CA1235528A - Heat dissipation for electronic components on ceramic substrate - Google Patents
Heat dissipation for electronic components on ceramic substrateInfo
- Publication number
- CA1235528A CA1235528A CA000489001A CA489001A CA1235528A CA 1235528 A CA1235528 A CA 1235528A CA 000489001 A CA000489001 A CA 000489001A CA 489001 A CA489001 A CA 489001A CA 1235528 A CA1235528 A CA 1235528A
- Authority
- CA
- Canada
- Prior art keywords
- electronic components
- heat
- ceramic
- ceramic substrate
- ceramic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
ABSTRACT
Disclosed is a heat dissipator for electronic components on a ceramic substrate. The ceramic plate receives heat from the component at one sur-face and has a plurality of separate spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate In a preferred embodiment the ceramic plate on which the metallic elements are mounted is separate from a ceramic substrate on which the electronic components are mounted; the ceramic plate carrying the metallic elements includes adhesive for adhering it to the ceramic substrate carrying the electronic components;
the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.
Disclosed is a heat dissipator for electronic components on a ceramic substrate. The ceramic plate receives heat from the component at one sur-face and has a plurality of separate spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate In a preferred embodiment the ceramic plate on which the metallic elements are mounted is separate from a ceramic substrate on which the electronic components are mounted; the ceramic plate carrying the metallic elements includes adhesive for adhering it to the ceramic substrate carrying the electronic components;
the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.
Description
I
1- 920~-96 FIELD OF THE__I_VENTION
The invention relates to dissipating heat from electronic components on a ceramic substrate.
BACKGROUND OF THE INVENTION
Electronic components can be mounted on a ceramic substrate and electrically connected to each other through metallized conductors carried by the substrate. Ire U.S.
Patent No. 4,292,647 discloses a semiconductor package including a plurality of electronic chips mounted on a ceramic substrate and provided with individual heat conductive elements mounted directly above them SUMMARY_OF_THE INVENTION
I have discovered that heat can he very effectively dissipated from electronic components through the use of a ceramic plate that receives heat from the components at one surface and has a plurality of separate, spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate.
According to a broad aspect of the invention there it provided the combination of a ceramic substrate carrying electronic components and a heat dissipator for the electronic components, said combination comprising:
a ceramic substrate carrying electronic components on one surface and having an opposite surface, a ceramic plate adjacent to said ceramic substrate and having a first surface adhered in heat conductive relationship to I
~23~52~3
1- 920~-96 FIELD OF THE__I_VENTION
The invention relates to dissipating heat from electronic components on a ceramic substrate.
BACKGROUND OF THE INVENTION
Electronic components can be mounted on a ceramic substrate and electrically connected to each other through metallized conductors carried by the substrate. Ire U.S.
Patent No. 4,292,647 discloses a semiconductor package including a plurality of electronic chips mounted on a ceramic substrate and provided with individual heat conductive elements mounted directly above them SUMMARY_OF_THE INVENTION
I have discovered that heat can he very effectively dissipated from electronic components through the use of a ceramic plate that receives heat from the components at one surface and has a plurality of separate, spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate.
According to a broad aspect of the invention there it provided the combination of a ceramic substrate carrying electronic components and a heat dissipator for the electronic components, said combination comprising:
a ceramic substrate carrying electronic components on one surface and having an opposite surface, a ceramic plate adjacent to said ceramic substrate and having a first surface adhered in heat conductive relationship to I
~23~52~3
-2- 9204-96 said opposite surface of said substrate by a layer of adhesive, said plate having a second surface, and a plurality of separate, spaced, free-standing, metallic, cylindrical, heat-conducting elements mounted in an array on and extending from said second surface of said ceramic plate, said heat conducting elements being electrically isolated from said electronic components.
In a preferred embodiment the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.
Because both plates are made of ceramic, there are no thermal stresses between them. Also, the ceramic plate diffuses heat well, making the difference in temperature among the various pins low and promoting efficient heat dissipation.
Finally, the copper pins provide good heat transfer to and low pressure drop in air passing next to them, and the solder provides good bond strength and little thermal resistance to heat passing through it.
DESCRIPTION OF THE PREFERRED EMBODIMENT
I will now describe the structure, manufacture and operation of the presently preferred embodiment of the invention after first briefly describing the drawings.
DRAWINGS
Figure 1 is a diagrammatic perspective view, partially broken away, of a heat dissipator shown attached to a ~2:3~i2~
-pa- 9204-96 ceramic substrate carrying electronic components according to the invention.
Figure 2 is a bottom plan view of the Figure 1 dissipator.
Figure 3 is a vertical sectional view, taken a-t 3-3 of Figure 1 and upside-down with respect to Figure 1, of a portion of the Figure 1 dissipator.
STRUCTURE
Referring -to Figure 1, -there is shown ceramic substrate 10, which carries electronic components 12 on so its upper surface and is secured to heat dissipator 14 at its lower surface. Electronic components 12 are electrically connected to each other by metallization 16 on the upper and lower surfaces of ceramic plate 10, and the upper surface of plate 10 also carries insulating coating 18 over metallization 16. Dissipator 14 includes ceramic plate 20 (95~ pure alumina), thermosetting adhesive layer 22 (5 mix thick and available from EM under the YN469 or YN568 trade designations) and metallic heat-conducting pins 24 on its lower surface.
Referring to Fig. 2, the arrangement of pins 24 on the lower surface of plate 20 is shown. Pins 24 are mounted on 0.125 by 0.125 inch square palladium/silver vacuum deposited pads 26, which are spaced from each other by 0.094 inch in the width direction and 0.108 inch in the length direction. Referring to Fig. 3, pins 24 are approximately 0.1 inch in diameter and I inch long and include copper core 28 and tin coating 30.
Pins 24 are attached to pads 26 by solder 32, Manufacture Heat dissipator 14 is made by securing pins 24 in a jig providing them with the proper arrangement an applying solder paste to the exposed ends of pins 24.
25 Ceramic plate 20 with pads 26 thereon is placed on the exposed ends ox pins I and pins 24 and ceramic plate 20 are joined to each other by vapor soldering. After the pin/ceramic assembly has cooled, adhesive layer 22 is applied, and this is covered with a release layer 30 (not shown), which is removed prior to adhering to substrate 10. Eta dissipator 14 is easily adhered to substrate 10 by bringing the lower surface of ceramic plate 10 in contact with exposed adhesive layer 22, Lowe 8 .
., which cures in use. Adhesive layer 22 is 5 miss thick to compensate for irregularities in the plenarily of the ceramic plate surfaces.
Operation . . .
In operation, heat from electronic components 12 is conducted through ceramic layers 10, 20 to heat-conducting pins 24, from which the heat is transferred to the surrounding air flowing past them.
Because ceramic plate 20 diffuses heat well, the difference in temperature among various pins 24 is low, and heat dissipation to the air is efficient. Because plate 20 and ceramic plate 10 are both ceramic, there are no thermal stresses between them.` Copper pins 24 provide good heat transfer to and low pressure drop in air flowing past them. Solder 32 provides good bond strength and little thermal resistance to heat passing through it.
Other Embodiments Other embodiments of the invention are within the scope of the following claims. For example, pins 24 can be provided directly on the bottom of the ceramic layer that carries the electronic components if there is no metallization 16 on the bottom surf e.
_ . _ . _ . . .. . , . . .. _ .. . . .. .
In a preferred embodiment the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.
Because both plates are made of ceramic, there are no thermal stresses between them. Also, the ceramic plate diffuses heat well, making the difference in temperature among the various pins low and promoting efficient heat dissipation.
Finally, the copper pins provide good heat transfer to and low pressure drop in air passing next to them, and the solder provides good bond strength and little thermal resistance to heat passing through it.
DESCRIPTION OF THE PREFERRED EMBODIMENT
I will now describe the structure, manufacture and operation of the presently preferred embodiment of the invention after first briefly describing the drawings.
DRAWINGS
Figure 1 is a diagrammatic perspective view, partially broken away, of a heat dissipator shown attached to a ~2:3~i2~
-pa- 9204-96 ceramic substrate carrying electronic components according to the invention.
Figure 2 is a bottom plan view of the Figure 1 dissipator.
Figure 3 is a vertical sectional view, taken a-t 3-3 of Figure 1 and upside-down with respect to Figure 1, of a portion of the Figure 1 dissipator.
STRUCTURE
Referring -to Figure 1, -there is shown ceramic substrate 10, which carries electronic components 12 on so its upper surface and is secured to heat dissipator 14 at its lower surface. Electronic components 12 are electrically connected to each other by metallization 16 on the upper and lower surfaces of ceramic plate 10, and the upper surface of plate 10 also carries insulating coating 18 over metallization 16. Dissipator 14 includes ceramic plate 20 (95~ pure alumina), thermosetting adhesive layer 22 (5 mix thick and available from EM under the YN469 or YN568 trade designations) and metallic heat-conducting pins 24 on its lower surface.
Referring to Fig. 2, the arrangement of pins 24 on the lower surface of plate 20 is shown. Pins 24 are mounted on 0.125 by 0.125 inch square palladium/silver vacuum deposited pads 26, which are spaced from each other by 0.094 inch in the width direction and 0.108 inch in the length direction. Referring to Fig. 3, pins 24 are approximately 0.1 inch in diameter and I inch long and include copper core 28 and tin coating 30.
Pins 24 are attached to pads 26 by solder 32, Manufacture Heat dissipator 14 is made by securing pins 24 in a jig providing them with the proper arrangement an applying solder paste to the exposed ends of pins 24.
25 Ceramic plate 20 with pads 26 thereon is placed on the exposed ends ox pins I and pins 24 and ceramic plate 20 are joined to each other by vapor soldering. After the pin/ceramic assembly has cooled, adhesive layer 22 is applied, and this is covered with a release layer 30 (not shown), which is removed prior to adhering to substrate 10. Eta dissipator 14 is easily adhered to substrate 10 by bringing the lower surface of ceramic plate 10 in contact with exposed adhesive layer 22, Lowe 8 .
., which cures in use. Adhesive layer 22 is 5 miss thick to compensate for irregularities in the plenarily of the ceramic plate surfaces.
Operation . . .
In operation, heat from electronic components 12 is conducted through ceramic layers 10, 20 to heat-conducting pins 24, from which the heat is transferred to the surrounding air flowing past them.
Because ceramic plate 20 diffuses heat well, the difference in temperature among various pins 24 is low, and heat dissipation to the air is efficient. Because plate 20 and ceramic plate 10 are both ceramic, there are no thermal stresses between them.` Copper pins 24 provide good heat transfer to and low pressure drop in air flowing past them. Solder 32 provides good bond strength and little thermal resistance to heat passing through it.
Other Embodiments Other embodiments of the invention are within the scope of the following claims. For example, pins 24 can be provided directly on the bottom of the ceramic layer that carries the electronic components if there is no metallization 16 on the bottom surf e.
_ . _ . _ . . .. . , . . .. _ .. . . .. .
Claims (4)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. The combination of a ceramic substrate carrying electronic components and a heat dissipator for the electronic components, said combination comprising a ceramic substrate carrying electronic components on one surface and having an opposite surface, a ceramic plate adjacent to said ceramic substrate and having a first surface adhered in heat conductive relationship to said opposite surface of said substrate by a layer of ad-hesive, said plate having a second surface, and a plurality of separate, spaced, free-standing, metallic, cylindrical, heat-conducting elements mounted in an array on and extending from said second surface of said ceramic plate, said heat conducting elements being electrically isolated from said electronic components.
2. The dissipator of claim 1 wherein said metallic elements are soldered to metallized pads on said second surface.
3. The dissipator of claim 2 wherein said metallic elements are made of copper.
4. The dissipator of claim 3 wherein said metallized pads are made of a palladium/silver alloy.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65964884A | 1984-10-11 | 1984-10-11 | |
| US659,648 | 1984-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1235528A true CA1235528A (en) | 1988-04-19 |
Family
ID=24646223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000489001A Expired CA1235528A (en) | 1984-10-11 | 1985-08-19 | Heat dissipation for electronic components on ceramic substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH0669119B2 (en) |
| CA (1) | CA1235528A (en) |
| DE (1) | DE3531729A1 (en) |
| FR (1) | FR2571921B1 (en) |
| GB (1) | GB2165704B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
| GB2198888A (en) * | 1986-12-09 | 1988-06-22 | Lucas Ind Plc | Cooling electronic components |
| DE3822890A1 (en) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Cooling arrangement for an optical character generator |
| US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
| DE4437971C2 (en) * | 1994-10-24 | 1997-09-11 | Siemens Ag | Cooling device for electrical assemblies |
| KR20150031818A (en) * | 2013-09-17 | 2015-03-25 | 삼성전자주식회사 | Portable electronic device capable of decreasing heat temperature |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2137001A1 (en) * | 1971-05-11 | 1972-12-29 | Thomson Csf | |
| JPS5647962Y2 (en) * | 1976-02-03 | 1981-11-10 | ||
| US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
| DE7821509U1 (en) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Cooling device for LSI wafers |
| US4292647A (en) * | 1979-04-06 | 1981-09-29 | Amdahl Corporation | Semiconductor package and electronic array having improved heat dissipation |
| JPS56164559U (en) * | 1980-05-09 | 1981-12-07 | ||
| DE3031912A1 (en) * | 1980-08-23 | 1982-04-01 | Brown, Boveri & Cie Ag, 6800 Mannheim | ARRANGEMENT FOR POTENTIAL-INDEPENDENT HEAT EXHAUST |
| FR2495838A1 (en) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | REMOVABLE COOLING DEVICE FOR INTEGRATED CIRCUIT CARRIERS |
| JPS57120390A (en) * | 1981-01-19 | 1982-07-27 | Mitsubishi Electric Corp | Ceramic circuit board |
| JPS5832313U (en) * | 1981-08-20 | 1983-03-02 | トキコ株式会社 | vehicle height detector |
| US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
| US4546405A (en) * | 1983-05-25 | 1985-10-08 | International Business Machines Corporation | Heat sink for electronic package |
| EP0135120B1 (en) * | 1983-08-23 | 1988-03-09 | BBC Brown Boveri AG | Ceramic-metallic element |
-
1985
- 1985-08-19 CA CA000489001A patent/CA1235528A/en not_active Expired
- 1985-09-05 DE DE19853531729 patent/DE3531729A1/en active Granted
- 1985-09-26 JP JP60213621A patent/JPH0669119B2/en not_active Expired - Lifetime
- 1985-10-08 GB GB8524805A patent/GB2165704B/en not_active Expired
- 1985-10-11 FR FR8515123A patent/FR2571921B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2165704A (en) | 1986-04-16 |
| DE3531729C2 (en) | 1987-10-29 |
| JPH0669119B2 (en) | 1994-08-31 |
| DE3531729A1 (en) | 1986-04-17 |
| JPS6195598A (en) | 1986-05-14 |
| FR2571921B1 (en) | 1989-02-03 |
| FR2571921A1 (en) | 1986-04-18 |
| GB8524805D0 (en) | 1985-11-13 |
| GB2165704B (en) | 1988-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |