, the DC reactors 62, and the control transformers 63, thereby enhancing the cooling efficiency of the entire electric power source device.
[0037] Further, the air outside the housing 2 flows into the front face-side space 30 and the lower space 29 simultaneously, and independent flow paths are formed in the front face-side space 30 and the lower space 29, so that it is possible to independently cool a block including the semiconductor devices 51 and the electrolytic capacitors 56 and a block including the circuit breakers 71 and the filter capacitors 72. That is, the semiconductor devices 51 and the electrolytic capacitors 56 are cooled not by the air that has already cooled the circuit breakers 71 and the filter capacitors 72 but fresh cooling air, so that it is possible to effectively cool the semiconductor devices 51 and the electrolytic capacitors 56. Alternatively, the circuit breakers 71 and the filter capacitors 72 are cooled not by the air that has already cooled the semiconductor devices 51 and the electrolytic capacitors 56 but fresh cooling air, so that it is possible to effectively cool the circuit breakers 71 and the filter capacitors 72.
[0038] Further, the air in the rear face-side space 31 rises while rotating, so that it is possible to effectively cool the AC reactors 61, the DC reactors 62, and the control transformers 63.
[0039] According to the present embodiment, the semiconductor devices 51 and the electrolytic capacitors 56 having a great need for maintenance are arranged in the front face-side space 30, which improves workability at the time of maintenance. From the same reason, workability at the time of assembling the electric power source device 1 is high.
[0040] Further, the AC reactors 61, the DC reactors 62, and the control reactors 63 that generate radiation noise are arranged in the rear face-side space 31, it is possible to suppress the radiation noise from leaking to the front side of the electric power source device 1. Further, the rear face panel 22 is formed of magnetic metal, thereby preventing radiation noise from leaking to the rear side of the electric power source device 1.
[0041] Further, the air inlet hole 33 is provided on the front face panel, and air discharge opening 36 is provided on the top plate 26, thereby eliminating the need for additional space for air inlet and outlet, with the result that the electric power source device 1 can be installed adjacent to another device or walls. Further, the housing 2 is formed into a vertically extending rectangular solid, thereby reducing the installation space for the electric power source device 1.
[0042]
(Second Embodiment) The electric power source device according to a second embodiment will be described using FIGS. 5 to 8. FIG. 5 is a perspective view of the front side of the electric power source device according to the second embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed. FIG.
6 is a perspective view of the rear side of the electric power source device of FIG. 5, in which a rear face panel of the electric power source device has been removed. FIG. 7 is a schematic front view of the electric power source device of FIG. 5, in which a part of the front face panel has been cut away and in which the main airflow is illustrated. FIG. 8 is a cross-sectional view as viewed in the direction of arrow VIII-VIII of FIG. 7. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0043] In the electric power source device 1 according to the second embodiment of the present invention, the front-rear air flow opening 32 is formed so as to vertically extend on one lateral side portion (right end portion in FIGS. 5 and 7) of the front-rear partition plate 28.
[0044] The plurality of electrolytic capacitors 56 are vertically arranged on the front surface of the front-rear partition plate 28 at the side portion thereof (left end side in FIGS. 5 through 7) where the front-rear air flow opening 32 are not formed. In the example illustrated in FIGS. 5 and 7, eight electrolytic capacitors 56 are arranged in one line.
[0045] The plurality of heat sinks 52 are vertically arranged on the front surface of the front-rear partition plate 28 and between the front-rear air flow opening 32 and the electrolytic capacitors 56 (at the lateral center of the front surface of the front-rear partition plate 28). In the example illustrated in FIGS. 5 to 8, four heat sinks 52 are arranged in one line between the eight electrolytic capacitors 56 and one front-rear air flow opening 32.
Further, in this example, eight semiconductor devices 51 are arranged in one line on the four heat sinks 52.
[0046]The fan 82 of the air discharger 81 rotates so as to make the air just after passing through the front-rear air flow opening 32 move in substantially perpendicular direction (toward the rear side) to the front-rear partition plate 28 in the rear face-side space 31. Referring to FIG. 8, the front-rear air flow opening 32 is formed at the lateral right end portion of the front-rear partition plate 28, so that the fan 82 rotates in the counterclockwise direction. Then, the air just after passing through the front-rear air flow opening 32 moves in substantially perpendicular direction (toward the rear side) to the front-rear partition plate 28 in the rear face-side space 31 and, after that, rises while rotating in the counterclockwise direction.
[0047] According to the present embodiment, the air in the rear face-side space 31 smoothly rotates to thereby effectively cool the AC reactors 61, the DC reactors 62, and the control transformers 63.
[0048]
(Third Embodiment) The electric power source device according to a third embodiment of the present invention will be described using FIG.
9. FIG. 9 is a view of the electric power source device according to the third embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0049] In the electric power source device 1 according to the third embodiment of the present invention, cut portions are formed so as to vertically extend at both lateral side portions of the front-rear partition plate 28. Gaps between the cut portions and the side face panels 23 and 24 serve as the front-rear air flow openings 32.
[0050] The guide member 91 is constituted by the end plates 93 and the parallel plates 94. The parallel plates 94 extend from the inner surface of the side face panels 23 and 24 to the semiconductor device 51 side surfaces of the heat sinks 52. The end plates 93 extend from top and bottom end portions of the front-rear air flow openings 32 to top and bottom end portions of the parallel plates 94.
[0051] According to the present embodiment, the same effects as in the electric power source device 1 according to the first embodiment of the present invention can be obtained.
[0052]
(Fourth Embodiment) The electric power source device according to a fourth embodiment of the present invention will be described using FIG.
ADVANTAGES OF THE INVENTION
[00071 According to the present invention, the air in the front face-side space flows into the rear face-side space through the cooling holes of the heat sinks, thereby effectively cooling the semiconductor devices. In addition, the semiconductor devices and the electrolytic capacitors having a great need for maintenance are arranged in the front face-side space, which I
improves workability at the time of maintenance.
BRIEF DESCRIPTION OF THE DRAWINGS
[00081 FIG. 1 is a perspective view of the front side of an electric power source device according to a first embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed.
FIG. 2 is a perspective view of the rear side of the electric power source device of FIG. 1, in which a rear face panel of the electric power source device has been removed.
FIG. 3 is a schematic front view of the electric power source device of FIG. 1, in which a part of the front face panel has been cut away and in which the main airflow is illustrated.
FIG. 4 is a cross-sectional view as viewed in the direction of arrow IV-IV of FIG. 3.
FIG. 5 is a perspective view of the front side of the electric power source device according to a second embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed.
FIG. 6 is a perspective view of the rear side of the electric power source device of FIG. 5, in which a rear face panel of the electric power source device has been removed.
FIG. 7 is a schematic front view of the electric power source device of FIG. 5, in which a part of the front face panel has been cut away and in which the main airflow is illustrated.
FIG. 8 is a cross-sectional view as viewed in the direction of arrow VIII-VIII of FIG. 7.
FIG. 9 is a view of the electric power source device according to a third embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
FIG. 10 is a view of the electric power source device according to a fourth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
FIG. 11 is a view of the electric power source device according to a fifth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4.
EXPLANATION OF REFERENCE SYMBOLS
[0009]
1: electric power source device; 2: housing; 3: floor surface;
21: front face panel; 22: rear face panel; 23, 24: side face panels; 25: bottom plate; 26: top plate; 27: upper-lower partition plate; 28: front-rear partition plate; 29: lower space; 30: front face-side space; 31: rear face-side space; 32:
front-rear air flow opening; 33: opened air inlet hole; 34:
grating; 35: leg portion; 36: air discharge opening; 37: leg portion; 51: semiconductor device; 52: heat sink; 53: cooling hole; 54: opening of cooling hole on side near front-rear air flow opening; 55: opening of cooling hole on side near electrolytic capacitor; 56: electrolytic capacitor 61: AC reactor; 62: DC reactor; 63: control transformer; 64:
supporting plate; 71: circuit breaker; 72: filter capacitor;
73: main circuit connection wiring; 81: air discharger; 82: fan;
91: guide member; 92: standing plate; 93: end plate; 94:
parallel plate BEST MODE FOR CARRYING OUT THE INVENTION
[0010]
(First Embodiment) An electric power source device according to a first embodiment of the present invention will be described using FIGS. 1 to 4. FIG. 1 is a perspective view of the front side of an electric power source device according to the first embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed. FIG. 2 is a perspective view of the rear side of the electric power source device of FIG. 1, in which a rear face panel of the electric power source device has been removed. FIG. 3 is a schematic front view of the electric power source device of FIG.
1, in which a part of the front face panel has been cut away and in which the main airflow is illustrated. FIG. 4 is a cross sectional view as viewed in the direction of arrow IV-IV of FIG. 3.
[0011] An electric power source device 1 according to the first embodiment of the present invention has a configuration in which electrical components such as semiconductor devices 51 and electrolytic capacitors 56 are mounted in a housing 2. The electric power source device 1 is mainly featured by this mounting structure.
[0012] First, a structure of a housing 2 will be described. The housing 2 is raised vertically relative to a floor surface 3 on which the electric power source device 1 is installed. A space for mounting the electrical components is formed inside the housing 2. The outer shape of the housing 2 is constituted by mutually facing front and rear face panels 21 and 22, mutually facing two side face panels 23 and 24, a bottom plate 25, and a top plate 26 so as to be formed into a rectangular solid vertically extending relative to the floor surface 3. The housing 2 has inside thereof an upper-lower partition plate 27 and a front-rear partition plate 28.
[0013] The upper-lower partition plate 27 is disposed horizontally so as to partition the space within the housing 2 into upper and lower sides, thereby forming an upper space and a lower space 29 in the housing 2. An upper-lower vent (not illustrated) is formed in the range where the upper-lower partition plate 27 contacts a rear face-side space 31 (to be described later), and the lower space 29 and the rear face-side space 31 communicate with each other through the upper-lower vent.
[00141 The front-rear partition plate 28 is disposed vertically so as to partition the upper space into front and rear sides, thereby forming a front face-side space 30 and a rear face-side space 31 in the housing 2. Front-rear air flow openings 32 are formed so as to vertically extend on both lateral side portions of the front-rear partition plate 28. The front face-side space 30 and the rear face-side space 31 communicate with each other through the front-rear air flow openings 32.
[00151The front face panel 21 is removably attached to the housing 2 in consideration of convenience at the time of mounting the electrical components in the front face-side space 30. An opened air inlet hole 33 is formed so as to extend from the lower portion of a range where the front face panel 21 contacts the front face-side space 30 to the upper portion of a range where the front face panel 21 contacts the lower space 29.
Through the air inlet hole 33, a space outside the housing 2 communicates with the front face-side space 30 and the lower space 29. A grating 34 for preventing electrical shock is attached to the air inlet hole 33.
[00161 The rear face panel 22 is removably attached to the housing 2 in consideration of convenience at the time of mounting the electrical components in the rear face-side space 31.
The rear face panel 22 is formed of magnetic metal in order to prevent radiation noise from leaking outside the housing 2.
[00171 Leg portions 35 extend from the lower surface of the bottom plate 25. The leg portions 35 are bolted to the floor surface 3, whereby the electric power source device 1 is fixed to the floor surface 3.
[0018]An air discharge opening 36 is formed on the top plate 26 in a range where the top plate 26 contacts the rear face-side space 31. Through the air discharge opening 36, the rear face-side space 31 and the space outside the housing 2 communicates with each other.
[0019] An electrical component mounting structure will next be described. The electric power source device 1 has, inside the housing 2, semiconductor devices 51, heat sinks 52, electrolytic capacitors 56, AC reactors 61, DC reactors 62, control transformers 63, circuit breakers 71, filter capacitors 72, and main circuit connection wirings 73.
[0020] The semiconductor devices 51, the heat sinks 52, and the electrolytic capacitors 56 are housed in the front face-side space 30. The plurality of electrolytic capacitors 56 are vertically arranged on the front surface of the front-rear partition plate 28 at the center portion in the width direction of the front-rear partition plate 28. In the example illustrated in FIGS. 1 to 4, 24 electrolytic capacitors 56 are arranged in two lines. Each electrolytic capacitor 56 is constituted by a cylindrical main portion 57 and a terminal portion 58 protruding from one end portion thereof and is attached to the front-rear partition plate 28 by means of a supporting member 59 such that the main portion 57 is raised relative to the front-rear partition plate 28.
[0021] The plurality of heat sinks 52 are vertically arranged on the front surface of the front-rear partition plate 28 and between the front-rear air flow openings 32 and the electrolytic capacitors 56 . In the example illustrated in FIGS. 1 to 4, eight heat sinks 52 are arranged in two lines between the 24 electrolytic capacitors 56 and the two front-rear air flow openings 32. Each heat sink 52 is formed into a plate body and has a plurality of cooling holes 53 penetrating the inside thereof in a planar direction. Each heat sink 52 is arranged such that the cooling holes 53 extend in the width direction.
[00221 The plurality of semiconductor devices 51 are vertically arranged on the front side surface of the plurality of heat sinks 52. In the example illustrated in FIGS. 1 to 4, 16 semiconductor devices 51 are arranged in two lines on eight heat sinks 52.
Heat generated from the semiconductor devices 51 is radiated mainly through the heat sinks 52.
[00231 The AC reactors 61, the DC reactors 62, and the control transformers 63 are housed in the rear face-side space 31. The plurality of AC reactors 61 are arranged on and above the upper-lower partition plate 27. A supporting plate 64 is provided above the plurality of AC reactors 61. The supporting plate 64 is attached to the two side face panels 23 and 24 so as to be parallel to the floor surface 3. The plurality of DC rectors 62 and the plurality of control transformers 63 are arranged on and the supporting plate 64.
[0024) The circuit breakers 71, the filter capacitors 72, and the main circuit connection wirings 73 are housed in the lower space .. .. ... .... J. .: ...., ..... ....__,. ... ao. .,...,;. ,.srasa.... õ.,..
~amawõbv. -:..-, r....w .... ... :.. .. _, _._. ...
29. The circuit breakers 71 are provided at the center portion of the bottom plate 25 in the forward-rear direction. The filter capacitors 72 are provided on the rear side of the bottom plate 25, and the main circuit connection wirings 73 are provided on the front side of the bottom plate 25.
[0025] Next, an air discharger 81 and a guide member 91 will be described. The air discharger 81 is attached to the top plate 26 so as to cover the air discharge opening 36 formed in the top plate 26. The air discharger 81 has a fan 82 capable of discharging the air in the rear face-side space 31 outside the housing 2. That is, when the fan 82 rotates, the space within the housing 2 assumes a negative pressure. Accordingly, the air outside the housing 2 flows into the housing 2 through the air inlet hole 33, and the air in the housing 2 flows out through the air discharge opening 36.
[00261The guide member 91 is a member for guiding the air in the front face-side space 30 to the rear face-side space 31 so as to allow the air in the front face-side space 30 to flow into the rear face-side space 31 after passing through the cooling holes 53.
[0027] Specifically, the guide member 91 is constituted by standing plates 92, end plates 93, and parallel plates 94, and is attached to the front-rear partition plate 28. The standing plates 92 are plate-like members extending from lateral end portions of the front-rear air flow opening 32 on the far-sides from the heat sinks 52 to the front sides by a length corresponding to the thickness of the heat sinks 52. The end plates 93 are plate-like members extending from vertical both end portions of the front-rear air flow opening 32 to the front sides by a length corresponding to the thickness of the heat sinks 52. The parallel plates 94 are plate-like members extending parallel to the front-rear partition plate 28 from end portions of the standing plates 92 and the end plates 93 to the semiconductor device 51 side surface of the heat sinks 52.
[0028] That is, the guide member 91 integrally covers the front-rear air flow opening 32 and the openings 55 of the cooling holes 53 on the near-side from the front-rear air flow opening 32 so as to make the front-rear air flow opening 32 and the cooling holes 53 communicate with each other. With the existence of the guide member 91, the air fed from the front face-side space 30 to the rear face-side space 31 is forced to pass through the cooling holes 53.
[0029] The airflow into the housing 2 generated when the fan 82 rotates will be described. Since the opened air inlet hole 33 is formed so as to extend from the lower portion of the front face-side space 30 to the upper portion of the lower space 29, the air outside the housing 2 passes thorough the air inlet hole 33 and then flows simultaneously in the front face-side space 30 and the lower space 29.
[0030] Since the rear face-side space 31 assumes a negative pressure, the air in the front face-side space 30 passes through the front-rear air flow opening 32 and flows into the rear face-side space 31. At this time, with the existence of the guide member 91, the air fed from the front face-side space 30 to the rear face-side space 31 is forced to pass through the cooling holes 53 of the heat sinks 52. When passing through the cooling holes 53, the air enters the cooling holes 53 from their openings (openings on the side near the electrolytic capacitors 56) 54 on the side of the electrolytic capacitors 56 and flows out of the cooling holes 53 from the openings (openings on the side near the front-rear air flow openings 32) 55 on the side of the front-rear air flow opening vents 32.
[0031]That is, the air in the front face-side space 30 is collected at the electrolytic capacitors 56 side openings 54 to cool the adjacent electrolytic capacitors 56 (refer to FIG. 3). Further, the air directed to the rear face-side space 31 passes through the cooling holes 53 of the heat sinks 52 to cool the semiconductor devices 51 through the heat sinks 52.
[0032] The air that has flowed into the rear face-side space 31 from the front face-side space 30 rises while rotating in the rear face-side space 31 and is then discharged outside the housing 2.
Assuming that the fan 82 rotates in the counterclockwise direction, the air in the rear face-side space 31 rises while rotating in the counterclockwise direction (refer to FIG. 4). At this time, the air in the rear face-side space 31 cools the AC
reactors 61, the DC reactors 62, and the control transformers 63 arranged in the rear face-side space 31.
[0033] Meanwhile, the air in the lower space 29 passes through the upper-lower vent and flows into the rear face-side space 31, since the rear face-side space 31 assumes a negative pressure.
At this time, the air in the lower space 29 cools the circuit breakers 71 and the filter capacitors 72 provided in the lower space 29.
[0034] The air that has flowed into the rear face-side space 31 from the lower space 29 rises while rotating in the rear face-side space 31 as described above to cool the AC reactors 61, the DC
reactors 62, and the control transformers 63 and is then discharged outside the housing 2.
[0035] Hereinafter, effects of the electric power source device according to the first embodiment of the present invention will be described. According to the present embodiment, the air in the front face-side space 30 passes through the cooling holes 53 of the heat sinks 52 and flows into the rear face-side space 31.
Thus, it is possible to effectively cool the semiconductor devices 51 which are highly required to be cooled. Further, the air in the front face-side space 30 is collected at the opening portions 54 of the cooling holes 53 on the side near the electrolytic capacitors 56, so that it is possible to effectively cool the electrolytic capacitors 56 adjacent to the openings 54.
[0036] Further, the main air that has flowed into the front face-side space 30 flows therein so as to cool the electrolytic capacitors 56, the semiconductor devices 51, the AC reactors 61, the DC reactors 62, and the control transformers 63, thereby enhancing the cooling efficiency of the entire electric power source device.
[0037] Further, the air outside the housing 2 flows into the front face-side space 30 and the lower space 29 simultaneously, and independent flow paths are formed in the front face-side space 30 and the lower space 29, so that it is possible to independently cool a block including the semiconductor devices 51 and the electrolytic capacitors 56 and a block including the circuit breakers 71 and the filter capacitors 72. That is, the semiconductor devices 51 and the electrolytic capacitors 56 are cooled not by the air that has already cooled the circuit breakers 71 and the filter capacitors 72 but fresh cooling air, so that it is possible to effectively cool the semiconductor devices 51 and the electrolytic capacitors 56. Alternatively, the circuit breakers 71 and the filter capacitors 72 are cooled not by the air that has already cooled the semiconductor devices 51 and the electrolytic capacitors 56 but fresh cooling air, so that it is possible to effectively cool the circuit breakers 71 and the filter capacitors 72.
[0038] Further, the air in the rear face-side space 31 rises while rotating, so that it is possible to effectively cool the AC reactors 61, the DC reactors 62, and the control transformers 63.
[0039] According to the present embodiment, the semiconductor devices 51 and the electrolytic capacitors 56 having a great need for maintenance are arranged in the front face-side space 30, which improves workability at the time of maintenance. From the same reason, workability at the time of assembling the electric power source device 1 is high.
[0040] Further, the AC reactors 61, the DC reactors 62, and the control reactors 63 that generate radiation noise are arranged in the rear face-side space 31, it is possible to suppress the radiation noise from leaking to the front side of the electric power source device 1. Further, the rear face panel 22 is formed of magnetic metal, thereby preventing radiation noise from leaking to the rear side of the electric power source device 1.
[0041] Further, the air inlet hole 33 is provided on the front face panel, and air discharge opening 36 is provided on the top plate 26, thereby eliminating the need for additional space for air inlet and outlet, with the result that the electric power source device 1 can be installed adjacent to another device or walls. Further, the housing 2 is formed into a vertically extending rectangular solid, thereby reducing the installation space for the electric power source device 1.
[0042]
(Second Embodiment) The electric power source device according to a second embodiment will be described using FIGS. 5 to 8. FIG. 5 is a perspective view of the front side of the electric power source device according to the second embodiment of the present invention, in which electric wirings are omitted and a front face panel of the electric power source device has been removed. FIG.
6 is a perspective view of the rear side of the electric power source device of FIG. 5, in which a rear face panel of the electric power source device has been removed. FIG. 7 is a schematic front view of the electric power source device of FIG. 5, in which a part of the front face panel has been cut away and in which the main airflow is illustrated. FIG. 8 is a cross-sectional view as viewed in the direction of arrow VIII-VIII of FIG. 7. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0043] In the electric power source device 1 according to the second embodiment of the present invention, the front-rear air flow opening 32 is formed so as to vertically extend on one lateral side portion (right end portion in FIGS. 5 and 7) of the front-rear partition plate 28.
[0044] The plurality of electrolytic capacitors 56 are vertically arranged on the front surface of the front-rear partition plate 28 at the side portion thereof (left end side in FIGS. 5 through 7) where the front-rear air flow opening 32 are not formed. In the example illustrated in FIGS. 5 and 7, eight electrolytic capacitors 56 are arranged in one line.
[0045] The plurality of heat sinks 52 are vertically arranged on the front surface of the front-rear partition plate 28 and between the front-rear air flow opening 32 and the electrolytic capacitors 56 (at the lateral center of the front surface of the front-rear partition plate 28). In the example illustrated in FIGS. 5 to 8, four heat sinks 52 are arranged in one line between the eight electrolytic capacitors 56 and one front-rear air flow opening 32.
Further, in this example, eight semiconductor devices 51 are arranged in one line on the four heat sinks 52.
[0046]The fan 82 of the air discharger 81 rotates so as to make the air just after passing through the front-rear air flow opening 32 move in substantially perpendicular direction (toward the rear side) to the front-rear partition plate 28 in the rear face-side space 31. Referring to FIG. 8, the front-rear air flow opening 32 is formed at the lateral right end portion of the front-rear partition plate 28, so that the fan 82 rotates in the counterclockwise direction. Then, the air just after passing through the front-rear air flow opening 32 moves in substantially perpendicular direction (toward the rear side) to the front-rear partition plate 28 in the rear face-side space 31 and, after that, rises while rotating in the counterclockwise direction.
[0047] According to the present embodiment, the air in the rear face-side space 31 smoothly rotates to thereby effectively cool the AC reactors 61, the DC reactors 62, and the control transformers 63.
[0048]
(Third Embodiment) The electric power source device according to a third embodiment of the present invention will be described using FIG.
9. FIG. 9 is a view of the electric power source device according to the third embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0049] In the electric power source device 1 according to the third embodiment of the present invention, cut portions are formed so as to vertically extend at both lateral side portions of the front-rear partition plate 28. Gaps between the cut portions and the side face panels 23 and 24 serve as the front-rear air flow openings 32.
[0050] The guide member 91 is constituted by the end plates 93 and the parallel plates 94. The parallel plates 94 extend from the inner surface of the side face panels 23 and 24 to the semiconductor device 51 side surfaces of the heat sinks 52. The end plates 93 extend from top and bottom end portions of the front-rear air flow openings 32 to top and bottom end portions of the parallel plates 94.
[0051] According to the present embodiment, the same effects as in the electric power source device 1 according to the first embodiment of the present invention can be obtained.
[0052]
(Fourth Embodiment) The electric power source device according to a fourth embodiment of the present invention will be described using FIG.
10. FIG. 10 is a view of the electric power source device according to the fourth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0053] In the electric power source device 1 according to the fourth embodiment of the present invention, the front-rear air flow opening 32 is formed so as to vertically extend at the lateral center portion of the front-rear partition plate 28.
[0054] The plurality of electrolytic capacitors 56 are vertically arranged in two lines on the front surface of the front-rear partition plate 28 at lateral side portions thereof. The plurality of heat sinks 52 are vertically arranged in two lines on the front surface of the front-rear partition plate 28 and between the front-rear air flow opening 32 and the plurality of electrolytic capacitors 56.
[0055] The guide member 91 is constituted by the end plates 93 and the parallel plates 94. The parallel plates 94 extends across the semiconductor device 51 side surfaces of the plurality of heat sinks 52 arranged in two lines. The end plates 93 extend from top and bottom portions of the front-rear air flow opening 32 to top and bottom portions of the parallel plates 94.
[0056]According to the present embodiment, the same effects as in the electric power source device 1 according to the first embodiment of the present invention can be obtained.
[0057]
(Fifth Embodiment) The electric power source device according to a fifth embodiment of the present invention will be described using FIG.
[0053] In the electric power source device 1 according to the fourth embodiment of the present invention, the front-rear air flow opening 32 is formed so as to vertically extend at the lateral center portion of the front-rear partition plate 28.
[0054] The plurality of electrolytic capacitors 56 are vertically arranged in two lines on the front surface of the front-rear partition plate 28 at lateral side portions thereof. The plurality of heat sinks 52 are vertically arranged in two lines on the front surface of the front-rear partition plate 28 and between the front-rear air flow opening 32 and the plurality of electrolytic capacitors 56.
[0055] The guide member 91 is constituted by the end plates 93 and the parallel plates 94. The parallel plates 94 extends across the semiconductor device 51 side surfaces of the plurality of heat sinks 52 arranged in two lines. The end plates 93 extend from top and bottom portions of the front-rear air flow opening 32 to top and bottom portions of the parallel plates 94.
[0056]According to the present embodiment, the same effects as in the electric power source device 1 according to the first embodiment of the present invention can be obtained.
[0057]
(Fifth Embodiment) The electric power source device according to a fifth embodiment of the present invention will be described using FIG.
11. FIG. 11 is a view of the electric power source device according to the fifth embodiment of the present invention, which illustrates a cross-section of the electric power source device as viewed in the same direction as in FIG. 4. The present embodiment is a modification of the first embodiment, and the same or similar parts as those of the first embodiment are represented with the same reference numerals to omit redundant description.
[0058] In the electric power source device 1 according to the fifth embodiment of the present invention, the guide member 91 is integrally formed with the heat sinks 52. Specifically, the semiconductor device 51 side surfaces of the heat sinks 52 are extended along the side surface to form the parallel plates 94.
[0059] According to the present invention, heat radiation can be achieved not only by the heat sinks 52 but also by the guide members 91, thereby enhancing the heat radiation effect of the semiconductor devices 51.
[0060]
(Other Embodiments) The above embodiments are merely examples, and the present invention is not limited to such embodiments. For example, the number of the electrical components such as the semiconductor devices 51 or electrolytic capacitors 57 is not limited to the above embodiments. Further, the features of different embodiments may be combined.
[0058] In the electric power source device 1 according to the fifth embodiment of the present invention, the guide member 91 is integrally formed with the heat sinks 52. Specifically, the semiconductor device 51 side surfaces of the heat sinks 52 are extended along the side surface to form the parallel plates 94.
[0059] According to the present invention, heat radiation can be achieved not only by the heat sinks 52 but also by the guide members 91, thereby enhancing the heat radiation effect of the semiconductor devices 51.
[0060]
(Other Embodiments) The above embodiments are merely examples, and the present invention is not limited to such embodiments. For example, the number of the electrical components such as the semiconductor devices 51 or electrolytic capacitors 57 is not limited to the above embodiments. Further, the features of different embodiments may be combined.
Claims (8)
1. An electric power source device having a housing raised from a floor surface, the power source device comprising:
a housing including:
a front face panel having an air inlet hole through which air outside the housing can be passed inside the housing;
a rear face panel disposed opposite to the front face panel;
two side face panels constituting a tubular body together with the front and rear face panels;
a front-rear partition plate disposed so as to partition a space within the housing into a front face-side space and a rear face-side space and having a front-rear air flow opening through which the front face-side space and the rear face-side space communicate with each other; and a top plate disposed on an upper end surface of the tubular body and having an air discharge opening formed in an upper portion of the rear face-side space;
an air discharger disposed at the air discharge opening so as to discharge air in the rear face-side space outside the housing;
a plurality of capacitors vertically arranged on a surface of front side of the front-rear partition plate;
a plurality of heat sinks arranged on the surface of front side of the front-rear partition plate and between the front-rear air flow opening and the capacitors, the plurality of heat sinks including cooling holes penetrating therethrough from a capacitor side to a front-rear air flow opening side;
a plurality of semiconductor devices vertically arranged on the surface of the front side of the heat sinks; and a guide member through which the front-rear air flow opening and opening portions of the cooling holes on side of the front-rear air flow opening communicate with each other, wherein heat generated in the capacitors and the semiconductor devices is transferred by an air flow from the front face-side space to the rear face-side space through the cooling holes and the front-rear air flow opening.
a housing including:
a front face panel having an air inlet hole through which air outside the housing can be passed inside the housing;
a rear face panel disposed opposite to the front face panel;
two side face panels constituting a tubular body together with the front and rear face panels;
a front-rear partition plate disposed so as to partition a space within the housing into a front face-side space and a rear face-side space and having a front-rear air flow opening through which the front face-side space and the rear face-side space communicate with each other; and a top plate disposed on an upper end surface of the tubular body and having an air discharge opening formed in an upper portion of the rear face-side space;
an air discharger disposed at the air discharge opening so as to discharge air in the rear face-side space outside the housing;
a plurality of capacitors vertically arranged on a surface of front side of the front-rear partition plate;
a plurality of heat sinks arranged on the surface of front side of the front-rear partition plate and between the front-rear air flow opening and the capacitors, the plurality of heat sinks including cooling holes penetrating therethrough from a capacitor side to a front-rear air flow opening side;
a plurality of semiconductor devices vertically arranged on the surface of the front side of the heat sinks; and a guide member through which the front-rear air flow opening and opening portions of the cooling holes on side of the front-rear air flow opening communicate with each other, wherein heat generated in the capacitors and the semiconductor devices is transferred by an air flow from the front face-side space to the rear face-side space through the cooling holes and the front-rear air flow opening.
2. The electric power source device according to claim 1, wherein air in the front face-side space flows into the rear face-side space through the cooling holes and front-rear air flow opening.
3. The electric power source device according to claim 2, wherein AC
reactors, DC reactors, and control transformers are disposed in the rear face-side space.
reactors, DC reactors, and control transformers are disposed in the rear face-side space.
4. The electric power source device according to claim 3, wherein at least a part of the rear face panel is formed of magnetic metal.
5. The electric power source device according to claim 2, wherein the housing has an upper-lower partition plate disposed so as to partition the space within the housing into an upper space and a lower space and having an upper-lower vent through which the rear face-side space and the lower space communicate with each other, the front-rear partition plate is disposed so as to partition the upper space into a front face-side space and a rear face-side space, and the air in the lower space flows into the rear face-side space through the upper-lower vent.
6. The electric power source device according to claim 5, wherein a circuit breaker and a filter capacitor are disposed in the lower space.
7. The electric power source device according to claim 2, wherein the air discharger has a fan capable of making the air in the rear face-side space rise while rotating the air.
8. The electric power source device according to claim 7, wherein the front-rear air flow opening is formed in only one lateral end portion of the front-rear partition plate, and the fan rotates so as to make the air just after passing through the front-rear air flow opening move toward the rear side in rear face-side space.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2008/003872 WO2010070715A1 (en) | 2008-12-19 | 2008-12-19 | Electric power source device |
Publications (2)
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|---|---|
| CA2746730A1 CA2746730A1 (en) | 2010-06-24 |
| CA2746730C true CA2746730C (en) | 2015-02-10 |
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| CA2746730A Active CA2746730C (en) | 2008-12-19 | 2008-12-19 | Electric power source device |
Country Status (6)
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| JP (1) | JP5378413B2 (en) |
| KR (1) | KR101254896B1 (en) |
| CN (1) | CN102257711B (en) |
| CA (1) | CA2746730C (en) |
| MX (1) | MX2011006492A (en) |
| WO (1) | WO2010070715A1 (en) |
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| JP5957909B2 (en) * | 2012-01-27 | 2016-07-27 | 富士電機株式会社 | Power converter |
| CN102832813B (en) * | 2012-09-21 | 2015-08-12 | 湖南南车时代电动汽车股份有限公司 | A kind of bidirectional charger internal main electric component arrangement used for electric vehicle |
| JP6296303B2 (en) * | 2015-05-21 | 2018-03-20 | 富士電機株式会社 | Semiconductor power converter |
| CN107245725B (en) * | 2017-07-18 | 2020-10-30 | 杭州尚杭科技有限公司 | Ozone generating device for intelligent environment-friendly toilet |
| KR102120608B1 (en) * | 2020-01-23 | 2020-06-08 | 김석조 | Electric automatic control panel with increased safety |
| JP7493345B2 (en) * | 2020-01-31 | 2024-05-31 | ニデックインスツルメンツ株式会社 | Drive unit |
| CN113489311B (en) * | 2021-08-19 | 2022-03-18 | 江苏博乐电力能源装备有限公司 | DC-DC switching power supply |
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| JP2006311679A (en) * | 2005-04-27 | 2006-11-09 | Fuji Electric Systems Co Ltd | Power converter board |
| CN2891466Y (en) * | 2006-01-23 | 2007-04-18 | 袁忠杰 | Wind cooled high frequency switch power supply structure |
| JP4857889B2 (en) * | 2006-04-26 | 2012-01-18 | 株式会社明電舎 | Power converter cooling and soundproof structure |
-
2008
- 2008-12-19 KR KR1020117014343A patent/KR101254896B1/en active IP Right Grant
- 2008-12-19 CN CN200880132474.4A patent/CN102257711B/en active Active
- 2008-12-19 CA CA2746730A patent/CA2746730C/en active Active
- 2008-12-19 JP JP2010542752A patent/JP5378413B2/en active Active
- 2008-12-19 WO PCT/JP2008/003872 patent/WO2010070715A1/en active Application Filing
- 2008-12-19 MX MX2011006492A patent/MX2011006492A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101254896B1 (en) | 2013-04-15 |
| JPWO2010070715A1 (en) | 2012-05-24 |
| MX2011006492A (en) | 2011-09-27 |
| CA2746730A1 (en) | 2010-06-24 |
| WO2010070715A1 (en) | 2010-06-24 |
| JP5378413B2 (en) | 2013-12-25 |
| KR20110086766A (en) | 2011-07-29 |
| CN102257711B (en) | 2014-04-16 |
| CN102257711A (en) | 2011-11-23 |
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