CA2275523A1 - Structure de montage de puces a bosses comportant des contacts elastiques - Google Patents

Structure de montage de puces a bosses comportant des contacts elastiques Download PDF

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Publication number
CA2275523A1
CA2275523A1 CA002275523A CA2275523A CA2275523A1 CA 2275523 A1 CA2275523 A1 CA 2275523A1 CA 002275523 A CA002275523 A CA 002275523A CA 2275523 A CA2275523 A CA 2275523A CA 2275523 A1 CA2275523 A1 CA 2275523A1
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CA
Canada
Prior art keywords
chip
flip
bumps
substrate
elastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002275523A
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English (en)
Inventor
Lillebror Hjalmar Hesselbom
Jan Peter Bodo
Hans Hentzell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority claimed from PCT/SE1997/002177 external-priority patent/WO1998027589A1/fr
Publication of CA2275523A1 publication Critical patent/CA2275523A1/fr
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne une structure de montage de puces à bosses auto-alignées comportant des contacts élastiques. Cette invention permet de résoudre le problème posé par la réalisation de joints non permanents combinés à des structures auto-alignées. Elle offre un alignement élastique symétrique assurant le centrage continu des pièces. Elle consiste à utiliser une structure (200) de puces à bosses basée sur un substrat (202) présentant une structure (204) de bosses élastomères obtenue par moulage dans un moule en silicium gravé par attaque chimique de façon anisotrope. La configuration des bosses élastiques (204) sur le substrat correspond à la configuration (210) des plages de connexion sur une puce à bosses (214). On peut revêtir les bosses (204) avec de l'or et les mettre en application à la fois en tant que contacts électriques et en tant qu'éléments de positionnement vertical. Un cadre de guidage (212) en matériau élastomère est situé autour des bosses (204) et présente des parois inclinées (220) dont la forme est semblable à celle des parois inclinées (222) de la puce à bosses (214).
CA002275523A 1996-12-19 1997-12-19 Structure de montage de puces a bosses comportant des contacts elastiques Abandoned CA2275523A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9604676-8 1996-12-19
SE9604676A SE516748C2 (sv) 1996-12-19 1996-12-19 Sammansättningsstruktur innefattande minst ett flip-chip och ett substrat
PCT/SE1997/002177 WO1998027589A1 (fr) 1996-12-19 1997-12-19 Structure de montage de puces a bosses comportant des contacts elastiques

Publications (1)

Publication Number Publication Date
CA2275523A1 true CA2275523A1 (fr) 1998-06-25

Family

ID=20405042

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002275523A Abandoned CA2275523A1 (fr) 1996-12-19 1997-12-19 Structure de montage de puces a bosses comportant des contacts elastiques

Country Status (6)

Country Link
JP (1) JP2001506413A (fr)
KR (1) KR20000069626A (fr)
CN (1) CN1156003C (fr)
CA (1) CA2275523A1 (fr)
SE (1) SE516748C2 (fr)
TW (1) TW341726B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303402B2 (en) * 2002-07-05 2007-12-04 J.S.T. Mfg. Co., Ltd Connector, method for manufacturing the same, and wiring board structure employing it
US7005751B2 (en) * 2003-04-10 2006-02-28 Formfactor, Inc. Layered microelectronic contact and method for fabricating same
CN100591181C (zh) * 2007-08-24 2010-02-17 武汉华灿光电有限公司 倒装焊发光二极管芯片的制造方法
WO2012056661A1 (fr) * 2010-10-25 2012-05-03 パナソニック株式会社 Ensemble de composants électroniques
CN105185724B (zh) * 2014-05-30 2019-03-01 无锡华润安盛科技有限公司 一种用于倒装芯片装片工艺的垫块、机器和倒装芯片的方法
WO2023163433A1 (fr) * 2022-02-24 2023-08-31 삼성전자주식회사 Procédé de réparation de module d'affichage

Also Published As

Publication number Publication date
TW341726B (en) 1998-10-01
JP2001506413A (ja) 2001-05-15
CN1246202A (zh) 2000-03-01
KR20000069626A (ko) 2000-11-25
SE9604676L (sv) 1998-06-20
CN1156003C (zh) 2004-06-30
SE516748C2 (sv) 2002-02-26
SE9604676D0 (sv) 1996-12-19

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