CA2427259C - Power cable - Google Patents
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- CA2427259C CA2427259C CA002427259A CA2427259A CA2427259C CA 2427259 C CA2427259 C CA 2427259C CA 002427259 A CA002427259 A CA 002427259A CA 2427259 A CA2427259 A CA 2427259A CA 2427259 C CA2427259 C CA 2427259C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2927—Rod, strand, filament or fiber including structurally defined particulate matter
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2942—Plural coatings
- Y10T428/2947—Synthetic resin or polymer in plural coatings, each of different type
Abstract
A cable comprising an electrical conductor or a core of electrical conductors surrounded by (A) an insulation layer, which is surrounded by, and contiguous with, (B) an insulation shield layer, the (A) insulation layer comprising: a) a polymer selected from the group consisting of polyethylene, ethylene/propylene copolymer rubber, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer; b) 0.0005 to 1 percent by weight of a 4-substituted 2, 2, 6, 6-tetramethylepiperidine containing one or more of the group wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms; and the (B) insulation shield layer comprising: a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl esters, acrylic acid esters, and methacrylic acid esters wherein the vinyl ester is present in the copolymer in an amount of 10 to 28 percent by weight based on the weight of the copolymer and the acrylic acid esters and methacrylic acid esters are present in an amount of 10 to 50 percent by weight based on the weight of component (B)(a); b)a conductive carbon black; and, based on the weight of the insulation shield layer; c) at least 5 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B) (c).
Description
POWER CABLE
Technical Field This invention relates to a power cable having semiconducting shields.
Background Information A typical electric power cable generally comprises one or more electrical conductors in a cable core that is surrounded by several layers of polymeric materials including a first or inner semiconducting shield layer (conductor or strand shield), an insulation layer, a second or outer semiconducting shield layer (insulation shield), a metallic tape or wire shield, and a protective jacket. The outer semiconducting shield can be either bonded to the insulation or strippable, with most applications using strippable shields. The inner semiconducting shield is generally bonded to the insulation layer. Additional layers within this construction such as moisture impervious materials are often incorporated.
Polymeric semiconducting shields have been utilized in multilayered power cable construction for many decades. Generally, they are used to fabricate solid dielectric power cables rated for voltages greater than 1 kilovolt (kV). These shields are used to provide layers of intermediate conductivity between the high potential conductor and the primary insulation, and between the primary insulation and the ground or neutral potential. The volume resistivity of these semiconducting materials is typically in the range of 10-1 to 108 ohm-cm when measured on a completed power cable construction using the methods described in ICEA 5-66-524, section 6.12, or IEC 60502-2 (1997), Annex C. Typical strippable shield compositions contain a polyolefin such as ethylene/vinyl acetate copolymer with a high vinyl acetate content, conductive carbon black, an organic peroxide crosslinking agent, and other conventional additives such as a nitrile rubber, which functions as a strip force reduction aid, processing aids, and antioxidants. These compositions are usually prepared in pellet form. Polyolefin formulations such as these are disclosed in United States patent 4,286,023 and European Patent Application 420 271.
Insulated electrical conductors are typically manufactured by coextrusion by which three layers, the inner semi-conducting layer, the crosslinkable polyolefin insulation layer, and the insulation shield are extruded simultaneously, employing coaxial extruders, and subsequently cured in a single operation. This method of manufacture is advantageous in that it results in the close bonding of the three layers, eliminating partial delamination and void formation between layers, caused, during normal use, by flexure and heat. This, in turn, helps prevent premature cable failure. On the other hand, such a method of manufacture for cable constructions requiring a strippable insulation shield presents problems of strippability due to the high bond strength between the crosslinked polyolefin insulation layer and the insulation shield, caused in part by formation of crosslinking bonds across their interface.
While it is important that the insulation shield adhere to the insulation layer, it is also important that the insulation shield can be stripped with relative ease in a short period of time. It is found that the typical insulation shield does not have optimum strippability with respect to the insulation layer. Strippability is very important in that it is not only time saving, but enhances the quality of the splice or terminal connection.
It is well understood by those skilled in the art, however, that thermal stability is not to be sacrificed to achieve optimum strippablity.
Three approaches have been taken to achieve acceptable strippability and thermal stability of the insulation shield in combination with commercial insulation layers made up of crosslinked polyethylene;
tree retardant, crosslinked polyethylene; or ethylene/propylene copolymer rubbers. The first approach provides an insulation shield made up of an
Technical Field This invention relates to a power cable having semiconducting shields.
Background Information A typical electric power cable generally comprises one or more electrical conductors in a cable core that is surrounded by several layers of polymeric materials including a first or inner semiconducting shield layer (conductor or strand shield), an insulation layer, a second or outer semiconducting shield layer (insulation shield), a metallic tape or wire shield, and a protective jacket. The outer semiconducting shield can be either bonded to the insulation or strippable, with most applications using strippable shields. The inner semiconducting shield is generally bonded to the insulation layer. Additional layers within this construction such as moisture impervious materials are often incorporated.
Polymeric semiconducting shields have been utilized in multilayered power cable construction for many decades. Generally, they are used to fabricate solid dielectric power cables rated for voltages greater than 1 kilovolt (kV). These shields are used to provide layers of intermediate conductivity between the high potential conductor and the primary insulation, and between the primary insulation and the ground or neutral potential. The volume resistivity of these semiconducting materials is typically in the range of 10-1 to 108 ohm-cm when measured on a completed power cable construction using the methods described in ICEA 5-66-524, section 6.12, or IEC 60502-2 (1997), Annex C. Typical strippable shield compositions contain a polyolefin such as ethylene/vinyl acetate copolymer with a high vinyl acetate content, conductive carbon black, an organic peroxide crosslinking agent, and other conventional additives such as a nitrile rubber, which functions as a strip force reduction aid, processing aids, and antioxidants. These compositions are usually prepared in pellet form. Polyolefin formulations such as these are disclosed in United States patent 4,286,023 and European Patent Application 420 271.
Insulated electrical conductors are typically manufactured by coextrusion by which three layers, the inner semi-conducting layer, the crosslinkable polyolefin insulation layer, and the insulation shield are extruded simultaneously, employing coaxial extruders, and subsequently cured in a single operation. This method of manufacture is advantageous in that it results in the close bonding of the three layers, eliminating partial delamination and void formation between layers, caused, during normal use, by flexure and heat. This, in turn, helps prevent premature cable failure. On the other hand, such a method of manufacture for cable constructions requiring a strippable insulation shield presents problems of strippability due to the high bond strength between the crosslinked polyolefin insulation layer and the insulation shield, caused in part by formation of crosslinking bonds across their interface.
While it is important that the insulation shield adhere to the insulation layer, it is also important that the insulation shield can be stripped with relative ease in a short period of time. It is found that the typical insulation shield does not have optimum strippability with respect to the insulation layer. Strippability is very important in that it is not only time saving, but enhances the quality of the splice or terminal connection.
It is well understood by those skilled in the art, however, that thermal stability is not to be sacrificed to achieve optimum strippablity.
Three approaches have been taken to achieve acceptable strippability and thermal stability of the insulation shield in combination with commercial insulation layers made up of crosslinked polyethylene;
tree retardant, crosslinked polyethylene; or ethylene/propylene copolymer rubbers. The first approach provides an insulation shield made up of an
-2-ethylene/vinyl acetate copolymer typically containing 33 percent by weight vinyl acetate and an acrylonitrile/butadiene rubber (NBR). The second uses an ethylene/vinyl acetate copolymer typically containing 40 percent or more by weight vinyl acetate and no NBR. These two approaches provide acceptable strippability, but poor thermal stability. The third approach uses an ethylene/ethyl acrylate copolymer insulation shield. This approach solves the problem of poor thermal stability, but unfortunately exhibits poor or no strippability.
Disclosure of the Invention An object of this invention, therefore, is to provide a power cable having an insulation layer surrounded by an insulation shield with improved strippability while maintaining a satisfactory level of thermal stability. Other objects and advantages will become apparent hereinafter.
According to the invention, such a cable has been discovered.
The cable comprises an electrical conductor or a core of electrical conductors surrounded by (A) an insulation layer, which is surrounded by, and contiguous with, (B) an insulation shield layer, the (A) insulation layer comprising:
(a) a polymer selected from the group consisting of polyethylene, ethylene/propylene copolymer rubber, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.005 to 1 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group R
H3C ~ CH3 N
Disclosure of the Invention An object of this invention, therefore, is to provide a power cable having an insulation layer surrounded by an insulation shield with improved strippability while maintaining a satisfactory level of thermal stability. Other objects and advantages will become apparent hereinafter.
According to the invention, such a cable has been discovered.
The cable comprises an electrical conductor or a core of electrical conductors surrounded by (A) an insulation layer, which is surrounded by, and contiguous with, (B) an insulation shield layer, the (A) insulation layer comprising:
(a) a polymer selected from the group consisting of polyethylene, ethylene/propylene copolymer rubber, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.005 to 1 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group R
H3C ~ CH3 N
-3-wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms ; and the (B) insulation shield layer comprising:
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl esters, acrylic acid esters, and methacrylic acid esters wherein the vinyl ester is present in the copolymer in an amount of 10 to 28 percent by weight based on the weight of the copolymer and the acrylic acid esters and methacrylic acid esters are present in an amount of 10 to 50 percent by weight based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) at least 5 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
Description of the Preferred Embodiments) The cable described above is generally used in medium and high voltage systems.
The polyethylene used in the insulation can be a homopolymer of ethylene or a copolymer of ethylene and an alpha-olefin.
The term "polyethylene" also includes the copolymers of ethylene and an unsaturated ester described below. The polyethylene can have a high, medium, or low density. Thus, the density can range from 0.860 to 0.960 gram per cubic centimeter. The alpha-olefin can have 3 to 12 carbon atoms, and preferably has 3 to 8 carbon atoms. Preferred alpha-olefins can be exemplified by propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, and 1-octene. The melt index can be in the range of 1 to 20 grams per 10 minutes, and is preferably in the range of 2 to 8 grams per 10 minutes. The ethylene
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl esters, acrylic acid esters, and methacrylic acid esters wherein the vinyl ester is present in the copolymer in an amount of 10 to 28 percent by weight based on the weight of the copolymer and the acrylic acid esters and methacrylic acid esters are present in an amount of 10 to 50 percent by weight based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) at least 5 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
Description of the Preferred Embodiments) The cable described above is generally used in medium and high voltage systems.
The polyethylene used in the insulation can be a homopolymer of ethylene or a copolymer of ethylene and an alpha-olefin.
The term "polyethylene" also includes the copolymers of ethylene and an unsaturated ester described below. The polyethylene can have a high, medium, or low density. Thus, the density can range from 0.860 to 0.960 gram per cubic centimeter. The alpha-olefin can have 3 to 12 carbon atoms, and preferably has 3 to 8 carbon atoms. Preferred alpha-olefins can be exemplified by propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, and 1-octene. The melt index can be in the range of 1 to 20 grams per 10 minutes, and is preferably in the range of 2 to 8 grams per 10 minutes. The ethylene
-4-polymers useful in subject invention are preferably produced in the gas phase. They can also be produced in the liquid phase in solutions or slurries by conventional techniques. They can be produced by high pressure or low pressure processes. Low pressure processes are typically run at pressures below 1000 psi whereas, as noted above, high pressure processes are typically run at pressures above 15,000 psi. Generally, the ethylene homopolymer is prepared by a high pressure process and the copolymers by low pressure processes. Typical catalyst systems, which can be used to prepare these polymers are magnesium/titanium based catalyst systems, which can be exemplified by the catalyst system described in United States patent 4,302,565; vanadium based catalyst systems such as those described in United States patents 4,508,842 and 5,332,793; 5,342,907; 'and
5,410,003; a chromium based catalyst system such as that described in United States patent 4,101,445; a metallocene catalyst system such as that described in United States patents 4,937,299 and 5,317,036; or other transition metal catalyst systems. Many of these catalyst systems are often referred to as Ziegler-Natta or Phillips catalyst systems. Catalyst systems, which use chromium or molybdenum oxides on silica-alumina supports, are also useful. Typical processes for preparing the polymers are also described in the aforementioned patents. Typical in situ polymer blends and processes and catalyst systems for providing same are described in United States Patents 5,371,145 and 5,405,901. A conventional high pressure process is described in Introduction to Polymer Chemistry, Stille, Wiley and Sons, New York, 1962, pages 149 to 151. A typical catalyst for high pressure processes is an organic peroxide. The processes can be carried out in a tubular reactor or a stirred autoclave.
Examples of the polyethylene are the homopolymer of ethylene (HP-LDPE), linear low density polyethylene (LLDPE), and very low density polyethylene (VLDPE). Medium and high density polyethylenes can also be used. The homopolymer of ethylene is generally made by a conventional high pressure process. It preferably has a density in the range of 0.910 to 0.930 gram per cubic centimeter. The homopolymer can also have a melt index in the range of 1 to 5 grams per 10 minutes, and preferably has a melt index in the range of 0.75 to 3 grams per 10 minutes.
The LLDPE can have a density in the range of 0.916 to 0.925 gram per cubic centimeter. The melt index can be in the range of 1 to 20 grams per minutes, and is preferably in the range of 3 to 8 grams per 10 minutes.
The density of the VLDPE, which is also linear, can be in the range of 0.860 to 0.915 gram per cubic centimeter. The melt index of the VLDPE can be in the range of 0.1 to 20 grams per 10 minutes and is preferably in the range of 0.3 to 5 grams per 10 minutes. The portion of the LLDPE and the VLDPE attributed to the comonomer(s), other than ethylene, can be in the range of 1 to 49 percent by weight based on the weight of the copolymer and is preferably in the range of 15 to 40 percent by weight. A third comonomer can be included, for example, another alpha-olefin or a dime such as ethylidene norbornene, butadiene, 1,4-hexadiene, or a dicyclopentadiene.
The third comonomer can be present in an amount of 1 to 15 percent by weight based on the weight of the copolymer and is preferably present in an amount of 1 to 10 percent by weight. It is preferred that the copolymers contain two or three comonomers inclusive of ethylene.
In addition to the polyethylene described above, another preferred resin for use in the insulation is an EPR (ethylene/propylene rubber), which includes both the ethylene/propylene copolymer (EPM) and an ethylene/propylene/diene terpolymer (EPDM). These rubbers have a density in the range of 1.25 to 1.45 grams per cubic centimeter and a Mooney viscosity (ML 1 + 4) at 125 degrees C in the range of 10 to 40. The propylene is present in the copolymer or terpolymer in an amount of 20 to 50 percent by weight, and the dime is present in an amount of 0 to 12 percent by weight. Examples of dimes used in the terpolymer are hexadiene, dicyclopentadiene, and ethylidene norbornene .
Examples of the polyethylene are the homopolymer of ethylene (HP-LDPE), linear low density polyethylene (LLDPE), and very low density polyethylene (VLDPE). Medium and high density polyethylenes can also be used. The homopolymer of ethylene is generally made by a conventional high pressure process. It preferably has a density in the range of 0.910 to 0.930 gram per cubic centimeter. The homopolymer can also have a melt index in the range of 1 to 5 grams per 10 minutes, and preferably has a melt index in the range of 0.75 to 3 grams per 10 minutes.
The LLDPE can have a density in the range of 0.916 to 0.925 gram per cubic centimeter. The melt index can be in the range of 1 to 20 grams per minutes, and is preferably in the range of 3 to 8 grams per 10 minutes.
The density of the VLDPE, which is also linear, can be in the range of 0.860 to 0.915 gram per cubic centimeter. The melt index of the VLDPE can be in the range of 0.1 to 20 grams per 10 minutes and is preferably in the range of 0.3 to 5 grams per 10 minutes. The portion of the LLDPE and the VLDPE attributed to the comonomer(s), other than ethylene, can be in the range of 1 to 49 percent by weight based on the weight of the copolymer and is preferably in the range of 15 to 40 percent by weight. A third comonomer can be included, for example, another alpha-olefin or a dime such as ethylidene norbornene, butadiene, 1,4-hexadiene, or a dicyclopentadiene.
The third comonomer can be present in an amount of 1 to 15 percent by weight based on the weight of the copolymer and is preferably present in an amount of 1 to 10 percent by weight. It is preferred that the copolymers contain two or three comonomers inclusive of ethylene.
In addition to the polyethylene described above, another preferred resin for use in the insulation is an EPR (ethylene/propylene rubber), which includes both the ethylene/propylene copolymer (EPM) and an ethylene/propylene/diene terpolymer (EPDM). These rubbers have a density in the range of 1.25 to 1.45 grams per cubic centimeter and a Mooney viscosity (ML 1 + 4) at 125 degrees C in the range of 10 to 40. The propylene is present in the copolymer or terpolymer in an amount of 20 to 50 percent by weight, and the dime is present in an amount of 0 to 12 percent by weight. Examples of dimes used in the terpolymer are hexadiene, dicyclopentadiene, and ethylidene norbornene .
-6-Mixtures of polyethylene and EPR are contemplated.
The insulation also contains 0.005 to 1 percent by weight, and preferably 0.1 to 0.3 percent by weight, of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group ;H3 wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms, and preferably 1 to 18 carbon atoms. Examples of the alkoxy group are methoxy and ethoxy. Examples of the alkyl group are methyl and ethyl.
The resins most commonly used in semiconducting shields are elastomers of varying degrees of crystallinity from amorphous through low and medium crystallinity, preferably copolymers of ethylene and unsaturated esters. Insofar as the insulation shield of this invention is concerned, the unsaturated ester is a vinyl ester, an acrylic acid ester, or a methacrylic acid ester. The ethylene/vinyl ester copolymer has an ester content of 10 to 28 percent by weight based on the weight, of the copolymer, and preferably has an ester content of 15 to 28 percent by weight. The ethylene/acrylic or methacrylic acid copolymer has an ester content of 10 to 50 percent by weight, and preferably has an ester content of 20 to 40 percent by weight based on the weight of the copolymer. The ethylene/unsaturated ester copolymers are usually made by conventional high pressure processes. These high pressure processes are typically run at pressures above 15,000 psi (pounds per square inch). The copolymers can have a density in the range of 0.900 to 0.990 gram per cubic centimeter, and preferably have a density in the range of 0.920 to 0.970 gram per cubic centimeter. The copolymers can also have a melt index in the range of 10 to 100 grams per 10 minutes, and preferably have a melt index in the range
The insulation also contains 0.005 to 1 percent by weight, and preferably 0.1 to 0.3 percent by weight, of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group ;H3 wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms, and preferably 1 to 18 carbon atoms. Examples of the alkoxy group are methoxy and ethoxy. Examples of the alkyl group are methyl and ethyl.
The resins most commonly used in semiconducting shields are elastomers of varying degrees of crystallinity from amorphous through low and medium crystallinity, preferably copolymers of ethylene and unsaturated esters. Insofar as the insulation shield of this invention is concerned, the unsaturated ester is a vinyl ester, an acrylic acid ester, or a methacrylic acid ester. The ethylene/vinyl ester copolymer has an ester content of 10 to 28 percent by weight based on the weight, of the copolymer, and preferably has an ester content of 15 to 28 percent by weight. The ethylene/acrylic or methacrylic acid copolymer has an ester content of 10 to 50 percent by weight, and preferably has an ester content of 20 to 40 percent by weight based on the weight of the copolymer. The ethylene/unsaturated ester copolymers are usually made by conventional high pressure processes. These high pressure processes are typically run at pressures above 15,000 psi (pounds per square inch). The copolymers can have a density in the range of 0.900 to 0.990 gram per cubic centimeter, and preferably have a density in the range of 0.920 to 0.970 gram per cubic centimeter. The copolymers can also have a melt index in the range of 10 to 100 grams per 10 minutes, and preferably have a melt index in the range
-7-of 20 to 50 grams per 10 minutes. Melt index is determined under ASTM
D-1238, Condition E. It is measured at 190° C and 2.16 kilograms.
The ester can have 4 to 20 carbon atoms, and preferably has 4 to 7 carbon atoms. Examples of vinyl esters are vinyl acetate, vinyl butyrate, vinyl pivalate, vinyl neononanoate, vinyl neodecanoate, and vinyl 2-ethylhexanoate. Vinyl acetate is preferred. Examples of acrylic and methacrylic acid esters are lauryl methacrylate; myristyl methacrylate;
palmityl methacrylate; stearyl methacrylate; 3-methacryloxy-propyltrimethoxysilane; 3-methacryloxypropyltriethoxysilane; cyclohexyl methacrylate; n-hexylmethacrylate; isodecyl methacrylate; 2-methoxyethyl methacrylate; tetrahydrofurfuryl methacrylate; octyl methacrylate; 2-phenoxyethyl methacrylate; isobornyl methacrylate; isooctylmethacrylate;
octyl methacrylate; isooctyl methacrylate; oleyl methacrylate; ethyl acrylate; methyl acrylate; t-butyl acrylate; n-butyl acrylate; and 2-ethylhexyl acrylate. Methyl acrylate, ethyl acrylate, and n- or t-butyl acrylate are preferred. In the case of alkyl acrylates and methacrylates, the alkyl group can have 1 to 8 carbon atoms, and preferably has 1 to 4 carbon atoms. The alkyl group can be substituted with an oxyalkyltrialkoxysilane, for example, or other various groups.
In order to provide a semiconducting shield it is necessary to incorporate conductive particles into the composition. These conductive particles are generally provided by particulate carbon black, which is referred to above. Useful carbon blacks can have a surface area of 20 to 1000 square meters per gram. The surface area is determined under ASTM
D 4820-93a (Multipoint B.E.T. Nitrogen Adsorption). The carbon black can be used in the semiconducting shield composition in an amount of 15 to 45 percent by weight based on the weight of the insulation shield layer, and is preferably used in an amount of 30 to 40 percent by weight. Both standard conductivity and high conductivity carbon blacks can be used with standard conductivity blacks being preferred.
_g_ Examples of conductive carbon blacks are the grades described by ASTM
N550, N472, N351, N110, and acetylene black.
Component (B)(c) is a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of the copolymer, and is preferably present in the copolymer in an amount of 30 to 35 percent by weight. This copolymer is also known as a nitrile rubber or an acrylonitrile/butadiene copolymer rubber. The density can be, for example, 0.98 gram per cubic centimeter and the Mooney Viscosity measured at 100 degrees C can be (ML 1+4) 50.
The components can be present in the following percentages by weight:
Component Broad Range Preferred Range Insulation layer (A)(a) 90 to 99 96 to 99 (A)(b) 0.005 to 1 0.1 to 0.3 Insulation shield layer (B)(a) 30 to 70 40 to 60 (B)(b) 15 to 45 30 to 40 (B)(c) at least 5 10 to 50 10 to 30.(most preferred) The polymers used in the invention are preferably crosslinked.
This is accomplished in a conventional manner with an organic peroxide or by irradiation, the former being preferred. The amount of organic peroxide used can be in the range of 0.2 to 5 percent by weight of organic peroxide based on the weight of the layer in which it is included, and is preferably in the range of 0.4 to 2 parts by weight. Organic peroxide crosslinking temperatures, as defined by a one minute half life for the peroxide _g_ decomposition, can be in the range of 150 to 250 degrees C and are preferably in the range of 170 to 210 degrees C.
Examples of organic peroxides useful in crosslinking are dicumyl peroxide; lauroyl peroxide; benzoyl peroxide; tertiary butyl perbenzoate; di(tertiary-butyl) peroxide; cumene hydroperoxide; 2,5-dimethyl-2,5-di(t-butyl-peroxy)hexyne-3; 2,5-dimethyl-2,5-di(t-butyl-peroxy)hexane; tertiary butyl hydroperoxide; isopropyl percarbonate; and alpha,alpha'-bis(tertiary-butylperoxy)diisopropylbenzene.
Conventional additives, which can be introduced into the composition, are exemplified by antioxidants, coupling agents, ultraviolet absorbers or stabilizers, antistatic agents, pigments, dyes, nucleating agents, reinforcing fillers or polymer additives, slip agents, plasticizers, processing aids, lubricants, viscosity control agents, tackifiers, anti-blocking agents, surfactants, extender oils, metal deactivators, voltage stabilizers, flame retardant fillers and additives, crosslinking agents, boosters, and catalysts, and smoke suppressants. Additives and fillers can be added in amounts ranging from less than 0.1 to more than 50 percent by weight based on the weight of the layer in which it is included.
Examples of antioxidants are: hindered phenols such as tetrakis[methylene(3,5-di-tert- butyl-4-hydroxyhydro-cinnamate)]methane, bis [(beta-(3,5-ditert-butyl-4-hydroxybenzyl)-methylcarboxyethyl)] sulphide, 4,4'-thiobis(2-methyl-6-tert-butylphenol), 4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), and thiodiethylene bis(3,5-di-tert-butyl-4-hydroxy)hydrocinnamate; phosphites and phosphonites such as tris(2,4-di-tert-butylphenyl)phosphite and di-tert-butylphenyl-phosphonite; thio compounds such as dilaurylthiodipropionate, dimyristylthiodipropionate, and distearylthiodipropionate; various siloxanes; and various amines such as polymerized 2,2,4-trimethyl-1,2-dihydroquinoline, 4,4'-bis(alpha,alpha-demthylbenzyl)diphenylamine, and alkylated diphenylamines. Antioxidants can be used in amounts of 0.1 to 5 percent by weight based on the weight of the layer in which it is included.
Compounding can be effected in a conventional melt/mixer or in a conventional extruder, and these terms are used in this specification interchangeably. Generally, the conductive shield composition is prepared in a melt/mixer and then pelletized using a pelletizer attachment or an extruder adapted for pelletizing. Both the melt/mixer, as the name implies, and the extruder, in effect, have melting and mixing zones although the various sections of each are known to those skilled in the art by different names. The semiconducting shield composition can be prepared in various types of melt/mixers and extruders such as a BrabenderTM mixer, BanburyTM mixer, a roll mill, a BussT"" co-kneader, a biaxial screw kneading extruder, and single or twin screw extruders. A description of a conventional extruder can be found in United States patent 4,857,600. In addition to melt/mixing, the extruder can coat a wire or a core of wires. An example of co-extrusion and an extruder therefor can be found in United States patent 5,575,965. A typical extruder has a hopper at its upstream end and a die at its downstream end. The hopper feeds into a barrel, which contains a screw. At the downstream end, between the end of the screw and the die, is a screen pack and a breaker plate. The screw portion of the extruder is considered to be divided up into three sections, the feed section, the compression section, and the metering section, and two zones, the back heat zone and the front heat zone, the sections and zones running from upstream to downstream. In the alternative, there can be multiple heating zones (more than two) along the axis running from upstream to downstream. If it has more than one barrel, the barrels are connected in series. The length to diameter ratio of each barrel is in the range of 15:1 to 30:1. In wire coating, where the material is crosslinked after extrusion, the die of the crosshead feeds directly into a heating zone in which temperatures can be in the range of 130°C to 260°C.
The advantages of the invention are an insulation shield easily strippable from the insulation; improved pellet handling characteristics; a reduction in CV (continuous vulcanization) line decomposition products; higher throughput rates; and cost reduction..
The term "surrounded" as it applies to a substrate being surrounded by an insulating composition, jacketing material, or other cable layer is considered to include extruding around the substrate; coating the substrate; or wrapping around the substrate as is well known by those skilled in the art. The substrate can include, for example, a core including a conductor or a bundle of conductors, or various underlying cable layers as noted above.
All molecular weights mentioned in this specification are weight average molecular weights unless otherwise designated.
The invention is illustrated by the following examples.
Examples 1 to 10 Examples 1 and 2 demonstrate the effect of including a TMP
in tree resistant, crosslinked insulation having an ethylene/ethyl acrylate copolymer insulation shield over the insulation. In this case, the ethyl acrylate content is 35 percent by weight of the polymer. Without a TMP in the insulation (example 1), the insulation shield is fully bonded to the insulation, and cannot be stripped. With a TMP (example 2), the strip force is 10 pounds per 0.5 inch, which is within the typical range for commercial cables.
Strip force is reported in pounds per 0.5 inch. It is measured as follows:
Single plaques are prepared from insulation shield formulation pellets and insulation layer formulation pellets by compression molding. Prior to compression molding, the pellets are melted on a two roll-mill. An organic peroxide is added if crosslinking is desired. The temperature for compression molding of shield pellets is 110 degrees C.
Approximately 65 grams of shield formulation are used to prepare a 30 mil plaque. The temperature for compression molding of insulation pellets is 130 degrees C. Approximately 135 grams of insulation formulation are used to prepare a 125 mil plaque. The weighed material is sandwiched between two MylarTM plastic sheets and is separated from the press platens by sheets of aluminum foil. The following typical pressures and time cycles are used for the compression molding: a) 2000 psi (pounds per square inch) for minutes; b) 50,000 psi for 3 minutes; then c) quench cooling pressure of 50,000 pounds for 10 minutes.
An adhesion plaque sandwich is then made by curing two single plaques under pressure (one shield plaque and one insulation plaque). The MylarTM sheets are removed from the single plaques and any excess is trimmed. The 125 mil trimmed insulation plaque is placed in a 75 mil mold. At least 2 inches on the top edge of the insulation plaque is covered with a strip of MylarTM sheet to prevent adhesion to the shield plaque in a region that will form a "pull-tab." The 30 mil shield plaque is then placed on top of the insulation plaque. The sandwich is separated from the press platens by MylarTM sheets, and placed in the press. The press is then closed and a pressure of 1000 psi is maintained for 4 minutes at 130 degrees C. Then steam is introduced into the press at 190 degrees C (180 psig). A cure cycle of 20,000 psi for 25 minutes (including the time to heat up from 130 degrees C to 190 degrees C) is then effected followed by a quench cooling cycle of 20,000 psi for 15 minutes.
The sandwich is removed from the press, the MylarTM sheets are removed, the excess is trimmed, and the sandwich is cut into five samples (each 1.5 inches wide by 6 inches long). These samples are placed in a climate controlled room at 23 degrees C and 50 percent relative humidity overnight before any further testing.
A one half inch strip is marked in the center of each sample. A
razor is used to cut along each line so that the black material is cut all the way through to the insulation plaque. A stripping test is achieved with the use of a rotating wheel and an InstronTM or similar tensile apparatus. Each sample is mounted to the wheel with the center strip mounted in the jaws of the tensile machine in such a manner that the tensile machine will pull the center strip from the sandwich plaque and the wheel will rotate to maintain the perpendicular configuration of the surface of the plaque to the direction of tensile force. The jaws of the tensile machine shall travel at a linear speed of 20 inches per minute during the test, and should be stopped when one half inch of unpeeled material remains. The Maximum Load and Minimum Load are to be reported from the test, while disregarding the first and last inch stripped. The plaque strip force is equal to the Maximum Load.
Examples 3 and 4 demonstrate the effect of including a TMP
in tree resistant, crosslinked insulation having an ethylene/ vinyl acetate copolymer insulation shield over the insulation. In this case, the vinyl acetate content is 28 percent by weight of the polymer. Without a TMP in the insulation (example 3), the strip force is 13 pounds per 0.5 inch. With a TMP (example 4), the strip force is 8 pounds per 0.5 inch, a 38 percent reduction in strip force.
Examples 5 through 10 demonstrate the effect of including a TMP in tree resistant, crosslinked insulation having an ethylene/ vinyl acetate copolymer insulation shield over the insulation. In this case, the vinyl acetate content is 32 percent by weight of the polymer. The insulation shield also contains various levels of NBR. With no NBR, the reduction in strip force with a TMP containing insulation (example 6) relative to a similar insulation without a TMP (example 5) is insignificant (10 pounds per 0.5 inch versus 11 pounds per 0.5 inch, that is, a 9 percent reduction).
With 5 percent by weight NBR, the reduction with a TMP containing insulation (example 8) relative to a similar insulation without a TMP
(example 7) is a significant 36 percent. With 10 percent by weight NBR, the reduction with a TMP containing insulation (example 10) relative to a similar insulation without a TMP (example 9) is a significant 71 percent.
Examples 11 through 13 demonstrate the effectiveness of the presence of the TMP in tree resistant, crosslinked insulation having a semiconducting ethylene/ vinyl acetate copolymer insulation shield over the insulation. It is noted that the insulation shield remains strippable for insulation shield formulations based upon copolymers of vinyl acetate content lower than that which could be utilized with insulation formulations without the TMP. In this case, the vinyl acetate content is approximately 20 percent by weight. The insulation shield formulation containing 20 percent by weight nitrile rubber is fully bonded to the insulation without TMP, yet strips with a force of between 11 and 12 pounds per one half inch when a small amount of TMP is added to the insulation.
Formulations are prepared and tested as described in United States patent 4,493,787.
Variables and strip force results are set forth in the following Table I.
Table I
(percent by weight) Exam 1e 1 2 3 4 5 Insulat-ion shield EEA 49.10 49.10 ----- ----- -----EVA 1 ----- ----- 47.50 47.50 -----EVA 2 ----- ----- ----- ----- 62.40 NBR 15.00 15.00 15.00 15.00 -----Carbon 32.00 32.00 35.00 35.00 34.00 black Additive 0.80 0.80 0.80 0.80 0.80 Additive 2.00 2.00 ----- ----- 2.00 Additive ----- ----- 1.00 1.00 -----Peroxide 1.1 1.1 0.70 0.70 0.80 Insulat-ion LDPE 97.12 96.87 97.12 96.87 97.12 Additive 0.38 0.38 0.38 0.38 0.38 Additive 0.60 0.60 0.60 0.60 0.60 TMP 1 _____ 0.25 _____ _____ _____ TMP 2 _____ _____ _____ 0.25 _____ Peroxide 1.9 1.9 1.9 1.9 1.9 Plaque bonded 10 13 8 11 strip force (lbs/0.5 ") Table I (continued) (percent by weight) Exam 1e 6 7 8 9 10 Insulat-ion shield EVA 2 62.40 57.40 57.40 52.40 52.40 NBR ----- 5.00 5.00 10.00 10.00 Carbon 34.00 34.00 34.00 34.00 34.00 black Additive 0.80 0.80 0.80 0.80 0.80 Additive 2.00 2.00 2.00 2.00 2.00 Peroxide 0.80 0.80 0.80 0.80 0.80 Insulat-ion LDPE ----- 97.12 ----- 97.12 -----Additive ----- 0.38 ----- 0.38 -----Additive ----- 0.60 ----- 0.60 -----Peroxide ----- 1.9 ----- 1.9 -----AT-320 100.00 ----- 100.00 ----- 100.00 Plaque 10 ' 14 9 14 4 strip force (lbs/0.5 ") Table I (continued) (percent by weight) Example 11 12 13 Insulation shield EVA 3 40.50 40.50 40.50 NBR 20.00 20.00 20.00 Carbon Black 36.00 36.00 36.00 Additive 1 0.80 0.80 0.80 Additive 2 2.00 2.00 2.00 Peroxide 1 0.70 0.70 0.70 Insulation LDPE 97.12 96.97 96.87 Additive 4 0.60 0.60 0.60 Additive 5 0.38 0.38 0.38 TMP 2 0.0 0.15 0.25 Peroxide 2 1.9 1.9 1.9 Plaque Strip ForceBonded 11.6 11.3 (lbs/0.5 ") Notes to Table I:
The EEA is a 20 g/10 min melt index ethylene-ethyl acrylate copolymer containing 35 percent by weight ethyl acrylate.
The EVA 1 is a 43 g/10 min melt index ethylene-vinyl acetate copolymer containing 28 percent by weight vinyl acetate.
The EVA 2 is a 30 g/10 min melt index ethylene-vinyl acetate copolymer containing 33 percent by weight vinyl acetate.
The EVA 3 is a 45 g/10 min melt index ethylene-vinyl acetate copolymer containing 20 percent by weight vinyl acetate.
NBR is an acrylonitrile butadiene copolymer containing 33 percent by weight acrylonitrile.
The carbon black is an N-550 type having a surface area of 43 square meters per gram (BET).
Additive 1 is 4,4'-bis (alpha, alpha-dimethylbenzyl) diphenyl amine.
Additive 2 is N,N' - ethylene bis stearamide.
Additive 3 is KE931U, a silicone rubber available from Shincor.
Peroxide 1 is dicumyl peroxide.
LDPE is a high pressure low density polyethylene having a density of 0.92 g/cc and a melt index of 2.1 g/10 min.
Additive 4 is 4,4'-thiobis (2-tert-butyl-5-methyl-phenol).
Additive 5 is a polyethylene glycol having an average molecular weight before processing of 20,000.
TMP 1 is N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine, polymer with 2,4,6-trichloro-1,3,5-triazine and 2,4,4-trimethyl-1,2-pentanamine, sold as ChimassorbT"' 944 (CAS Registry Number 70624-18-9) by Ciba Specialty Chemicals.
TMP 2 is 1,6-hexanediamine, N, N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-polymer with 2,4,6-trichloro-1,3,5-triazine, reaction products with N-butyl-1-butanamine and N-butyl-2,2,6,6-tetramethyl-4-piperidinamine (CAS number 192268-64-7) available as ChimassorbT"" 2020 from Ciba Specialty Chemicals.
Peroxide 2 is a blend containing 20 percent by weight dicumyl peroxide and 80 percent by weight oc,oc'-bis(tert-butylperoxy)-diisopropylbenzene.
AT-320 is an insulation material described in claim 1 of US
patent 5,719,218, and is available from AT Plastics. It contains 0.3 percent by weight of TMP 1.
Examples 14 to 17 Thermogravimetric weight loss data is provided for copolymer samples run under nitrogen through a 10 degrees C per minute temperature ramp up to a temperature of 400 degrees C. Relative to the ethylene/vinyl acetate copolymer with 33 percent vinyl acetate, thermal stability is improved (for example higher temperature for given weight loss) for the ethylene/ethyl acrylate sample with 25 percent ethyl acrylate. A
reduction in vinyl acetate content also provides more thermally stability and permits higher vulcanization temperatures, and thus faster line speeds for an equivalent degree of cure, where current limitations are imposed to prevent generation of excessive amounts of acetic acid (a decomposition by-product of ethylene/vinyl acetate which is potentially damaging to process equipment). See Table II for variables and results.
Table II
Example 1 2 3 4 Weight Loss (percent by lpercent 2percent 5percent l0percent weight) Temperature in degrees C for above specified weight loss (10 degrees C per minute heating ramp in nitrogen) (33 percent VA) (20 percent VA) EEA 370 382 greater greater (25 percent EA) than 400 Than 400 Notes to Table:
EVA (33 percent VA) is a 30. g/10 min melt index ethylene-vinyl acetate copolymer containing 33 percent by weight vinyl acetate.
EVA (20 percent VA) is a 45 g/10 min melt index ethylene-vinyl acetate copolymer containing 20 percent by weight vinyl acetate.
EEA (25 percent EA) is a 20 g/10 min melt index ethylene-ethyl acrylate copolymer containing 25 percent by weight ethyl acrylate.
D-1238, Condition E. It is measured at 190° C and 2.16 kilograms.
The ester can have 4 to 20 carbon atoms, and preferably has 4 to 7 carbon atoms. Examples of vinyl esters are vinyl acetate, vinyl butyrate, vinyl pivalate, vinyl neononanoate, vinyl neodecanoate, and vinyl 2-ethylhexanoate. Vinyl acetate is preferred. Examples of acrylic and methacrylic acid esters are lauryl methacrylate; myristyl methacrylate;
palmityl methacrylate; stearyl methacrylate; 3-methacryloxy-propyltrimethoxysilane; 3-methacryloxypropyltriethoxysilane; cyclohexyl methacrylate; n-hexylmethacrylate; isodecyl methacrylate; 2-methoxyethyl methacrylate; tetrahydrofurfuryl methacrylate; octyl methacrylate; 2-phenoxyethyl methacrylate; isobornyl methacrylate; isooctylmethacrylate;
octyl methacrylate; isooctyl methacrylate; oleyl methacrylate; ethyl acrylate; methyl acrylate; t-butyl acrylate; n-butyl acrylate; and 2-ethylhexyl acrylate. Methyl acrylate, ethyl acrylate, and n- or t-butyl acrylate are preferred. In the case of alkyl acrylates and methacrylates, the alkyl group can have 1 to 8 carbon atoms, and preferably has 1 to 4 carbon atoms. The alkyl group can be substituted with an oxyalkyltrialkoxysilane, for example, or other various groups.
In order to provide a semiconducting shield it is necessary to incorporate conductive particles into the composition. These conductive particles are generally provided by particulate carbon black, which is referred to above. Useful carbon blacks can have a surface area of 20 to 1000 square meters per gram. The surface area is determined under ASTM
D 4820-93a (Multipoint B.E.T. Nitrogen Adsorption). The carbon black can be used in the semiconducting shield composition in an amount of 15 to 45 percent by weight based on the weight of the insulation shield layer, and is preferably used in an amount of 30 to 40 percent by weight. Both standard conductivity and high conductivity carbon blacks can be used with standard conductivity blacks being preferred.
_g_ Examples of conductive carbon blacks are the grades described by ASTM
N550, N472, N351, N110, and acetylene black.
Component (B)(c) is a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of the copolymer, and is preferably present in the copolymer in an amount of 30 to 35 percent by weight. This copolymer is also known as a nitrile rubber or an acrylonitrile/butadiene copolymer rubber. The density can be, for example, 0.98 gram per cubic centimeter and the Mooney Viscosity measured at 100 degrees C can be (ML 1+4) 50.
The components can be present in the following percentages by weight:
Component Broad Range Preferred Range Insulation layer (A)(a) 90 to 99 96 to 99 (A)(b) 0.005 to 1 0.1 to 0.3 Insulation shield layer (B)(a) 30 to 70 40 to 60 (B)(b) 15 to 45 30 to 40 (B)(c) at least 5 10 to 50 10 to 30.(most preferred) The polymers used in the invention are preferably crosslinked.
This is accomplished in a conventional manner with an organic peroxide or by irradiation, the former being preferred. The amount of organic peroxide used can be in the range of 0.2 to 5 percent by weight of organic peroxide based on the weight of the layer in which it is included, and is preferably in the range of 0.4 to 2 parts by weight. Organic peroxide crosslinking temperatures, as defined by a one minute half life for the peroxide _g_ decomposition, can be in the range of 150 to 250 degrees C and are preferably in the range of 170 to 210 degrees C.
Examples of organic peroxides useful in crosslinking are dicumyl peroxide; lauroyl peroxide; benzoyl peroxide; tertiary butyl perbenzoate; di(tertiary-butyl) peroxide; cumene hydroperoxide; 2,5-dimethyl-2,5-di(t-butyl-peroxy)hexyne-3; 2,5-dimethyl-2,5-di(t-butyl-peroxy)hexane; tertiary butyl hydroperoxide; isopropyl percarbonate; and alpha,alpha'-bis(tertiary-butylperoxy)diisopropylbenzene.
Conventional additives, which can be introduced into the composition, are exemplified by antioxidants, coupling agents, ultraviolet absorbers or stabilizers, antistatic agents, pigments, dyes, nucleating agents, reinforcing fillers or polymer additives, slip agents, plasticizers, processing aids, lubricants, viscosity control agents, tackifiers, anti-blocking agents, surfactants, extender oils, metal deactivators, voltage stabilizers, flame retardant fillers and additives, crosslinking agents, boosters, and catalysts, and smoke suppressants. Additives and fillers can be added in amounts ranging from less than 0.1 to more than 50 percent by weight based on the weight of the layer in which it is included.
Examples of antioxidants are: hindered phenols such as tetrakis[methylene(3,5-di-tert- butyl-4-hydroxyhydro-cinnamate)]methane, bis [(beta-(3,5-ditert-butyl-4-hydroxybenzyl)-methylcarboxyethyl)] sulphide, 4,4'-thiobis(2-methyl-6-tert-butylphenol), 4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), and thiodiethylene bis(3,5-di-tert-butyl-4-hydroxy)hydrocinnamate; phosphites and phosphonites such as tris(2,4-di-tert-butylphenyl)phosphite and di-tert-butylphenyl-phosphonite; thio compounds such as dilaurylthiodipropionate, dimyristylthiodipropionate, and distearylthiodipropionate; various siloxanes; and various amines such as polymerized 2,2,4-trimethyl-1,2-dihydroquinoline, 4,4'-bis(alpha,alpha-demthylbenzyl)diphenylamine, and alkylated diphenylamines. Antioxidants can be used in amounts of 0.1 to 5 percent by weight based on the weight of the layer in which it is included.
Compounding can be effected in a conventional melt/mixer or in a conventional extruder, and these terms are used in this specification interchangeably. Generally, the conductive shield composition is prepared in a melt/mixer and then pelletized using a pelletizer attachment or an extruder adapted for pelletizing. Both the melt/mixer, as the name implies, and the extruder, in effect, have melting and mixing zones although the various sections of each are known to those skilled in the art by different names. The semiconducting shield composition can be prepared in various types of melt/mixers and extruders such as a BrabenderTM mixer, BanburyTM mixer, a roll mill, a BussT"" co-kneader, a biaxial screw kneading extruder, and single or twin screw extruders. A description of a conventional extruder can be found in United States patent 4,857,600. In addition to melt/mixing, the extruder can coat a wire or a core of wires. An example of co-extrusion and an extruder therefor can be found in United States patent 5,575,965. A typical extruder has a hopper at its upstream end and a die at its downstream end. The hopper feeds into a barrel, which contains a screw. At the downstream end, between the end of the screw and the die, is a screen pack and a breaker plate. The screw portion of the extruder is considered to be divided up into three sections, the feed section, the compression section, and the metering section, and two zones, the back heat zone and the front heat zone, the sections and zones running from upstream to downstream. In the alternative, there can be multiple heating zones (more than two) along the axis running from upstream to downstream. If it has more than one barrel, the barrels are connected in series. The length to diameter ratio of each barrel is in the range of 15:1 to 30:1. In wire coating, where the material is crosslinked after extrusion, the die of the crosshead feeds directly into a heating zone in which temperatures can be in the range of 130°C to 260°C.
The advantages of the invention are an insulation shield easily strippable from the insulation; improved pellet handling characteristics; a reduction in CV (continuous vulcanization) line decomposition products; higher throughput rates; and cost reduction..
The term "surrounded" as it applies to a substrate being surrounded by an insulating composition, jacketing material, or other cable layer is considered to include extruding around the substrate; coating the substrate; or wrapping around the substrate as is well known by those skilled in the art. The substrate can include, for example, a core including a conductor or a bundle of conductors, or various underlying cable layers as noted above.
All molecular weights mentioned in this specification are weight average molecular weights unless otherwise designated.
The invention is illustrated by the following examples.
Examples 1 to 10 Examples 1 and 2 demonstrate the effect of including a TMP
in tree resistant, crosslinked insulation having an ethylene/ethyl acrylate copolymer insulation shield over the insulation. In this case, the ethyl acrylate content is 35 percent by weight of the polymer. Without a TMP in the insulation (example 1), the insulation shield is fully bonded to the insulation, and cannot be stripped. With a TMP (example 2), the strip force is 10 pounds per 0.5 inch, which is within the typical range for commercial cables.
Strip force is reported in pounds per 0.5 inch. It is measured as follows:
Single plaques are prepared from insulation shield formulation pellets and insulation layer formulation pellets by compression molding. Prior to compression molding, the pellets are melted on a two roll-mill. An organic peroxide is added if crosslinking is desired. The temperature for compression molding of shield pellets is 110 degrees C.
Approximately 65 grams of shield formulation are used to prepare a 30 mil plaque. The temperature for compression molding of insulation pellets is 130 degrees C. Approximately 135 grams of insulation formulation are used to prepare a 125 mil plaque. The weighed material is sandwiched between two MylarTM plastic sheets and is separated from the press platens by sheets of aluminum foil. The following typical pressures and time cycles are used for the compression molding: a) 2000 psi (pounds per square inch) for minutes; b) 50,000 psi for 3 minutes; then c) quench cooling pressure of 50,000 pounds for 10 minutes.
An adhesion plaque sandwich is then made by curing two single plaques under pressure (one shield plaque and one insulation plaque). The MylarTM sheets are removed from the single plaques and any excess is trimmed. The 125 mil trimmed insulation plaque is placed in a 75 mil mold. At least 2 inches on the top edge of the insulation plaque is covered with a strip of MylarTM sheet to prevent adhesion to the shield plaque in a region that will form a "pull-tab." The 30 mil shield plaque is then placed on top of the insulation plaque. The sandwich is separated from the press platens by MylarTM sheets, and placed in the press. The press is then closed and a pressure of 1000 psi is maintained for 4 minutes at 130 degrees C. Then steam is introduced into the press at 190 degrees C (180 psig). A cure cycle of 20,000 psi for 25 minutes (including the time to heat up from 130 degrees C to 190 degrees C) is then effected followed by a quench cooling cycle of 20,000 psi for 15 minutes.
The sandwich is removed from the press, the MylarTM sheets are removed, the excess is trimmed, and the sandwich is cut into five samples (each 1.5 inches wide by 6 inches long). These samples are placed in a climate controlled room at 23 degrees C and 50 percent relative humidity overnight before any further testing.
A one half inch strip is marked in the center of each sample. A
razor is used to cut along each line so that the black material is cut all the way through to the insulation plaque. A stripping test is achieved with the use of a rotating wheel and an InstronTM or similar tensile apparatus. Each sample is mounted to the wheel with the center strip mounted in the jaws of the tensile machine in such a manner that the tensile machine will pull the center strip from the sandwich plaque and the wheel will rotate to maintain the perpendicular configuration of the surface of the plaque to the direction of tensile force. The jaws of the tensile machine shall travel at a linear speed of 20 inches per minute during the test, and should be stopped when one half inch of unpeeled material remains. The Maximum Load and Minimum Load are to be reported from the test, while disregarding the first and last inch stripped. The plaque strip force is equal to the Maximum Load.
Examples 3 and 4 demonstrate the effect of including a TMP
in tree resistant, crosslinked insulation having an ethylene/ vinyl acetate copolymer insulation shield over the insulation. In this case, the vinyl acetate content is 28 percent by weight of the polymer. Without a TMP in the insulation (example 3), the strip force is 13 pounds per 0.5 inch. With a TMP (example 4), the strip force is 8 pounds per 0.5 inch, a 38 percent reduction in strip force.
Examples 5 through 10 demonstrate the effect of including a TMP in tree resistant, crosslinked insulation having an ethylene/ vinyl acetate copolymer insulation shield over the insulation. In this case, the vinyl acetate content is 32 percent by weight of the polymer. The insulation shield also contains various levels of NBR. With no NBR, the reduction in strip force with a TMP containing insulation (example 6) relative to a similar insulation without a TMP (example 5) is insignificant (10 pounds per 0.5 inch versus 11 pounds per 0.5 inch, that is, a 9 percent reduction).
With 5 percent by weight NBR, the reduction with a TMP containing insulation (example 8) relative to a similar insulation without a TMP
(example 7) is a significant 36 percent. With 10 percent by weight NBR, the reduction with a TMP containing insulation (example 10) relative to a similar insulation without a TMP (example 9) is a significant 71 percent.
Examples 11 through 13 demonstrate the effectiveness of the presence of the TMP in tree resistant, crosslinked insulation having a semiconducting ethylene/ vinyl acetate copolymer insulation shield over the insulation. It is noted that the insulation shield remains strippable for insulation shield formulations based upon copolymers of vinyl acetate content lower than that which could be utilized with insulation formulations without the TMP. In this case, the vinyl acetate content is approximately 20 percent by weight. The insulation shield formulation containing 20 percent by weight nitrile rubber is fully bonded to the insulation without TMP, yet strips with a force of between 11 and 12 pounds per one half inch when a small amount of TMP is added to the insulation.
Formulations are prepared and tested as described in United States patent 4,493,787.
Variables and strip force results are set forth in the following Table I.
Table I
(percent by weight) Exam 1e 1 2 3 4 5 Insulat-ion shield EEA 49.10 49.10 ----- ----- -----EVA 1 ----- ----- 47.50 47.50 -----EVA 2 ----- ----- ----- ----- 62.40 NBR 15.00 15.00 15.00 15.00 -----Carbon 32.00 32.00 35.00 35.00 34.00 black Additive 0.80 0.80 0.80 0.80 0.80 Additive 2.00 2.00 ----- ----- 2.00 Additive ----- ----- 1.00 1.00 -----Peroxide 1.1 1.1 0.70 0.70 0.80 Insulat-ion LDPE 97.12 96.87 97.12 96.87 97.12 Additive 0.38 0.38 0.38 0.38 0.38 Additive 0.60 0.60 0.60 0.60 0.60 TMP 1 _____ 0.25 _____ _____ _____ TMP 2 _____ _____ _____ 0.25 _____ Peroxide 1.9 1.9 1.9 1.9 1.9 Plaque bonded 10 13 8 11 strip force (lbs/0.5 ") Table I (continued) (percent by weight) Exam 1e 6 7 8 9 10 Insulat-ion shield EVA 2 62.40 57.40 57.40 52.40 52.40 NBR ----- 5.00 5.00 10.00 10.00 Carbon 34.00 34.00 34.00 34.00 34.00 black Additive 0.80 0.80 0.80 0.80 0.80 Additive 2.00 2.00 2.00 2.00 2.00 Peroxide 0.80 0.80 0.80 0.80 0.80 Insulat-ion LDPE ----- 97.12 ----- 97.12 -----Additive ----- 0.38 ----- 0.38 -----Additive ----- 0.60 ----- 0.60 -----Peroxide ----- 1.9 ----- 1.9 -----AT-320 100.00 ----- 100.00 ----- 100.00 Plaque 10 ' 14 9 14 4 strip force (lbs/0.5 ") Table I (continued) (percent by weight) Example 11 12 13 Insulation shield EVA 3 40.50 40.50 40.50 NBR 20.00 20.00 20.00 Carbon Black 36.00 36.00 36.00 Additive 1 0.80 0.80 0.80 Additive 2 2.00 2.00 2.00 Peroxide 1 0.70 0.70 0.70 Insulation LDPE 97.12 96.97 96.87 Additive 4 0.60 0.60 0.60 Additive 5 0.38 0.38 0.38 TMP 2 0.0 0.15 0.25 Peroxide 2 1.9 1.9 1.9 Plaque Strip ForceBonded 11.6 11.3 (lbs/0.5 ") Notes to Table I:
The EEA is a 20 g/10 min melt index ethylene-ethyl acrylate copolymer containing 35 percent by weight ethyl acrylate.
The EVA 1 is a 43 g/10 min melt index ethylene-vinyl acetate copolymer containing 28 percent by weight vinyl acetate.
The EVA 2 is a 30 g/10 min melt index ethylene-vinyl acetate copolymer containing 33 percent by weight vinyl acetate.
The EVA 3 is a 45 g/10 min melt index ethylene-vinyl acetate copolymer containing 20 percent by weight vinyl acetate.
NBR is an acrylonitrile butadiene copolymer containing 33 percent by weight acrylonitrile.
The carbon black is an N-550 type having a surface area of 43 square meters per gram (BET).
Additive 1 is 4,4'-bis (alpha, alpha-dimethylbenzyl) diphenyl amine.
Additive 2 is N,N' - ethylene bis stearamide.
Additive 3 is KE931U, a silicone rubber available from Shincor.
Peroxide 1 is dicumyl peroxide.
LDPE is a high pressure low density polyethylene having a density of 0.92 g/cc and a melt index of 2.1 g/10 min.
Additive 4 is 4,4'-thiobis (2-tert-butyl-5-methyl-phenol).
Additive 5 is a polyethylene glycol having an average molecular weight before processing of 20,000.
TMP 1 is N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine, polymer with 2,4,6-trichloro-1,3,5-triazine and 2,4,4-trimethyl-1,2-pentanamine, sold as ChimassorbT"' 944 (CAS Registry Number 70624-18-9) by Ciba Specialty Chemicals.
TMP 2 is 1,6-hexanediamine, N, N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-polymer with 2,4,6-trichloro-1,3,5-triazine, reaction products with N-butyl-1-butanamine and N-butyl-2,2,6,6-tetramethyl-4-piperidinamine (CAS number 192268-64-7) available as ChimassorbT"" 2020 from Ciba Specialty Chemicals.
Peroxide 2 is a blend containing 20 percent by weight dicumyl peroxide and 80 percent by weight oc,oc'-bis(tert-butylperoxy)-diisopropylbenzene.
AT-320 is an insulation material described in claim 1 of US
patent 5,719,218, and is available from AT Plastics. It contains 0.3 percent by weight of TMP 1.
Examples 14 to 17 Thermogravimetric weight loss data is provided for copolymer samples run under nitrogen through a 10 degrees C per minute temperature ramp up to a temperature of 400 degrees C. Relative to the ethylene/vinyl acetate copolymer with 33 percent vinyl acetate, thermal stability is improved (for example higher temperature for given weight loss) for the ethylene/ethyl acrylate sample with 25 percent ethyl acrylate. A
reduction in vinyl acetate content also provides more thermally stability and permits higher vulcanization temperatures, and thus faster line speeds for an equivalent degree of cure, where current limitations are imposed to prevent generation of excessive amounts of acetic acid (a decomposition by-product of ethylene/vinyl acetate which is potentially damaging to process equipment). See Table II for variables and results.
Table II
Example 1 2 3 4 Weight Loss (percent by lpercent 2percent 5percent l0percent weight) Temperature in degrees C for above specified weight loss (10 degrees C per minute heating ramp in nitrogen) (33 percent VA) (20 percent VA) EEA 370 382 greater greater (25 percent EA) than 400 Than 400 Notes to Table:
EVA (33 percent VA) is a 30. g/10 min melt index ethylene-vinyl acetate copolymer containing 33 percent by weight vinyl acetate.
EVA (20 percent VA) is a 45 g/10 min melt index ethylene-vinyl acetate copolymer containing 20 percent by weight vinyl acetate.
EEA (25 percent EA) is a 20 g/10 min melt index ethylene-ethyl acrylate copolymer containing 25 percent by weight ethyl acrylate.
Claims (11)
1. A cable comprising an electrical conductor or a core of electrical conductors surrounded by (A) an insulation layer, which is surrounded by, and contiguous with, (B) an insulation shield layer, the (A) insulation layer comprising:
(a) a polymer selected from the group consisting of polyethylene, ethylene/propylene copolymer rubber, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.005 to 1 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms; and the (B) insulation shield layer comprising:
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl esters, acrylic acid esters, and methacrylic acid esters wherein the vinyl ester is present in the copolymer in an amount of 10 to 28 percent by weight based on the weight of the copolymer and the acrylic acid esters and methacrylic acid esters are present in an amount of 10 to 50 percent by weight based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) at least 5 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
(a) a polymer selected from the group consisting of polyethylene, ethylene/propylene copolymer rubber, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.005 to 1 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine containing one or more of the group wherein R is hydrogen, or an alkoxy or an alkyl, each having 1 to 50 carbon atoms; and the (B) insulation shield layer comprising:
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl esters, acrylic acid esters, and methacrylic acid esters wherein the vinyl ester is present in the copolymer in an amount of 10 to 28 percent by weight based on the weight of the copolymer and the acrylic acid esters and methacrylic acid esters are present in an amount of 10 to 50 percent by weight based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) at least 5 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
2. The cable defined in claim 1 wherein components (A)(a) and (B)(a) are crosslinked.
3. The cable defined in claim 2 wherein component (B)(a) is either vinyl acetate or ethyl acrylate.
4. The cable defined in claim 3 wherein the vinyl acetate is present in the copolymer in an amount of 15 to 28 percent by weight.
5. The cable defined in claim 1 wherein component (A)(a) is a high pressure homopolymer of ethylene having a density in the range of 0.910 to 0.930 gram per cubic centimeter and a melt index in the range of 1 to 5 grams per 10 minutes.
6. The cable defined in claim 1 wherein component (A)(a) is an ethylene/propylene/diene terpolymer rubber.
7. The cable defined in claim 1 wherein component (A)(b) is present in an amount of 0.1 to 0.3 percent by weight.
8. The cable defined in claim 1 wherein, in component (A)(b), R
is hydrogen, methoxy, or methyl.
is hydrogen, methoxy, or methyl.
9. The cable defined in claim 1 wherein component (B)(c) is present in an amount of 10 to 30 percent.
10. A cable comprising an electrical conductor or a core of electrical conductors surrounded by (A) an insulation layer, which is surrounded by, and contiguous with, (B) an insulation shield layer, the (A) insulation layer comprising:
(a) a polymer selected from the group consisting of a high pressure homopolymer of ethylene, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.1 to 0.3 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine derivative containing one or more of the group wherein R is hydrogen, methoxy , or methyl; and the (B) insulation shield layer comprising:
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl acetate or ethyl acrylate wherein the vinyl acetate is present in the copolymer in an amount of 15 to 28 percent by weight and the ethyl acrylate is present in an amount of 20 to 40 percent by weight, both based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) 10 to 30 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
(a) a polymer selected from the group consisting of a high pressure homopolymer of ethylene, ethylene/propylene/diene terpolymer rubber, and mixtures thereof, and, based on the weight of the insulation layer, (b) 0.1 to 0.3 percent by weight of a 4-substituted 2,2,6,6-tetramethylepiperidine derivative containing one or more of the group wherein R is hydrogen, methoxy , or methyl; and the (B) insulation shield layer comprising:
(a) a copolymer of ethylene and an unsaturated ester selected from the group consisting of vinyl acetate or ethyl acrylate wherein the vinyl acetate is present in the copolymer in an amount of 15 to 28 percent by weight and the ethyl acrylate is present in an amount of 20 to 40 percent by weight, both based on the weight of component (B)(a);
(b) a conductive carbon black; and, based on the weight of the insulation shield layer, (c) 10 to 30 percent by weight of a copolymer of acrylonitrile and butadiene wherein the acrylonitrile is present in the copolymer in an amount of 25 to 55 percent by weight based on the weight of component (B)(c).
11. The cable defined in claim 10 wherein component (A)(b) is (i) N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexanediamine, polymer with 2,4,6-trichloro-1,3,5-triazine and 2,4,4-trimethyl-1,2-pentanamine or (ii) 1,6-hexanediamine, N, N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-polymer with 2,4,6-trichloro-1,3,5-triazine, reaction products with N-butyl-1-butanamine and N-butyl-2,2,6,6-tetramethyl-4-piperidinamine.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/680,180 | 2000-10-05 | ||
| US09/680,180 US6858296B1 (en) | 2000-10-05 | 2000-10-05 | Power cable |
| PCT/US2001/030739 WO2002029829A1 (en) | 2000-10-05 | 2001-10-02 | Power cable |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2427259A1 CA2427259A1 (en) | 2002-04-11 |
| CA2427259C true CA2427259C (en) | 2009-03-31 |
Family
ID=24730031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002427259A Expired - Lifetime CA2427259C (en) | 2000-10-05 | 2001-10-02 | Power cable |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6858296B1 (en) |
| EP (1) | EP1342247B1 (en) |
| AU (1) | AU2001296461A1 (en) |
| CA (1) | CA2427259C (en) |
| DE (1) | DE60119159T2 (en) |
| WO (1) | WO2002029829A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005017014A1 (en) | 2003-06-09 | 2005-02-24 | Union Carbide Chemicals & Plastics Technology Corporation | Strippable semi-conductive insulation shield |
| EP2410010B1 (en) * | 2005-10-25 | 2019-03-13 | General Cable Technologies Corporation | Improved lead-free insulation compositions containing metallocene polymers |
| BRPI0621784A2 (en) * | 2006-06-26 | 2011-12-20 | Prysmian Power Cables And Systems Usa Llc | electric power cable, and, method for producing an electric power cable |
| EP1881508B1 (en) * | 2006-07-10 | 2010-01-20 | Borealis Technology Oy | Cable layer on polypropylene basis with high electrical breakdown strength |
| CA2919737C (en) * | 2007-08-06 | 2018-03-13 | General Cable Technologies Corp. | Tree resistant insulation compositions |
| KR101732756B1 (en) * | 2009-12-21 | 2017-05-04 | 유니온 카바이드 케미칼즈 앤드 플라스틱스 테크날러지 엘엘씨 | Medium voltage cable insulation |
| US20110162867A1 (en) * | 2010-01-07 | 2011-07-07 | Hanwha Chemical Corporation | Telephone cable insulation composition, and telephone cable using thereof |
| MX2012014006A (en) * | 2010-06-03 | 2013-01-24 | Dow Global Technologies Llc | Strippable insulation shield for cables. |
| WO2012050792A1 (en) * | 2010-09-30 | 2012-04-19 | Union Carbide Chemicals & Plastics Technology Llc | Coated conductor with voltage stabilized inner layer |
| KR20140007908A (en) | 2011-03-29 | 2014-01-20 | 유니온 카바이드 케미칼즈 앤드 플라스틱스 테크날러지 엘엘씨 | Semiconductive shield composition with improved strippability |
| US11011283B2 (en) * | 2013-03-15 | 2021-05-18 | General Cable Technologies Corporation | Easy clean cable |
| US10501645B2 (en) | 2015-10-07 | 2019-12-10 | Union Carbide Chemicals & Plastics Technology | Semiconductive shield composition |
| BR112019012297B1 (en) * | 2016-12-21 | 2023-11-28 | Dow Global Technologies Llc | Peroxide-curable semiconductor composition, method for making a peroxide-curable semiconductor composition, peroxide-curable semiconductor product, article of manufacture and coated conductor |
| EP3401929A1 (en) * | 2017-05-09 | 2018-11-14 | Borealis AG | Cable insulation |
| WO2019210040A1 (en) * | 2018-04-26 | 2019-10-31 | Dow Global Technologies Llc | Polyolefin additive formulations |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4286023A (en) | 1976-10-04 | 1981-08-25 | Union Carbide Corporation | Article of manufacture, the cross-linked product of a semi-conductive composition bonded to a crosslinked polyolefin substrate |
| JPS5662846A (en) | 1979-10-29 | 1981-05-29 | Mitsubishi Petrochem Co Ltd | Semiconductive resin composition |
| JPS5861501A (en) | 1981-10-08 | 1983-04-12 | 日本ユニカー株式会社 | Semiconductive material combining adhesivity and peelability |
| DE69015302T2 (en) | 1989-09-29 | 1995-05-18 | Union Carbide Chem Plastic | Insulated electrical conductors. |
| US5453322A (en) * | 1994-06-03 | 1995-09-26 | Union Carbide Chemicals & Plastics Technology Corporation | Telephone cables |
| US5719218A (en) | 1995-06-01 | 1998-02-17 | At Plastics Inc. | Water resistant electrical insulation compositions |
| US5766761A (en) * | 1996-12-11 | 1998-06-16 | Union Carbide Chemicals & Plastics Technology Corporation | Telephone cables |
| US5807635A (en) | 1997-01-24 | 1998-09-15 | Union Carbide Chemicals & Plastics Technology Corporation | Telephone cables |
| SE9703798D0 (en) | 1997-10-20 | 1997-10-20 | Borealis As | Electric cable and a method of composition for the production thereof |
| SE9703844D0 (en) | 1997-10-22 | 1997-10-22 | Borealis As | Composition for electric cables |
| US6013202A (en) | 1998-07-29 | 2000-01-11 | Bicc General Uk Cables Limited | Compositions of matter and electric cables |
| JP4215356B2 (en) * | 1999-10-14 | 2009-01-28 | 日本ユニカー株式会社 | Water-crosslinked polyolefin resin composition, method for producing the same, silane blend used therein, and molded product of the resin composition |
-
2000
- 2000-10-05 US US09/680,180 patent/US6858296B1/en not_active Expired - Lifetime
-
2001
- 2001-10-02 WO PCT/US2001/030739 patent/WO2002029829A1/en active IP Right Grant
- 2001-10-02 CA CA002427259A patent/CA2427259C/en not_active Expired - Lifetime
- 2001-10-02 AU AU2001296461A patent/AU2001296461A1/en not_active Abandoned
- 2001-10-02 DE DE60119159T patent/DE60119159T2/en not_active Expired - Lifetime
- 2001-10-02 EP EP01977335A patent/EP1342247B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1342247B1 (en) | 2006-04-26 |
| US6858296B1 (en) | 2005-02-22 |
| DE60119159T2 (en) | 2007-05-10 |
| AU2001296461A1 (en) | 2002-04-15 |
| DE60119159D1 (en) | 2006-06-01 |
| EP1342247A1 (en) | 2003-09-10 |
| WO2002029829A1 (en) | 2002-04-11 |
| CA2427259A1 (en) | 2002-04-11 |
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