CA1134057A - Glass-sealed power thyristor - Google Patents

Glass-sealed power thyristor

Info

Publication number
CA1134057A
CA1134057A CA335,443A CA335443A CA1134057A CA 1134057 A CA1134057 A CA 1134057A CA 335443 A CA335443 A CA 335443A CA 1134057 A CA1134057 A CA 1134057A
Authority
CA
Canada
Prior art keywords
region
semiconductor material
shaped
thyristor
emitter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA335,443A
Other languages
English (en)
French (fr)
Inventor
David L. Moore
John A. Ostop
Joseph E. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Application granted granted Critical
Publication of CA1134057A publication Critical patent/CA1134057A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
  • Formation Of Insulating Films (AREA)
CA335,443A 1978-09-15 1979-09-11 Glass-sealed power thyristor Expired CA1134057A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94257778A 1978-09-15 1978-09-15
US942,577 1978-09-15

Publications (1)

Publication Number Publication Date
CA1134057A true CA1134057A (en) 1982-10-19

Family

ID=25478299

Family Applications (1)

Application Number Title Priority Date Filing Date
CA335,443A Expired CA1134057A (en) 1978-09-15 1979-09-11 Glass-sealed power thyristor

Country Status (8)

Country Link
JP (2) JPS5558571A (de)
BE (1) BE878751A (de)
BR (1) BR7905849A (de)
CA (1) CA1134057A (de)
DE (1) DE2937258A1 (de)
FR (1) FR2436499A1 (de)
GB (1) GB2031225B (de)
IN (1) IN152228B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349584A (en) * 1981-04-28 1982-09-14 Rca Corporation Process for tapering openings in ternary glass coatings
DE102009001534B4 (de) * 2009-03-13 2012-10-04 Infineon Technologies Bipolar Gmbh & Co. Kg Lichtempfindliches, elektronisches Bauelement und Verfahren zur Herstellung eines Gehäusedeckels

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4934282A (de) * 1972-07-29 1974-03-29
JPS5069971A (de) * 1973-10-24 1975-06-11
JPS5130480A (en) * 1974-09-09 1976-03-15 New Nippon Electric Co Handotaisochi no seizohoho

Also Published As

Publication number Publication date
BE878751A (fr) 1980-03-12
JPS58109268U (ja) 1983-07-25
GB2031225B (en) 1983-07-20
IN152228B (de) 1983-11-26
BR7905849A (pt) 1980-05-27
FR2436499A1 (fr) 1980-04-11
GB2031225A (en) 1980-04-16
JPS5558571A (en) 1980-05-01
DE2937258A1 (de) 1980-03-27

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Legal Events

Date Code Title Description
MKEX Expiry