CA2613974A1 - Emballage pour dispositif d'eclairage a semi-conducteurs - Google Patents
Emballage pour dispositif d'eclairage a semi-conducteurs Download PDFInfo
- Publication number
- CA2613974A1 CA2613974A1 CA002613974A CA2613974A CA2613974A1 CA 2613974 A1 CA2613974 A1 CA 2613974A1 CA 002613974 A CA002613974 A CA 002613974A CA 2613974 A CA2613974 A CA 2613974A CA 2613974 A1 CA2613974 A1 CA 2613974A1
- Authority
- CA
- Canada
- Prior art keywords
- light
- lighting device
- device package
- emitting elements
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002613974A CA2613974A1 (fr) | 2005-03-24 | 2006-03-24 | Emballage pour dispositif d'eclairage a semi-conducteurs |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66517905P | 2005-03-24 | 2005-03-24 | |
US60/665,179 | 2005-03-24 | ||
CA2,535,958 | 2006-02-10 | ||
CA2535958 | 2006-02-10 | ||
CA002613974A CA2613974A1 (fr) | 2005-03-24 | 2006-03-24 | Emballage pour dispositif d'eclairage a semi-conducteurs |
PCT/CA2006/000442 WO2006099741A1 (fr) | 2005-03-24 | 2006-03-24 | Emballage pour dispositif d'eclairage a semi-conducteurs |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2613974A1 true CA2613974A1 (fr) | 2006-09-28 |
Family
ID=38988241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002613974A Abandoned CA2613974A1 (fr) | 2005-03-24 | 2006-03-24 | Emballage pour dispositif d'eclairage a semi-conducteurs |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2613974A1 (fr) |
-
2006
- 2006-03-24 CA CA002613974A patent/CA2613974A1/fr not_active Abandoned
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Dead |