CA2334524C - Electronic apparatus provided with an electronic circuit substrate having high heat dissipation - Google Patents
Electronic apparatus provided with an electronic circuit substrate having high heat dissipation Download PDFInfo
- Publication number
- CA2334524C CA2334524C CA002334524A CA2334524A CA2334524C CA 2334524 C CA2334524 C CA 2334524C CA 002334524 A CA002334524 A CA 002334524A CA 2334524 A CA2334524 A CA 2334524A CA 2334524 C CA2334524 C CA 2334524C
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- Prior art keywords
- circuit substrate
- electronic circuit
- electronic
- case
- heat generating
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides an electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics, and which comprises: an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern at an internal layer thereof, a plurality of through holes provided directly below a mounting portion of a heat generating component and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of the rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure space between the case and the rear surface of the electronic circuit substrate to enable mounting of low heat generating electrical/electronic components.
Description
DESCRIPTION
ELECTRONIC APPARATUS PROVIDED WITH AN ELECTRONIC
CIRCUIT SUBSTRATE HAVING HIGH HEAT DISSIPATION
BACKGROUND OF THE INVENTION
1. Field of the Invention [0001] The present invention relates to an electronic apparatus provided with an electronic circuit substrate, and in particular to a small electronic apparatus provided with an small electronic circuit substrate on which a heat generating component is mounted. Moreover, as an example of such a electronic apparatus provided with a small electronic circuit substrate an optical transceiver, which converts optical signals to electrical signals and transmits data, and the like may be given.
ELECTRONIC APPARATUS PROVIDED WITH AN ELECTRONIC
CIRCUIT SUBSTRATE HAVING HIGH HEAT DISSIPATION
BACKGROUND OF THE INVENTION
1. Field of the Invention [0001] The present invention relates to an electronic apparatus provided with an electronic circuit substrate, and in particular to a small electronic apparatus provided with an small electronic circuit substrate on which a heat generating component is mounted. Moreover, as an example of such a electronic apparatus provided with a small electronic circuit substrate an optical transceiver, which converts optical signals to electrical signals and transmits data, and the like may be given.
2. Description of the Related Art [0002] In recent years, with miniaturization of electronic components and developments in high density integration technology, the size of optical transceivers, which are representative of electronic apparatuses provided with an electronic circuit substrate, has been decreasing at a rapid pace, and increases in the density of generated heat accompanying this reduction in size of electronic apparatuses provided with an electronic circuit substrate is beginning to be viewed as a problem.
Furthermore, since electronic components are highly integrated, there is a tendency for the heat distribution inside electronic apparatuses provided with an electronic circuit substrate to concentrate in certain locations, and it is expected that this trend will strengthen further in the future. In consideration of the fact that size reductions in such electronic apparatuses provided with an electronic circuit substrate will lead to further increases in the density of generated heat and further concentration of the heat distribution, there is a need for development of an electronic apparatus provided with an electronic circuit substrate with improved heat dissipating characteristics.
Furthermore, since electronic components are highly integrated, there is a tendency for the heat distribution inside electronic apparatuses provided with an electronic circuit substrate to concentrate in certain locations, and it is expected that this trend will strengthen further in the future. In consideration of the fact that size reductions in such electronic apparatuses provided with an electronic circuit substrate will lead to further increases in the density of generated heat and further concentration of the heat distribution, there is a need for development of an electronic apparatus provided with an electronic circuit substrate with improved heat dissipating characteristics.
[0003) When heat dissipation is carried out in an electronic apparatus provided with an electronic circuit substrate in which the density of generated heat increases and there is a concentration of the heat distribution, such as above, a ceramic substrate having good thermal conductivity and electrical characteristics has generally been employed as the substrate material, a:nd the substrate is mounted by coating an adhesive and the like on the entire rear surface thereof and contacting to a case.
[0004] A construction of such a conventional electronic apparatus provided with an electronic circuit substrate is shown, for example, in FIG.
5.
In FIG. 5, a heat generating component 1 is a heat producing electronic component such as a power transistor, an electronic circuit substrate 2 constructed from a ceramic substrate mounts this heat generating component 1 on a surface thereof and a case 3 houses and protects the electronic circuit substrate 2, the case 3 being open at the upper side thereof so that the electronic circuit substrate 2 may be removed. An adhesive 4 fixes the electronic circuit substrate to the case 3 and a cover 5 covers the aforementioned opening.
[0005] In a conventional electronic apparatus provided with an electronic circuit substrai;e constructed as above, heat generated by the heat generating component 1 is diffused in the entire electronic circuit substrate comprising a ceramic substrate with good thermal conductivity and the diffused heat is transferred to the case 3 via the adhesive 4. The case 3 functions as a radiator to dissipate the heat transferred thereto to the outside.
In this case, by using a ceramic substrate with good thermal conductivity as the electronic circuit substrate 2, the heat generated by the heat generating component is diffused through the entire substrate and since the diffused heat is transferred from the entire rear surface of electronic circuit substrate 2 contacting the case 3 to the case 3 which combines the effect of a radiator, heat is eftciently dissipated.
In FIG. 5, a heat generating component 1 is a heat producing electronic component such as a power transistor, an electronic circuit substrate 2 constructed from a ceramic substrate mounts this heat generating component 1 on a surface thereof and a case 3 houses and protects the electronic circuit substrate 2, the case 3 being open at the upper side thereof so that the electronic circuit substrate 2 may be removed. An adhesive 4 fixes the electronic circuit substrate to the case 3 and a cover 5 covers the aforementioned opening.
[0005] In a conventional electronic apparatus provided with an electronic circuit substrai;e constructed as above, heat generated by the heat generating component 1 is diffused in the entire electronic circuit substrate comprising a ceramic substrate with good thermal conductivity and the diffused heat is transferred to the case 3 via the adhesive 4. The case 3 functions as a radiator to dissipate the heat transferred thereto to the outside.
In this case, by using a ceramic substrate with good thermal conductivity as the electronic circuit substrate 2, the heat generated by the heat generating component is diffused through the entire substrate and since the diffused heat is transferred from the entire rear surface of electronic circuit substrate 2 contacting the case 3 to the case 3 which combines the effect of a radiator, heat is eftciently dissipated.
[0006] Nevertheless, in the electronic apparatus provided with an electronic circuit substr;~te constructed as above, a ceramic substrate is employed as the material of the electronic circuit substrate 2, and since the entire rear surface of the electronic circuit substrate 2 must be mounted so as to contact the case 3, there is a problem in that packaging density is reduced.
Namely, when mounting a heat generating component 1 in an electronic apparatus provided with a small electronic circuit substrate, as stated above, ceramic material having good thermal conductivity is generally employed because it is necessary to dissipate heat and the electronic circuit substrate is provided such that the entire rear surface thereof contacts with the case 3.
Thus, electrical/electronic components are not normally mounted to the rear surface of the electronic: circuit substrate 2. Moreover, assuming that packaging density is regarded as being important so that electrical/electronic components are also mounted on the rear surface of the electronic circuit substrate 2, since the electronic circuit substrate 2 is installed so as to be floating from the case 3, it is conceivable that, as ceramic does not have sufficient strength to withstand operating environment, such vibrations, shocks, etc. cracks and the like will develop in the ceramic substrate. Thus, conventionally, mounting of electricallelectronic components has been limited to one side of the electronic circuit substrate 2 and there has been a problem in that component packaging density has been reduced by hal~
Moreover, there .is also a problem in that the cost of the product increases because expensive ceramic must be used as the material of the electronic circuit substrate 2.
SUMMARY OF THE INVENTION
Namely, when mounting a heat generating component 1 in an electronic apparatus provided with a small electronic circuit substrate, as stated above, ceramic material having good thermal conductivity is generally employed because it is necessary to dissipate heat and the electronic circuit substrate is provided such that the entire rear surface thereof contacts with the case 3.
Thus, electrical/electronic components are not normally mounted to the rear surface of the electronic: circuit substrate 2. Moreover, assuming that packaging density is regarded as being important so that electrical/electronic components are also mounted on the rear surface of the electronic circuit substrate 2, since the electronic circuit substrate 2 is installed so as to be floating from the case 3, it is conceivable that, as ceramic does not have sufficient strength to withstand operating environment, such vibrations, shocks, etc. cracks and the like will develop in the ceramic substrate. Thus, conventionally, mounting of electricallelectronic components has been limited to one side of the electronic circuit substrate 2 and there has been a problem in that component packaging density has been reduced by hal~
Moreover, there .is also a problem in that the cost of the product increases because expensive ceramic must be used as the material of the electronic circuit substrate 2.
SUMMARY OF THE INVENTION
[0007] The present invention aims to solve the above problems with the conventional art and the object of the present invention is to provide an electronic apparatus provided with an electronic circuit substrate which is inexpensive, with high packaging density and superior heat dissipating characteristics and reliability.
[0008] In order t;o achieve the above objects, according to one aspect of the present invention there is provided an electronic apparatus provided with an electronic circuit substrate comprising:
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where a heat generating component is mounted and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of a rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components.
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where a heat generating component is mounted and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of a rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components.
[0009] Accorcling; to another aspect of the present invention there is provided an electronic apparatus provided with an electronic circuit substrate comprising:
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pati;ern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where a heat generating component is mounted and which are not connected to the grounding pattern, and opposing insulating grooves formed in a front and rear surface of the electronic circuit substrate so as to surround the heat generating component, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of the rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components.
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pati;ern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where a heat generating component is mounted and which are not connected to the grounding pattern, and opposing insulating grooves formed in a front and rear surface of the electronic circuit substrate so as to surround the heat generating component, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of the rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components.
[0010] According to the present invention there is provided an electronic apparatus pro~~ided with an electronic circuit substrate wherein:
a filler of a material with high thermal conductivity is filled in the plurality of through holes, and a heat dissipating grease intervenes at a contact portion between an area where the through holes of the electronic circuit substrate rear surface are disposed and the heat dissipating protruding surface portion of the case.
a filler of a material with high thermal conductivity is filled in the plurality of through holes, and a heat dissipating grease intervenes at a contact portion between an area where the through holes of the electronic circuit substrate rear surface are disposed and the heat dissipating protruding surface portion of the case.
[0011] Moreover, in the present invention the heat generating component is an electrical/electronic component which generates a large amount of heat, such as a power transistor and the like, and the low heat generating electricahel.ectronic components are electrical/electronic components in which the amount of generated heat is smaller than in the heat generating component.
BRIEF DIESCRIPTION OF THE DRAWINGS
BRIEF DIESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 i:> a schematic structural diagram of an electronic apparatus provided wii;h an electronic circuit substrate according to Embodiment 1 of the present invention.
FIG. 2 is a schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 2 of the present invention.
FIG. 3 is a schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 3 of the present invention.
FIG. 4 is a plan view of the electronic circuit substrate described in FIG. 3.
FIG. 5 is a schematic structural diagram showing an example of a conventional electronic apparatus provided with an electronic circuit substrate.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiment 1 [0013] Embodiment 1 of the present invention will be described with reference to FIG. 1. FICA. 1 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate and portions similar to those in the conventional example will be denoted by similar reference numerals and the repeat description thereof will be omitted.
FIG. 2 is a schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 2 of the present invention.
FIG. 3 is a schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 3 of the present invention.
FIG. 4 is a plan view of the electronic circuit substrate described in FIG. 3.
FIG. 5 is a schematic structural diagram showing an example of a conventional electronic apparatus provided with an electronic circuit substrate.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiment 1 [0013] Embodiment 1 of the present invention will be described with reference to FIG. 1. FICA. 1 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate and portions similar to those in the conventional example will be denoted by similar reference numerals and the repeat description thereof will be omitted.
[0014] In FIG. l, an electronic circuit substrate 6 comprises a resin wiring substrate with a wiring pattern 7 and a grounding pattern 8 formed in internal layers of the electronic circuit substrate 6. A plurality of through holes 9 are provided directly below a portion where a heat generating component 1 is mounted and are connected with the grounding pattern 8 in the electronic circuit substrate 6 by passing through the grounding pattern 8. A. heat dissipating protruding surface portion 10 is formed as a portion of a case 3 by protruding one portion therefrom. The electronic circuit substrate 6 is disposed such that positions of the through holes 9 at a rear surface thereof contact a top of the heat dissipating protruding surface portion 10. A space 11 is formed between the rear surface of the electronic; circuit substrate 6 and a surface of the case 3 surrounding the heat dissipating protruding surface portion 10. Moreover, this space 11 is set to a fixed size that enables low heat generating electrical/electronic components to be mounted to the rear surface of the electronic circuit substratte 6.
[0015] Thus, in Embodiment 1 of the present invention, heat generated by the heat generating component 1 is transferred to the entire case 3 via the heat dissipating protruding surface portion 10, which is in contact with the through holes 9, by way of the through holes 9 provided directly underneath the mounting portion of the heat generating component l, and is dissipated to the outside from the case 3 which has the combined effect of a radiator. A:Lso, by connecting the through holes 9 with the grounding pattern 8 formed in an internal layer of the electronic circuit substrate 6, it is possible to diffuse the heat generated by the heat generating component 1 in the electronic circuit substrate 6.
[0016] Furthermore, since heat dissipation may be performed in the heat generating component 1 by contacting only one portion of the rear surface of the electronic circuit substrate 6 with the case 3, low heat generating electrical/electronic components may also be mounted to the rear surface of the electronic circuit substrate 6 and it is possible to increase the conventional component packaging density by approximately twofold. Also, it is possible to obtain heat dissipating effects equal to or better than conventional examples by employing a circuit board made of resin such as an inexpensive glass epoxy and the like as the electronic circuit substrate 6 instead of an expensive ceramic substrate.
(0017] Hence, according to Embodiment 1 of the present invention, it is possible to realize a electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics.
Embodiment 2 [0018] Next, Embodiment 2 of the present invention will be described with reference to FIG. 2. FIG. 2 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 2 of the present invention which is further improved over Embodiment 1 of the present invention. Moreover, portions similar to those in Embodiment 1 will be denoted by similar reference numerals and the repeat description thereof will be omitted.
Embodiment 2 [0018] Next, Embodiment 2 of the present invention will be described with reference to FIG. 2. FIG. 2 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 2 of the present invention which is further improved over Embodiment 1 of the present invention. Moreover, portions similar to those in Embodiment 1 will be denoted by similar reference numerals and the repeat description thereof will be omitted.
[0019] In FIG. 2, a filler 12 of a material with high thermal conductivity, such as copper and the like, is f;lled in the through holes 9. A
heat dissipating grease 13 composed of a material with high thermal conductivity is applied to a contact surface between an area where the through holes 9 of the rear surface of the electronic circuit substrate 6 are disposed and the heat dissipating protruding surface portion 10 of the case 3.
Moreover, all other constructions are the same as in Embodiment 1.
heat dissipating grease 13 composed of a material with high thermal conductivity is applied to a contact surface between an area where the through holes 9 of the rear surface of the electronic circuit substrate 6 are disposed and the heat dissipating protruding surface portion 10 of the case 3.
Moreover, all other constructions are the same as in Embodiment 1.
[0020] In the electronic apparatus provided with an electronic circuit substrate constructed as described above, it is possible to transfer a large amount of heat generated from the heat generating component 1 to the case 3 by means of the filler 12 filled in the through holes 9 and the heat dissipating grease 13 which intervenes at the contact portion between the area where the through holes 9 of the rear surface of the electronic circuit substrate 6 are disposed and the heat dissipating protruding surface portion 10.
[0021] Thus, Embodiment 2 of the present invention not only provides the same effects as in the above Embodiment 1, but it is also possible to realize an electronic apparatus provided with an electronic circuit substrate with even further improved heat dissipating characteristics.
Embodiment 3 [0022] Next, Embodiment 3 of the present invention will be described with reference to FIGS. 3 and 4. FIG. 3 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 3 of the present invention which is further improved over Embodiment 2 of the present invention and FIG. 4 is a partial plan view of the e'.~ectronic circuit substrate according to Embodiment 3 of the present invention. Moreover, portions similar to those in Embodiment 2 will be denoted by similar reference numerals and the repeat description thereof will be omitted.
Embodiment 3 [0022] Next, Embodiment 3 of the present invention will be described with reference to FIGS. 3 and 4. FIG. 3 is schematic structural diagram of an electronic apparatus provided with an electronic circuit substrate according to Embodiment 3 of the present invention which is further improved over Embodiment 2 of the present invention and FIG. 4 is a partial plan view of the e'.~ectronic circuit substrate according to Embodiment 3 of the present invention. Moreover, portions similar to those in Embodiment 2 will be denoted by similar reference numerals and the repeat description thereof will be omitted.
[0023] The above mentioned improvements will now be explained.
In the above mentioned Embodiment 2, as in the conventional example and Embodiment 1, since the entire electronic circuit substrate 6 is warmed by heat generated from the heat generating component 1 being diffused therein, there is a concern that heat stress will be given to other electronic components mounted on the electronic circuit substrate 6. This concern is particularly great when electronic components which are sensitive to temperature change are mounted in the vicinity of heat generating components. Embodiment 3 further overcomes the deficiencies of this sort in Embodiment 2.
In the above mentioned Embodiment 2, as in the conventional example and Embodiment 1, since the entire electronic circuit substrate 6 is warmed by heat generated from the heat generating component 1 being diffused therein, there is a concern that heat stress will be given to other electronic components mounted on the electronic circuit substrate 6. This concern is particularly great when electronic components which are sensitive to temperature change are mounted in the vicinity of heat generating components. Embodiment 3 further overcomes the deficiencies of this sort in Embodiment 2.
[0024] In FIGS. 3 and 4, an insulating groove 14 comprising a concave groove of a V-shaped cross-section is formed in a front surface of the electronic circuit substrate 6 in an approximately square-shape so as to surround the vicinity of the heat generating component which constitutes an approximately square, planar shape. Moreover, an insulating groove 15 comprising a concave groove of a V-shaped cross-section similar to the insulating groove 14 is formed in the rear surface of the electronic circuit substrate 6 as well, and is formed in an approximately square-shape at a location opposite that of the insulating groove 14.
The grounding pattern 8 is removed in an area where the through holes 9 are disposed so as to not be connected with the through holes 9.
Moreover, all other constructions are as in Embodiment 2.
The grounding pattern 8 is removed in an area where the through holes 9 are disposed so as to not be connected with the through holes 9.
Moreover, all other constructions are as in Embodiment 2.
[0025] In an electronic apparatus provided with an electronic circuit substrate of the above construction, the through holes 9 are not connected with the grounding pattern 8 and by further providing insulating grooves 14 and 15 in the front and rear surfaces of the electronic circuit substrate 6 at locations opposing each other, respectively, the heat generated from the heat generating component 1 :is transferred to the case 3 via the through holes 9 without being transferred to the grounding pattern 8. Moreover, since the heat transferred by the resin substrate is also blocked by the insulating groove 14 surrounding the heat generating component 1 and the insulating groove 15 of the substrate rear surface, it is possible to reduce the heat stress given from the heat generating component 1 to electronic components in the vicinity o~'the heat generating component g while positively performing heat dissipation in the heat generating component 1 via the through holes 9 and the case 3.
Thus, Embodiment 3 of the present invention not only provides the same effects as in the above Embodiment 2, but since the constraints when mounting electronic/electrical components in the vicinity of the heat generating component 1 are further relaxed, it is also possible to realize the electronic apparatus provided with an electronic circuit substrate which is small in size and inexpensive.
Thus, Embodiment 3 of the present invention not only provides the same effects as in the above Embodiment 2, but since the constraints when mounting electronic/electrical components in the vicinity of the heat generating component 1 are further relaxed, it is also possible to realize the electronic apparatus provided with an electronic circuit substrate which is small in size and inexpensive.
[0026] Next, a vairiant of the above mentioned Embodiment 3 will be described. Although the above mentioned Embodiment 3 is described as an improvement on Embodiment 2, as in Embodiment 1, the present mode of Embodiment 3 may be constructed without the filler 12 filled in the through holes 9 and the heat dissipating grease 13 which intervenes at the contact portion between the area where the through holes 9 of the rear surface of the electronic circuit substrate 6 are disposed and the heat dissipating protruding surface portion 10.
However, in this case, although the structure may be simplified by not applying the filler 12 and the heat dissipating grease 13, a small reduction in the heat dissipating characteristics can not be avoided.
However, in this case, although the structure may be simplified by not applying the filler 12 and the heat dissipating grease 13, a small reduction in the heat dissipating characteristics can not be avoided.
[0027] According to one aspect of the present invention an electronic apparatus provided with an electronic circuit substrate comprises:
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a mounting portion where a heat generating component is mounted and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through. holes of a rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components. Thus, heat dissipation may be performed in the heat generating component by contacting only one portion of the rear surface of the electronic circuit substrate with the case, low heat generating electrical/electronic components may also be mounted to the rear surface of the electronic circuit substrate and it is possible to increase the conventional component packaging density by approximately twofoldl.
Also, it is possible to obtain heat dissipating effects equal to or better than conventional examples by employing a wiring substrate made of resin, such as an inexpensive glass epoxy and the like, as the electronic circuit substrate instead of an expensive ceramic substrate.
Hence, according to this aspect of the present invention, it is possible to realize the electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics.
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a mounting portion where a heat generating component is mounted and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through. holes of a rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components. Thus, heat dissipation may be performed in the heat generating component by contacting only one portion of the rear surface of the electronic circuit substrate with the case, low heat generating electrical/electronic components may also be mounted to the rear surface of the electronic circuit substrate and it is possible to increase the conventional component packaging density by approximately twofoldl.
Also, it is possible to obtain heat dissipating effects equal to or better than conventional examples by employing a wiring substrate made of resin, such as an inexpensive glass epoxy and the like, as the electronic circuit substrate instead of an expensive ceramic substrate.
Hence, according to this aspect of the present invention, it is possible to realize the electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics.
[0028] According to another aspect of the present invention an electronic apparatus pro~rided with an electronic circuit substrate comprises:
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where the heat generating component is mounted and which are not connected to the grounding pattern, and opposing insulating grooves formed in a front and rear surface of the electronic circuit substrate so as to surround the heat generating component, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of a rear surface of the electronic circuit substrate are disposed, a:nd being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components. Thus, as in the above embodiment, heat dissipation may be performed in the heat generating component by contacting only one portion of the rear surface of the electronic circuit substrate with the case, low heat generating electrical/electronic components may also be mounted to the rear surface of the electronic circuit substrate and it is possible to increase the conventional component packaging density by approximately twofold. Moreover, heat generated from the heat generating component does not spread in the entire wiring substrate via the grounding pattern and the heat transferred by the resin substrate is also blocked by the insulating groove surrounding the heat generating component and the insulating groove of the substrate rear surface. Consequently, it is possible to reduce the heat stress given from the heat generating corriponent to electricallelectronic components in the vicinity of the heat generating component while positively performing heat dissipation in the heat generating component, and electronic components which are sensitive to temperature change may also be mounted in the vicinity of the heat generating component.
Hence, according to this aspect of the present invention, it is possible to realize the electronic: apparatus provided with an electronic circuit substrate that is inexpensive and smaller in size.
an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes provided directly below a portion where the heat generating component is mounted and which are not connected to the grounding pattern, and opposing insulating grooves formed in a front and rear surface of the electronic circuit substrate so as to surround the heat generating component, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of a rear surface of the electronic circuit substrate are disposed, a:nd being formed so as to ensure a space between the case and the rear surface of the electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components. Thus, as in the above embodiment, heat dissipation may be performed in the heat generating component by contacting only one portion of the rear surface of the electronic circuit substrate with the case, low heat generating electrical/electronic components may also be mounted to the rear surface of the electronic circuit substrate and it is possible to increase the conventional component packaging density by approximately twofold. Moreover, heat generated from the heat generating component does not spread in the entire wiring substrate via the grounding pattern and the heat transferred by the resin substrate is also blocked by the insulating groove surrounding the heat generating component and the insulating groove of the substrate rear surface. Consequently, it is possible to reduce the heat stress given from the heat generating corriponent to electricallelectronic components in the vicinity of the heat generating component while positively performing heat dissipation in the heat generating component, and electronic components which are sensitive to temperature change may also be mounted in the vicinity of the heat generating component.
Hence, according to this aspect of the present invention, it is possible to realize the electronic: apparatus provided with an electronic circuit substrate that is inexpensive and smaller in size.
[0029] According to the present invention there is provided an electronic apparatus provided with an electronic circuit substrate wherein:
a ~.ller of a material with high thermal conductivity is filled in the plurality of through holes, and a heat dissipating grease intervenes at a contact portion between .an area where the through holes of the electronic circuit substrate rear surface are disposed and the heat dissipating protruding surface portion of the case. Thus not only are the effects in the above aspects obtained, but it is also possible transfer a large amount of heat generated by the heat generating component to the case.
Hence, according to this aspect of the present invention, it is possible to realize an electronic apparatus provided with an electronic circuit substrate with further improved heat dissipating characteristics
a ~.ller of a material with high thermal conductivity is filled in the plurality of through holes, and a heat dissipating grease intervenes at a contact portion between .an area where the through holes of the electronic circuit substrate rear surface are disposed and the heat dissipating protruding surface portion of the case. Thus not only are the effects in the above aspects obtained, but it is also possible transfer a large amount of heat generated by the heat generating component to the case.
Hence, according to this aspect of the present invention, it is possible to realize an electronic apparatus provided with an electronic circuit substrate with further improved heat dissipating characteristics
Claims (4)
1. An electronic apparatus provided with an electronic circuit substrate comprising:
an electronic circuit substrate mounting a heat generating component, a case for protectively housing said electronic circuit substrate and provided with an opening for housing said electronic circuit substrate, and a cover for blocking said opening of said case, said heat generating component being exposed to the atmosphere in the case, wherein, said electronic circuit substrate comprises a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, and a plurality of through holes formed directly below a portion where said heat generating component is mounted and connected with said grounding pattern, and said case comprises a heat dissipating protruding surface portion contacting an area where said through holes of a rear surface of said electronic substrate are disposed, and is formed so as to ensure a space between portions of said case other than said protruding surface portion and said rear surface of said electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components to said rear surface of said electronic circuit substrate.
an electronic circuit substrate mounting a heat generating component, a case for protectively housing said electronic circuit substrate and provided with an opening for housing said electronic circuit substrate, and a cover for blocking said opening of said case, said heat generating component being exposed to the atmosphere in the case, wherein, said electronic circuit substrate comprises a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, and a plurality of through holes formed directly below a portion where said heat generating component is mounted and connected with said grounding pattern, and said case comprises a heat dissipating protruding surface portion contacting an area where said through holes of a rear surface of said electronic substrate are disposed, and is formed so as to ensure a space between portions of said case other than said protruding surface portion and said rear surface of said electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components to said rear surface of said electronic circuit substrate.
2. An electronic apparatus provided with an electronic circuit substrate comprising:
an electronic circuit substrate mounting a heat generating component, a case for protectively housing said electronic circuit substrate and provided with an opening for housing said electronic circuit substrate, and a cover for blocking said opening of said case wherein, said electronic circuit substrate comprises a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes formed directly below a portion where said heat generating component is mounted and which are not connected to said grounding pattern, an insulating groove comprising a concave groove formed in a front surface of said substrate mounting said heat generating component so as to surround said heat generating component, and an insulating groove also comprising a concave groove being formed in a rear surface of said substrate at a location opposite that of said groove in said substrate front surface, said case comprising a heat dissipating protruding surface portion contacting an area where said through holes of said rear surface of said electronic circuit substrate are disposed, and formed so as to ensure a space between portions of said case other than said protruding surface portion and said rear surface of said electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components to said rear surface of said electronic circuit substrate.
an electronic circuit substrate mounting a heat generating component, a case for protectively housing said electronic circuit substrate and provided with an opening for housing said electronic circuit substrate, and a cover for blocking said opening of said case wherein, said electronic circuit substrate comprises a resin wiring substrate formed with a wiring pattern and a grounding pattern in an internal layer thereof, a plurality of through holes formed directly below a portion where said heat generating component is mounted and which are not connected to said grounding pattern, an insulating groove comprising a concave groove formed in a front surface of said substrate mounting said heat generating component so as to surround said heat generating component, and an insulating groove also comprising a concave groove being formed in a rear surface of said substrate at a location opposite that of said groove in said substrate front surface, said case comprising a heat dissipating protruding surface portion contacting an area where said through holes of said rear surface of said electronic circuit substrate are disposed, and formed so as to ensure a space between portions of said case other than said protruding surface portion and said rear surface of said electronic circuit substrate for enabling mounting of low heat generating electrical/electronic components to said rear surface of said electronic circuit substrate.
3. An electronic apparatus provided with an electronic circuit substrate according to Claim 1 wherein:
a filler of a material with high thermal conductivity is filled in said plurality of through holds, and a heat dissipating grease intervenes at a contact portion between an area where said through holes of said electronic circuit substrate rear surface are disposed and said heat dissipating protruding surface portion of said case.
a filler of a material with high thermal conductivity is filled in said plurality of through holds, and a heat dissipating grease intervenes at a contact portion between an area where said through holes of said electronic circuit substrate rear surface are disposed and said heat dissipating protruding surface portion of said case.
4. An electronic apparatus provided with an electronic circuit substrate according to Claim 2 wherein:
a filler of a material with high thermal conductivity is filled in said plurality of through holes, and a heat dissipating grease intervenes at a contact portion between an area where said through holes of said electronic circuit substrate rear surface are disposed and said heat dissipating protruding surface portion of said case.
a filler of a material with high thermal conductivity is filled in said plurality of through holes, and a heat dissipating grease intervenes at a contact portion between an area where said through holes of said electronic circuit substrate rear surface are disposed and said heat dissipating protruding surface portion of said case.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-232859 | 2000-08-01 | ||
| JP2000232859 | 2000-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2334524A1 CA2334524A1 (en) | 2002-02-01 |
| CA2334524C true CA2334524C (en) | 2004-12-21 |
Family
ID=18725471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002334524A Expired - Fee Related CA2334524C (en) | 2000-08-01 | 2001-02-08 | Electronic apparatus provided with an electronic circuit substrate having high heat dissipation |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20020029875A1 (en) |
| EP (1) | EP1178594B1 (en) |
| KR (1) | KR20020011321A (en) |
| CN (1) | CN1206893C (en) |
| CA (1) | CA2334524C (en) |
| DE (1) | DE60139533D1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3841633B2 (en) * | 2000-10-16 | 2006-11-01 | ヤマハ株式会社 | Semiconductor laser module |
| JP2003289191A (en) * | 2002-03-28 | 2003-10-10 | Denso Corp | Electronic control device |
| FR2839417B1 (en) * | 2002-05-03 | 2004-07-16 | Dav | COOLED POWER SWITCHING DEVICE |
| KR100534968B1 (en) * | 2003-09-16 | 2005-12-08 | 현대자동차주식회사 | cooling structure of an electronic element |
| US7180745B2 (en) | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
| KR100659071B1 (en) * | 2004-11-19 | 2006-12-21 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| US20080080142A1 (en) * | 2006-09-28 | 2008-04-03 | Mediatek Inc. | Electronic devices with enhanced heat spreading |
| US7808788B2 (en) * | 2007-06-29 | 2010-10-05 | Delphi Technologies, Inc. | Multi-layer electrically isolated thermal conduction structure for a circuit board assembly |
| JP5408502B2 (en) | 2010-09-06 | 2014-02-05 | 株式会社デンソー | Electronic control unit |
| CN103547111B (en) * | 2012-07-09 | 2016-08-10 | 光宝电子(广州)有限公司 | Planar heat radiation structure and electronic installation |
| JP2014093414A (en) * | 2012-11-02 | 2014-05-19 | Hitachi Automotive Systems Ltd | Electronic control device |
| US9554453B2 (en) * | 2013-02-26 | 2017-01-24 | Mediatek Inc. | Printed circuit board structure with heat dissipation function |
| JP6141064B2 (en) * | 2013-03-21 | 2017-06-07 | 日立オートモティブシステムズ株式会社 | Connection method of circuit board and housing |
| JP6200693B2 (en) * | 2013-05-24 | 2017-09-20 | 日立オートモティブシステムズ株式会社 | Electronic control unit |
| CN110707449A (en) * | 2019-10-08 | 2020-01-17 | 联合汽车电子有限公司 | Three-phase copper bar and electric drive assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352926A (en) * | 1993-01-04 | 1994-10-04 | Motorola, Inc. | Flip chip package and method of making |
| US5625227A (en) * | 1995-01-18 | 1997-04-29 | Dell Usa, L.P. | Circuit board-mounted IC package cooling apparatus |
| JPH08204070A (en) * | 1995-01-20 | 1996-08-09 | Hitachi Ltd | Electronic part cooling structure |
| US5777844A (en) * | 1996-08-30 | 1998-07-07 | General Electric Company | Electronic control with heat sink |
| DE19916010C1 (en) * | 1999-04-09 | 2000-04-20 | Daimler Chrysler Ag | Heat conduction device for circuit board component heat sink has press-fit element inserted in opening in printed circuit board between circuit board component and heat sink mounted on opposite circuit board surfaces |
-
2001
- 2001-01-30 EP EP01102031A patent/EP1178594B1/en not_active Expired - Lifetime
- 2001-01-30 DE DE60139533T patent/DE60139533D1/en not_active Expired - Lifetime
- 2001-02-08 CA CA002334524A patent/CA2334524C/en not_active Expired - Fee Related
- 2001-02-08 US US09/778,952 patent/US20020029875A1/en not_active Abandoned
- 2001-02-20 CN CNB011119438A patent/CN1206893C/en not_active Expired - Fee Related
- 2001-04-26 KR KR1020010022690A patent/KR20020011321A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1206893C (en) | 2005-06-15 |
| EP1178594A3 (en) | 2004-01-21 |
| EP1178594A2 (en) | 2002-02-06 |
| KR20020011321A (en) | 2002-02-08 |
| CN1336792A (en) | 2002-02-20 |
| CA2334524A1 (en) | 2002-02-01 |
| US20020029875A1 (en) | 2002-03-14 |
| EP1178594B1 (en) | 2009-08-12 |
| DE60139533D1 (en) | 2009-09-24 |
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| EEER | Examination request | ||
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