CA2417852A1 - A plating method and apparatus - Google Patents
A plating method and apparatus Download PDFInfo
- Publication number
- CA2417852A1 CA2417852A1 CA002417852A CA2417852A CA2417852A1 CA 2417852 A1 CA2417852 A1 CA 2417852A1 CA 002417852 A CA002417852 A CA 002417852A CA 2417852 A CA2417852 A CA 2417852A CA 2417852 A1 CA2417852 A1 CA 2417852A1
- Authority
- CA
- Canada
- Prior art keywords
- basin
- plating
- pipe
- tool
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A plating method and apparatus, in which the object (7) to be coated is immersed in a bath (2) in a basin (1). A plating tool (5) is kept permanently in the basin (1), in the vicinity of a pipe or duct (3) passing through the basin, and the object (7) to be coated is not placed in conjunction with the tool (5) until inside the bath (2). In electrolytic plating, a current is supplied to the anodes (5) by means of a conductor rail (4), which is located in the pipe (3) in the basin, which the electrolytic liquid (2) surrounds and which extends above the liquid surface. The object (7) to be coated is immersed in the basin (1) by means of a suspender (8) supported on the upper end of the pipe (3).
Claims (10)
1. A plating method, in which the object (7) to be coated is immersed in a bath (2) in a basin (1), a plating tool (5) is kept permanently in the basin (2) and the object (7) to be coated is not placed in conjunction with the tool (5) until inside the bath (2), characterised in that the plating tool (5) is kept in conjunction with a pipe or duct (3) passed through the basin, and that electric current and/or chemicals are supplied to the plating tool (5) through the said pipe or duct (3).
2. A method as claimed in claim 1 for electrolytic plating, characterised in that the plating tool, which comprises anodes (5), is kept permanently in the basin, that a current is conveyed to the anodes (5) by means of a conductor rail (4) located in the pipe (3) in the basin, which is surrounded by electrolytic liquid (2) and extends above the liquid surface.
3. A method as claimed in claim 1 or 2, characterised in that the object (7) to be coated is immersed in the basin (1) by means of a suspender (8) supported on the upper end of the pipe (3).
4. A plating apparatus, which comprises a plating basin (1) containing a liquid bath (2) and a plating tool (5) immersed in the liquid bath (2), the said tool being permanently in the basin, characterised in that in the basin is a pipe (3) surrounded by the liquid bath (2), in conjunction with which the plating tool (5) is arranged and which comprises means (4) for supplying electricity or chemicals to the plating tool (5).
5. An apparatus as claimed in claim 4 for electrolytic plating, characterised in that the plating tool comprises anodes (5) to which a current is supplied by means of a conductor rail (4) located in the pipe (3) in the basin (1),
6 which the electrolytic liquid (2) surrounds and which extends above the liquid surface.
6. An apparatus as claimed in claim 4 or 5, characterised in that one or more vertical pipes (3) pass through the bottom of the basin (1).
6. An apparatus as claimed in claim 4 or 5, characterised in that one or more vertical pipes (3) pass through the bottom of the basin (1).
7. An apparatus as claimed in any of the claims 4 to 6, characterised in that the object (7) to be coated can be immersed in the basin (1) by means of a suspender (8) supported on the upper end of the pipe (3).
8. An apparatus as claimed in any of the claims 4 to 6, characterised in that the anode plates (S) comprised in the plating tools are arranged in a circle surrounding the pipe (3) and the arrangement is used for the internal plating of tubular objects of the processing industry.
9. An apparatus as claimed in any of the claims 4 to 8, characterised in that one or more pipes (3) surrounded by a liquid bath (2) are located symmetrically in the basin (1).
10. The use of the method according to any of the claims 1 to 3 or of the apparatus according to any of the claims 4 to 8 for plating objects with a chromium coating.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20020261A FI114811B (en) | 2002-02-08 | 2002-02-08 | A coating method and a coating device |
FI20020261 | 2002-02-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2417852A1 true CA2417852A1 (en) | 2003-08-08 |
CA2417852C CA2417852C (en) | 2012-01-10 |
Family
ID=8563138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2417852A Expired - Fee Related CA2417852C (en) | 2002-02-08 | 2003-01-30 | A plating method and apparatus |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1347081B1 (en) |
AT (1) | ATE553233T1 (en) |
CA (1) | CA2417852C (en) |
FI (1) | FI114811B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105887175A (en) * | 2016-06-27 | 2016-08-24 | 无锡瑾宸表面处理有限公司 | Plating tank with sidewall-fitted stirrer |
CN108441931B (en) * | 2018-05-03 | 2020-05-08 | 台山永发五金制品有限公司 | Clamping device for electroplating pipe fitting |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2462490A1 (en) * | 1979-08-03 | 1981-02-13 | Centre Techn Ind Mecanique | ELECTROLYTIC COATING DEVICE |
US4853099A (en) * | 1988-03-28 | 1989-08-01 | Sifco Industries, Inc. | Selective electroplating apparatus |
US5985123A (en) * | 1997-07-09 | 1999-11-16 | Koon; Kam Kwan | Continuous vertical plating system and method of plating |
-
2002
- 2002-02-08 FI FI20020261A patent/FI114811B/en not_active IP Right Cessation
-
2003
- 2003-01-30 CA CA2417852A patent/CA2417852C/en not_active Expired - Fee Related
- 2003-02-05 AT AT03100234T patent/ATE553233T1/en active
- 2003-02-05 EP EP03100234A patent/EP1347081B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1347081A1 (en) | 2003-09-24 |
FI114811B (en) | 2004-12-31 |
FI20020261A0 (en) | 2002-02-08 |
FI20020261A (en) | 2003-08-09 |
ATE553233T1 (en) | 2012-04-15 |
EP1347081B1 (en) | 2012-04-11 |
CA2417852C (en) | 2012-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20150130 |