CA2149603A1 - Electronic unit - Google Patents
Electronic unitInfo
- Publication number
- CA2149603A1 CA2149603A1 CA002149603A CA2149603A CA2149603A1 CA 2149603 A1 CA2149603 A1 CA 2149603A1 CA 002149603 A CA002149603 A CA 002149603A CA 2149603 A CA2149603 A CA 2149603A CA 2149603 A1 CA2149603 A1 CA 2149603A1
- Authority
- CA
- Canada
- Prior art keywords
- heat
- board
- heat sink
- increases
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Electronic unit in which a printed circuit board is located within a housing which includes a heat sink.
The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship.
Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases.
Preferably the heat conductive efficiency of the compressible member increases as compression increases.
The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship.
Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases.
Preferably the heat conductive efficiency of the compressible member increases as compression increases.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002149603A CA2149603C (en) | 1995-05-17 | 1995-05-17 | Electronic unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002149603A CA2149603C (en) | 1995-05-17 | 1995-05-17 | Electronic unit |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2149603A1 true CA2149603A1 (en) | 1996-11-18 |
CA2149603C CA2149603C (en) | 2003-11-11 |
Family
ID=4155865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002149603A Expired - Fee Related CA2149603C (en) | 1995-05-17 | 1995-05-17 | Electronic unit |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2149603C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6376779B1 (en) | 2000-08-24 | 2002-04-23 | Nortel Networks Limited | Printed circuit board having a plurality of spaced apart scrap border support tabs |
-
1995
- 1995-05-17 CA CA002149603A patent/CA2149603C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6376779B1 (en) | 2000-08-24 | 2002-04-23 | Nortel Networks Limited | Printed circuit board having a plurality of spaced apart scrap border support tabs |
Also Published As
Publication number | Publication date |
---|---|
CA2149603C (en) | 2003-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |