CA2042840A1 - Preparation and use of resins that are relatively non-inflammable and resistant to high temperatures - Google Patents

Preparation and use of resins that are relatively non-inflammable and resistant to high temperatures

Info

Publication number
CA2042840A1
CA2042840A1 CA2042840A CA2042840A CA2042840A1 CA 2042840 A1 CA2042840 A1 CA 2042840A1 CA 2042840 A CA2042840 A CA 2042840A CA 2042840 A CA2042840 A CA 2042840A CA 2042840 A1 CA2042840 A1 CA 2042840A1
Authority
CA
Canada
Prior art keywords
resins
resistant
curable
component consisting
high temperatures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2042840A
Other languages
French (fr)
Other versions
CA2042840C (en
Inventor
Herbert Schreiber
Gunter Burkart
Bruno Knaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Gurit Essex AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gurit Essex AG filed Critical Gurit Essex AG
Publication of CA2042840A1 publication Critical patent/CA2042840A1/en
Application granted granted Critical
Publication of CA2042840C publication Critical patent/CA2042840C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

Polymeric resins which are difficultly inflammable and/or resistant to high temperatures are obtained by curing a curable resin mixture which comprises a mixture of:
(a) a component consisting of at least one thermically curable 1-oxa-3-aza tetraline groups containing compound;
(b) a component consisting of at least one curable halogenated epoxy resin; and optionally (c) a component consisting of at least one curable non-halogenated epoxy resin; and/or optionally (d) a curing agent for epoxy resins.
By tempering them, the glass transition temperature and the mechanical properties can be further improved.
The obtained polymeric resins may be used as follows: as electric insulating materials, in particular for printed circuit boards; in aircraft constructions, also for supporting structures; adhesives; and moreover wherever resins which are flame-resistant are to be used.
CA002042840A 1990-05-21 1991-05-17 Preparation and use of resins that are relatively non-inflammable and resistant to high temperatures Expired - Lifetime CA2042840C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4016296A DE4016296C1 (en) 1990-05-21 1990-05-21 Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives
DEP4016296.6 1990-05-21

Publications (2)

Publication Number Publication Date
CA2042840A1 true CA2042840A1 (en) 1991-11-22
CA2042840C CA2042840C (en) 1996-11-26

Family

ID=6406865

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002042840A Expired - Lifetime CA2042840C (en) 1990-05-21 1991-05-17 Preparation and use of resins that are relatively non-inflammable and resistant to high temperatures

Country Status (8)

Country Link
EP (1) EP0458739A3 (en)
JP (1) JP3203385B2 (en)
KR (1) KR0166377B1 (en)
AU (1) AU636226B2 (en)
CA (1) CA2042840C (en)
CS (1) CS145891A2 (en)
DE (1) DE4016296C1 (en)
ZA (1) ZA913434B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0493310A1 (en) * 1990-12-21 1992-07-01 Gurit-Essex AG Curable resin compositions having flame resistant properties in the cured state and use thereof
CN1058738C (en) * 1994-07-29 2000-11-22 四川联合大学 Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material
JP3543866B2 (en) * 1995-02-28 2004-07-21 日立化成工業株式会社 Friction material and method of manufacturing the same
JPH09157496A (en) * 1995-12-06 1997-06-17 Hitachi Chem Co Ltd Thermosetting resin composition, cured product therefrom, prepreg and metallic foil-laminated plate using the same
JP3487083B2 (en) * 1996-02-09 2004-01-13 日立化成工業株式会社 Thermosetting resin composition and cured product thereof
DE10309617A1 (en) * 2003-03-05 2004-09-23 Siemens Ag Workpiece carrier for holding workpieces
US7157509B2 (en) * 2003-06-27 2007-01-02 Henkel Corporation Curable compositions
US20050042961A1 (en) 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
JP2004156045A (en) * 2003-12-22 2004-06-03 Hitachi Chem Co Ltd Friction material
DE102004046745B4 (en) * 2004-09-27 2008-04-24 Atotech Deutschland Gmbh Process for the solvent-free production of a fiber-reinforced, resin-coated film and use thereof
DE102004046744B4 (en) 2004-09-27 2007-05-24 Atotech Deutschland Gmbh Process for transferring powders and powder coatings to substrates and use for the production of printed circuit boards and solar cells
TWI374137B (en) 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
DE102006017891A1 (en) 2006-04-13 2007-10-25 Hexion Specialty Chemicals Gmbh resin dispersion
EP2070984A1 (en) 2007-12-12 2009-06-17 Hexion Specialty Chemicals Research Belgium S.A. Epoxy-phenolic resins co-dispersions
JP5438035B2 (en) 2008-02-21 2014-03-12 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー Curable composition based on halogen-free benzoxazine for high TG applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH579113A5 (en) * 1972-05-09 1976-08-31 Micafil Ag
ES414518A1 (en) * 1972-05-09 1976-02-01 Sued West Chemie Gmbh Procedure for the preparation of synthetic materials. (Machine-translation by Google Translate, not legally binding)
DE3433851A1 (en) * 1984-09-14 1986-03-27 Gurit-Essex, Freienbach CHEMICALLY CURABLE RESINS FROM COMPOUNDS CONTAINING 1-OXA-3-AZA-TETRALINE GROUPS AND CYCLOALIPHATIC EPOXY RESINS, METHOD FOR THE PRODUCTION AND CURING THEREOF AND THE USE OF SUCH RESINS
DE58909626D1 (en) * 1988-07-18 1996-04-25 Gurit Essex Ag Resins curable to flame retardant and high temperature resistant plastics and process for their production

Also Published As

Publication number Publication date
EP0458739A3 (en) 1993-09-01
DE4016296C1 (en) 1991-09-05
CS145891A2 (en) 1991-12-17
ZA913434B (en) 1992-02-26
JPH04227922A (en) 1992-08-18
CA2042840C (en) 1996-11-26
JP3203385B2 (en) 2001-08-27
KR910020104A (en) 1991-12-19
KR0166377B1 (en) 1999-03-20
AU636226B2 (en) 1993-04-22
EP0458739A2 (en) 1991-11-27
AU7721391A (en) 1991-11-21

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