CA2432701A1 - Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection - Google Patents
Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection Download PDFInfo
- Publication number
- CA2432701A1 CA2432701A1 CA002432701A CA2432701A CA2432701A1 CA 2432701 A1 CA2432701 A1 CA 2432701A1 CA 002432701 A CA002432701 A CA 002432701A CA 2432701 A CA2432701 A CA 2432701A CA 2432701 A1 CA2432701 A1 CA 2432701A1
- Authority
- CA
- Canada
- Prior art keywords
- chip
- electrically conductive
- connection
- coupling element
- security
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/305—Associated digital information
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/355—Security threads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
- D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
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- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/14—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by function or properties in or on the paper
- D21H21/40—Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper
- D21H21/44—Latent security elements, i.e. detectable or becoming apparent only by use of special verification or tampering devices or methods
- D21H21/48—Elements suited for physical verification, e.g. by irradiation
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
- G07D7/01—Testing electronic circuits therein
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Abstract
A document of value has a chip and is connected to a coupling element for the transmission of data and/or energy from and/or to the chip via an adhesive.
According to a first embodiment, the adhesive contains electrically conductive particles which are smaller than the distance between the contact surfaces 5 of the chip 3 and the coupling element 2. According to a second embodiment, the conductive adhesive contains electrically conductive particles which are soft at an elevated temperature at which the chip 3 is applied to the coupling element 2. According to a third embodiment, it is possible to dispense with the electrically conductive particles in the adhesive.
Instead, the transmission of data/energy is carried out via an alternating field coupled in capacitively at high frequencies of about 2 GHz.
According to a first embodiment, the adhesive contains electrically conductive particles which are smaller than the distance between the contact surfaces 5 of the chip 3 and the coupling element 2. According to a second embodiment, the conductive adhesive contains electrically conductive particles which are soft at an elevated temperature at which the chip 3 is applied to the coupling element 2. According to a third embodiment, it is possible to dispense with the electrically conductive particles in the adhesive.
Instead, the transmission of data/energy is carried out via an alternating field coupled in capacitively at high frequencies of about 2 GHz.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10064411A DE10064411A1 (en) | 2000-12-21 | 2000-12-21 | Electrically conductive connection between a chip and a coupling element as well as security element, security paper and document of value with such a connection |
DE10064411.2 | 2000-12-21 | ||
PCT/EP2001/015018 WO2002050890A2 (en) | 2000-12-21 | 2001-12-19 | Electroconductive connection between a chip and a coupling element in addition to a security element containing a connection of said type |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2432701A1 true CA2432701A1 (en) | 2002-06-27 |
CA2432701C CA2432701C (en) | 2008-08-26 |
Family
ID=7668543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002432701A Expired - Fee Related CA2432701C (en) | 2000-12-21 | 2001-12-19 | Electrically conductive connection between a chip and a coupling element, and security element, security paper and document of value with such a connection |
Country Status (5)
Country | Link |
---|---|
EP (3) | EP3179508A1 (en) |
AU (1) | AU2002238451A1 (en) |
CA (1) | CA2432701C (en) |
DE (1) | DE10064411A1 (en) |
WO (1) | WO2002050890A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7476981B2 (en) | 2002-02-18 | 2009-01-13 | Infineon Technologies Ag | Electronic module with layer of adhesive and process for producing it |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10235771A1 (en) * | 2002-08-05 | 2004-02-26 | Texas Instruments Deutschland Gmbh | Encapsulated chip and production process for smart labels has baseplate with conductive surrounding layer and cover plate with conductive surfaces |
DE102004001661A1 (en) * | 2004-01-12 | 2005-08-11 | Infineon Technologies Ag | Method for electrically connecting an electrical conductor to an electronic component and device |
FR2893163B1 (en) * | 2005-11-08 | 2008-02-01 | Oberthur Card Syst Sa | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD AND A MICROCIRCUIT CARD, IN PARTICULAR A MAGNETIC ANTENNA. |
FR2894714B1 (en) * | 2005-12-13 | 2008-02-29 | K Sa As | METHOD FOR CONNECTING AN ELECTRONIC CHIP TO A RADIOFREQUENCY IDENTIFICATION DEVICE |
EP2038817B1 (en) | 2006-06-07 | 2015-04-01 | Nxp B.V. | Semiconductor chip, transponder and method of manufacturing a transponder |
FR2904723B1 (en) * | 2006-08-01 | 2008-12-19 | Arjowiggins Security Soc Par A | SECURITY STRUCTURE, IN PARTICULAR FOR A DOCUMENT OF SECURITY AND / OR VALUE |
EP1923822A1 (en) * | 2006-11-09 | 2008-05-21 | Gemplus | Method of manufacturing an element of a secure electric or electronic circuit, element obtained and support integrating said element |
FR2917534B1 (en) * | 2007-06-15 | 2009-10-02 | Ask Sa | METHOD FOR CONNECTING AN ELECTRONIC CHIP TO A RADIO FREQUENCY IDENTIFICATION DEVICE |
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DE2902002A1 (en) * | 1979-01-19 | 1980-07-31 | Gerhard Krause | Three=dimensional integrated circuits - mfd. by joining wafer stack with contacts through conductive adhesive |
EP0265077A3 (en) * | 1986-09-25 | 1989-03-08 | Sheldahl, Inc. | An anisotropic adhesive for bonding electrical components |
US4902857A (en) * | 1988-12-27 | 1990-02-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Polymer interconnect structure |
JPH04332404A (en) * | 1991-05-07 | 1992-11-19 | Nec Corp | Anisotropic conductive material and connection of integrated circuit element using it |
AT399274B (en) | 1993-05-14 | 1995-04-25 | Kainz Johann | EXTENDABLE SAUNA CABIN |
JPH10502677A (en) * | 1994-06-29 | 1998-03-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Anisotropic conductive adhesive and method for producing anisotropic conductive adhesive |
DE19601358C2 (en) * | 1995-01-20 | 2000-01-27 | Fraunhofer Ges Forschung | Integrated circuit paper |
JPH08202844A (en) * | 1995-01-25 | 1996-08-09 | Nippon Retsuku Kk | Electronic unit and its manufacture |
JP3150575B2 (en) * | 1995-07-18 | 2001-03-26 | 沖電気工業株式会社 | Tag device and manufacturing method thereof |
US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
DE19636813C1 (en) * | 1996-09-11 | 1998-01-29 | Bosch Gmbh Robert | Method of mounting piezoelectric elements on metal surface e.g. in sensor systems |
DE19640192A1 (en) * | 1996-09-30 | 1998-04-02 | Bosch Gmbh Robert | Process for flip chip assembly |
EP0905657B1 (en) * | 1997-09-23 | 2003-05-28 | STMicroelectronics S.r.l. | Currency note comprising an integrated circuit |
DE69737914T2 (en) * | 1997-12-22 | 2008-02-07 | Hitachi, Ltd. | CARDBOARD DEVICE WITH A SEMICONDUCTOR ELEMENT |
NL1008929C2 (en) * | 1998-04-20 | 1999-10-21 | Vhp Ugchelen Bv | Substrate made of paper provided with an integrated circuit. |
DE19826568A1 (en) * | 1998-06-15 | 1999-12-16 | Sihl Gmbh | Duplicate form set for transported material, esp. for freight items/packages/wallet envelopes, with several sheets and a transponder integrated into one sheet with a connected antenna enables wireless transfer of re-readable data |
TW484101B (en) * | 1998-12-17 | 2002-04-21 | Hitachi Ltd | Semiconductor device and its manufacturing method |
DE19957609A1 (en) | 1998-12-30 | 2000-07-06 | Giesecke & Devrient Gmbh | Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
-
2000
- 2000-12-21 DE DE10064411A patent/DE10064411A1/en not_active Ceased
-
2001
- 2001-12-19 CA CA002432701A patent/CA2432701C/en not_active Expired - Fee Related
- 2001-12-19 EP EP16002743.9A patent/EP3179508A1/en not_active Withdrawn
- 2001-12-19 EP EP01986899A patent/EP1362369A2/en not_active Ceased
- 2001-12-19 EP EP16002742.1A patent/EP3179505A1/en active Pending
- 2001-12-19 AU AU2002238451A patent/AU2002238451A1/en not_active Abandoned
- 2001-12-19 WO PCT/EP2001/015018 patent/WO2002050890A2/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7476981B2 (en) | 2002-02-18 | 2009-01-13 | Infineon Technologies Ag | Electronic module with layer of adhesive and process for producing it |
Also Published As
Publication number | Publication date |
---|---|
DE10064411A1 (en) | 2002-06-27 |
WO2002050890A2 (en) | 2002-06-27 |
CA2432701C (en) | 2008-08-26 |
EP3179505A1 (en) | 2017-06-14 |
WO2002050890A3 (en) | 2003-09-12 |
EP3179508A1 (en) | 2017-06-14 |
EP1362369A2 (en) | 2003-11-19 |
AU2002238451A1 (en) | 2002-07-01 |
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Legal Events
Date | Code | Title | Description |
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EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20161219 |