CA1332849C - Ensemble de modules interconnectes en trois dimensions - Google Patents

Ensemble de modules interconnectes en trois dimensions

Info

Publication number
CA1332849C
CA1332849C CA000616511A CA616511A CA1332849C CA 1332849 C CA1332849 C CA 1332849C CA 000616511 A CA000616511 A CA 000616511A CA 616511 A CA616511 A CA 616511A CA 1332849 C CA1332849 C CA 1332849C
Authority
CA
Canada
Prior art keywords
power
logic
axis
boards
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA000616511A
Other languages
English (en)
Inventor
Seymour R. Cray
Nicholas J. Krajewski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Medallion Tech LLC
Original Assignee
Cray Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/053,142 external-priority patent/US5054192A/en
Application filed by Cray Computer Corp filed Critical Cray Computer Corp
Priority to CA000616511A priority Critical patent/CA1332849C/fr
Application granted granted Critical
Publication of CA1332849C publication Critical patent/CA1332849C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
CA000616511A 1987-05-21 1992-10-16 Ensemble de modules interconnectes en trois dimensions Expired - Lifetime CA1332849C (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000616511A CA1332849C (fr) 1987-05-21 1992-10-16 Ensemble de modules interconnectes en trois dimensions

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US07/053,142 US5054192A (en) 1987-05-21 1987-05-21 Lead bonding of chips to circuit boards and circuit boards to circuit boards
US053,142 1987-05-21
CA000567084A CA1318415C (fr) 1987-05-21 1988-05-18 Methode d'interconnexion electrique de circuits par compression et circuits interconnectes selon cette methode
CA000616511A CA1332849C (fr) 1987-05-21 1992-10-16 Ensemble de modules interconnectes en trois dimensions

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA000567084A Division CA1318415C (fr) 1987-05-21 1988-05-18 Methode d'interconnexion electrique de circuits par compression et circuits interconnectes selon cette methode

Publications (1)

Publication Number Publication Date
CA1332849C true CA1332849C (fr) 1994-11-01

Family

ID=25671899

Family Applications (2)

Application Number Title Priority Date Filing Date
CA000615777A Expired - Lifetime CA1332639C (fr) 1987-05-21 1990-06-28 Soudage a l'or par compression
CA000616511A Expired - Lifetime CA1332849C (fr) 1987-05-21 1992-10-16 Ensemble de modules interconnectes en trois dimensions

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CA000615777A Expired - Lifetime CA1332639C (fr) 1987-05-21 1990-06-28 Soudage a l'or par compression

Country Status (1)

Country Link
CA (2) CA1332639C (fr)

Also Published As

Publication number Publication date
CA1332639C (fr) 1994-10-18

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Legal Events

Date Code Title Description
MKEX Expiry