CA1116678A - Rectifier assembly for a synchronous machine - Google Patents
Rectifier assembly for a synchronous machineInfo
- Publication number
- CA1116678A CA1116678A CA000301042A CA301042A CA1116678A CA 1116678 A CA1116678 A CA 1116678A CA 000301042 A CA000301042 A CA 000301042A CA 301042 A CA301042 A CA 301042A CA 1116678 A CA1116678 A CA 1116678A
- Authority
- CA
- Canada
- Prior art keywords
- cooling medium
- diode
- wafers
- assembly
- rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/042—Rectifiers associated with rotating parts, e.g. rotor cores or rotary shafts
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Synchronous Machinery (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Motor Or Generator Cooling System (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A plurality of individual semiconductor diode wafers secured to the rotor of a synchronous machine rectify AC from an excitation power source to provide DC to the main rotating field element. The diode wafers, connected as either a half wave or a full wave rectifier, are contained within a housing to form a rectifier assembly. The assembly is mounted directly on an inner surface of the housing carried on the shaft of the machine. The assembly is provided with suitable passageways or surfaces for a nonelectrically conductive cooling medium. In one embodiment, the cooling medium, as oil or air, traverses the surface of the diode wafers to provide high efficiency heat removal. In another embodiment the cooling medium traverses a heat sink on which the wafers are mounted to provide high efficiency heat removal.
A plurality of individual semiconductor diode wafers secured to the rotor of a synchronous machine rectify AC from an excitation power source to provide DC to the main rotating field element. The diode wafers, connected as either a half wave or a full wave rectifier, are contained within a housing to form a rectifier assembly. The assembly is mounted directly on an inner surface of the housing carried on the shaft of the machine. The assembly is provided with suitable passageways or surfaces for a nonelectrically conductive cooling medium. In one embodiment, the cooling medium, as oil or air, traverses the surface of the diode wafers to provide high efficiency heat removal. In another embodiment the cooling medium traverses a heat sink on which the wafers are mounted to provide high efficiency heat removal.
Description
~667~
Th;s invent;on relates to a rectifier asse~bly for use on the rotor of a synchronous machine such as a brushless alternating current generator or a brushless synchronous motor.
A synchronous machine, such as a brushless alternating current generator, has an exciter generator comprising a DC stator field with an AC
armature on the rotor. An example of such a machine is provided by Sones et al U.S. Patent No. 3,059,168. A rectifier on the rotor rectlfies AC
from the exciter for the main generator DC field winding which is also located on the rotor. The main AC armature is on the stator and the AC
voltage is available therefrom. The rectifier typically uses individual semiconductor diode rectifiers mounted in a housing on the rotor shaft.
Several disadvantages are encountered when employing individual semiconductor diode rectifiers. For example, mounting complexity is encountered due to the physical stresses from the rotational"6" forces at speeds up to 20,0~0 RPM, which are used in aircraft generators and motors.
Also, since the casing of the semiconductor d;ode rectifier is usually the anode or the cathode of the device, the rectifier must be insulated from the mounting base if the moun~ing base is conductive. Moreover, reliability of the rectifier is degraded due to the complexity of the entire rectifier assembly. Also, effective cooling of the semiconductor diode rectlfier is difficult to obtain since there is a high thermal resistance between the outer casing of the semiconductor diode assembly and the wafer within. Thus, even if the rectifier assembly is immersed in a cooling medium, inefficient cooling results. -Considering these drawbacks, I have developed a rectifier assembly ~ ;
for a synchronous machine which is easily mounted to the housing, insulated from the mounting base, capable of wl~hstanding centrifugal force created at normal operating speeds and is efficiently cooled. The assembly can be connected as either a half wave or a full wave rectifier.
7~
_ A plurality of semiconductor wafers forming either a half wave or a full wave rectifier are conta;ned within a rectifier assembly attached directly to an inner section of a housing mounted on a shaft of a synchronous machine. In one embodiment, the assembly is provided wlth inlets and outlets for the passage of a cooling medium. The cooling medium traverses the surface of the semiconductor wafers to provide high efficiency heat removal. In another embodiment, the cooling medium traverses the face of a heat sink on which the wafers are mounted.
It is a feature of the present invention to provide a rectifier assembly which permits the cooling medium to traverse the surface of the semiconductor wafers within the rectifier assembly.
Another feature of the present invention is to provide a rectifier assembly having a heat sink wherein the cooling medium traverses the heat sink to remove heat.
Yet another feature of the present invention is to provide a rectifier assembly which is efficiently cooled and capable of withstanding high centrifugal forces and has a high reliability.
Other features of the invention will become apparent when considering the specification and the drawings in which:
DRAWIN~S
Fig. 1 is a cross-sectional view of a brushless alternating current generating system having a rectifier assembly of the present invention;
Fig. 2 is a schematic diagram of a full wave rectifier for converting three-phase AC to DC;
Fig. 3 is a half wave rectifier for converting three-phase AC to DC;
Fig. 4 is an end view of the brushless alternating current generating system of Fig. 1 taken through the line 4-4;
Fig. 5 is a perspective view of one of the three casings which house the semiconductor wafer in the rectifier assembly; and Fig. 6 is a perspective view of an alternative construction of the rectifier assembly.
Referring to Fig. 1, brushless alternating current generating system 10 is shown. Although the invention will be described for use in conjunction with a synchronous generator, it also may be used with a synchronous motor. The generating system 10 includes rotatable shaft 12 driven by an external source (not shown) to produce an AC output from terminals 14. The system may provide a single phase or a polyphase voltage supply. As shaft 12 rotates, AC armature 16, wound around an annular housing 18, provides a polyphase excitation power source for the system as AC armature 16 cuts through the DC exciter field established by DC windings 20. The AC from armature 16 ls rectified by rectifier assembly 22 which is located in an inner section 24 of annular housing 18. Rectifier assembly 22 iS connected to provide either a half wave or a full wave rectifier and is coupled to DC field winding 26 by leads (not shown) from the terminals, as terminal 30.
DC field windings 26 are secured to shaft 12 and spaced apart from housing 18 by spacer 32. As shaft 12 rotates, current provided DC field winding 26 establishes a DC field which cuts through AC output windings 34. The AC output windings 34 provide the single phase or polyphase supply and are connected to terminals 14. Housing 36 is provided with a cooling medium, as oil or air. Suitable inlet and outlet ports (not shown) to and from the generator assure adequate cooling of the alternating current generating system 10 during operation in the well known manner. Also, each end of shaft 12 is provided with suitable bearings, as bearings 38, to enhance rotation.
An electrical schematic of a full wave rectifier is shown in Fig. 2 as having three pairs of diodes 40, 42 and 44. An electrical schematic of a half wave rectifier having diodes 46, 48 and 50 is shown in Fig. 3. As will be explained in greater detail below, either the full wave or the hal~
wave rectifier is contained by rectifier assembly 22, and in either case, the DC voltage output therefrom is provided to DC windings 26.
Referring to Fig. 4, rectifier assembly 22 is shown and includes three individual casings 52, 54 and 56 symmetrically disposed about shaft 1~6678 1 ~ in inner sec~ion 24 of annular housing 18. Each casing contains diode pair 40, 42 and 44, respectively. The leads from the diodes of each casing may be interconnected to form the full wave rectifier of Fig. 2.
Referring to Fig. 5, the construction of casing 52 of rectifier assembly 22 will now be described. The discussion relating to the construction of casing 52 equally applies to similarly constructed casings 54 and 56. Cover 53 of casing 52 is mounted on a conductive shell 58.
Diode wafers, such as semiconductor wafers 60 and 62, are mechanically and electrically attached to conductive shell 58. Specifically, the flat ~0 planar anode surface of diode wafer 60 is attached to shell 58 and the flat planar cathode surface of diode wafer 62 is attached to shell 58. High temperature solder or an adhesive which is electrically conductive may be used to attach the wafers to the shell. The conductive shell 58 provides a common terminal between wafers 60 and 62 of diode pair 40 for applying phase A of the AC voltage input (Fig. 2). Since cover 53 is in mechanical contact with shell 58, terminal 64 mounted on cover 53 is used for providing the conductive shell 58 with the polyphase AC source. Leads 66 and 68 are secured to the upper surface of wafers 60 and 62, respectively, to connect the diodes to terminals 70 and 72 which are mounted on, but electrically insulated from, cover 53. A coating compatible with the cooling material may be apptied over the chips to isolate them from contaminants present in the cooling medium.
Casing 52 is electrically insulated from the annular housing 18 by insulative pad 59 and is attached to housing 18 by screws 74 and 76.
Insulative washers 78 and 80 electrically insulate the screws from cover 53. Cover 53 is spaced apart from the inner wall 84 of the base plate by a distance d to form an arcuate inlet. Nonconductive coolant material, as air or lubricating oil, blowing in a direction generally parallel with the shaft 12, enters the inner cavity of casing 52 between inner wall 84 and cover 53. An example of how hydraulic lubricating oil can be used to cool the various components of a high speed aircraft-type generator is provided in Baits U.S. Patent No. 3,576,143. The flow of the coolant material is provided directly across the surface of wafers 60 and 62 or across the 1 r,otective coating. Because the coolant is in direct contact with the semiconductor material itself, particularly efficient heat removal is attained, thereby allowing the rectifier diodes to operate at substantially lower temperatures and thus increasing the life and reliability of the wafers. Slots 86 in cover 53 provide an outlet for the coolant material and since the rotor and hence the cover are rotating, centrifugal force will cause the coolant to flow over the diodes 60 and 62 and out of the casing 52. As shown in Fig. 1, housing 18 may be provided with channels 88 to enhance coolant flow through the entire housing if desired.
Referring to Fig. 6, an alternative construction of the rectifier assembly is shown. Nonconductive plate 90 forms the base of assembly 92.
Plate 90 has a large center hole 94 which accommodates shaft 12, and six small holes, as hole 96, for cooling, as will be explained below.
Diode triplet assemblies 98 and 100 are secured to the nonconductive base plate 90. Each triplet assembly has three diodes secured to the upper surface of conductive heat sinks 102 and 104, respectively. Conductors ~not shown) are secured to each individual diode wafer of the triplet assembly and to protrusions 106 and 108 on triplet assemblies 98 and 100. The other ends of the conductors are coupled to terminals 110, 112, 114, 116 and 118, which are mounted on nonconductive cover 120. The connection of the conductors with the wafers and the protrusions 106 and 108 correspond to the connections shown in the schematic diagram of Fig. 2. The assembly is encapsulated in epoxy or other suitable material, retaining cover 120 over base plate 90.
The construction of diode triplet assembly 98 will now be described. Wafers 122, 124 and 126 are electrically and mechanically attached to conductive heat sink 102. Eaçh of the wafers represents one-half of the diode pair 40, 42 and 44, respectively, as best shown in Fig. 2. The flat planar cathode surface of each of the wafers 122, 124 and 126 is attached to conductive heat sink 102. Positive DC potential is therefore available from the outwardly extending protrusion 106.
The construction of diode triplet assembly 100 will now be described. Wafers 128 and 130 and a third diode (not shown) are 7~3 1 lectrically and mechanically attached to conductive heat sink 104. Each of the wafers represents one-half of the diode pair 40, 42 and 44, respectively, as best shown in Fig. 2. The flat planar anode surface of each of the wafers 128 and 130 and the third diode is attached to the inductive heat sink 104. Negative DC potential is therefore available from outwardly extending protrusion 108.
Assembly 92 is rigidly attached to the annular housing 18 of AC
armature 16 of the generating system 10 by an adhesive. If housing 18 is provided with suitable passsageways or openings for cooling medium, efficient heat removal occurs when the cooling material traverses the rear side of heat sinks 102 and 104 through the six holes, as hole 96.
The above explanation specifically relates to rectifier assemblies providing full wave rectification. A half wave rectifier, as shown in Fig.
3, could be constructed by providing casings 52, 54 and 56 with a single diode wafer representing diodes 46, 48 and 50 (as shown in Fig. 2).
Similarly, if a half wave rectifier is employed in the assembly shown in F;g. 6, only one diode triplet would be employed. In such a case, rotational balance must be maintained during the operation of the generator.
Finally, although the use of silicone wafers is preferred, diode wafers constructed of other semiconductive materials may also be used.
3o
Th;s invent;on relates to a rectifier asse~bly for use on the rotor of a synchronous machine such as a brushless alternating current generator or a brushless synchronous motor.
A synchronous machine, such as a brushless alternating current generator, has an exciter generator comprising a DC stator field with an AC
armature on the rotor. An example of such a machine is provided by Sones et al U.S. Patent No. 3,059,168. A rectifier on the rotor rectlfies AC
from the exciter for the main generator DC field winding which is also located on the rotor. The main AC armature is on the stator and the AC
voltage is available therefrom. The rectifier typically uses individual semiconductor diode rectifiers mounted in a housing on the rotor shaft.
Several disadvantages are encountered when employing individual semiconductor diode rectifiers. For example, mounting complexity is encountered due to the physical stresses from the rotational"6" forces at speeds up to 20,0~0 RPM, which are used in aircraft generators and motors.
Also, since the casing of the semiconductor d;ode rectifier is usually the anode or the cathode of the device, the rectifier must be insulated from the mounting base if the moun~ing base is conductive. Moreover, reliability of the rectifier is degraded due to the complexity of the entire rectifier assembly. Also, effective cooling of the semiconductor diode rectlfier is difficult to obtain since there is a high thermal resistance between the outer casing of the semiconductor diode assembly and the wafer within. Thus, even if the rectifier assembly is immersed in a cooling medium, inefficient cooling results. -Considering these drawbacks, I have developed a rectifier assembly ~ ;
for a synchronous machine which is easily mounted to the housing, insulated from the mounting base, capable of wl~hstanding centrifugal force created at normal operating speeds and is efficiently cooled. The assembly can be connected as either a half wave or a full wave rectifier.
7~
_ A plurality of semiconductor wafers forming either a half wave or a full wave rectifier are conta;ned within a rectifier assembly attached directly to an inner section of a housing mounted on a shaft of a synchronous machine. In one embodiment, the assembly is provided wlth inlets and outlets for the passage of a cooling medium. The cooling medium traverses the surface of the semiconductor wafers to provide high efficiency heat removal. In another embodiment, the cooling medium traverses the face of a heat sink on which the wafers are mounted.
It is a feature of the present invention to provide a rectifier assembly which permits the cooling medium to traverse the surface of the semiconductor wafers within the rectifier assembly.
Another feature of the present invention is to provide a rectifier assembly having a heat sink wherein the cooling medium traverses the heat sink to remove heat.
Yet another feature of the present invention is to provide a rectifier assembly which is efficiently cooled and capable of withstanding high centrifugal forces and has a high reliability.
Other features of the invention will become apparent when considering the specification and the drawings in which:
DRAWIN~S
Fig. 1 is a cross-sectional view of a brushless alternating current generating system having a rectifier assembly of the present invention;
Fig. 2 is a schematic diagram of a full wave rectifier for converting three-phase AC to DC;
Fig. 3 is a half wave rectifier for converting three-phase AC to DC;
Fig. 4 is an end view of the brushless alternating current generating system of Fig. 1 taken through the line 4-4;
Fig. 5 is a perspective view of one of the three casings which house the semiconductor wafer in the rectifier assembly; and Fig. 6 is a perspective view of an alternative construction of the rectifier assembly.
Referring to Fig. 1, brushless alternating current generating system 10 is shown. Although the invention will be described for use in conjunction with a synchronous generator, it also may be used with a synchronous motor. The generating system 10 includes rotatable shaft 12 driven by an external source (not shown) to produce an AC output from terminals 14. The system may provide a single phase or a polyphase voltage supply. As shaft 12 rotates, AC armature 16, wound around an annular housing 18, provides a polyphase excitation power source for the system as AC armature 16 cuts through the DC exciter field established by DC windings 20. The AC from armature 16 ls rectified by rectifier assembly 22 which is located in an inner section 24 of annular housing 18. Rectifier assembly 22 iS connected to provide either a half wave or a full wave rectifier and is coupled to DC field winding 26 by leads (not shown) from the terminals, as terminal 30.
DC field windings 26 are secured to shaft 12 and spaced apart from housing 18 by spacer 32. As shaft 12 rotates, current provided DC field winding 26 establishes a DC field which cuts through AC output windings 34. The AC output windings 34 provide the single phase or polyphase supply and are connected to terminals 14. Housing 36 is provided with a cooling medium, as oil or air. Suitable inlet and outlet ports (not shown) to and from the generator assure adequate cooling of the alternating current generating system 10 during operation in the well known manner. Also, each end of shaft 12 is provided with suitable bearings, as bearings 38, to enhance rotation.
An electrical schematic of a full wave rectifier is shown in Fig. 2 as having three pairs of diodes 40, 42 and 44. An electrical schematic of a half wave rectifier having diodes 46, 48 and 50 is shown in Fig. 3. As will be explained in greater detail below, either the full wave or the hal~
wave rectifier is contained by rectifier assembly 22, and in either case, the DC voltage output therefrom is provided to DC windings 26.
Referring to Fig. 4, rectifier assembly 22 is shown and includes three individual casings 52, 54 and 56 symmetrically disposed about shaft 1~6678 1 ~ in inner sec~ion 24 of annular housing 18. Each casing contains diode pair 40, 42 and 44, respectively. The leads from the diodes of each casing may be interconnected to form the full wave rectifier of Fig. 2.
Referring to Fig. 5, the construction of casing 52 of rectifier assembly 22 will now be described. The discussion relating to the construction of casing 52 equally applies to similarly constructed casings 54 and 56. Cover 53 of casing 52 is mounted on a conductive shell 58.
Diode wafers, such as semiconductor wafers 60 and 62, are mechanically and electrically attached to conductive shell 58. Specifically, the flat ~0 planar anode surface of diode wafer 60 is attached to shell 58 and the flat planar cathode surface of diode wafer 62 is attached to shell 58. High temperature solder or an adhesive which is electrically conductive may be used to attach the wafers to the shell. The conductive shell 58 provides a common terminal between wafers 60 and 62 of diode pair 40 for applying phase A of the AC voltage input (Fig. 2). Since cover 53 is in mechanical contact with shell 58, terminal 64 mounted on cover 53 is used for providing the conductive shell 58 with the polyphase AC source. Leads 66 and 68 are secured to the upper surface of wafers 60 and 62, respectively, to connect the diodes to terminals 70 and 72 which are mounted on, but electrically insulated from, cover 53. A coating compatible with the cooling material may be apptied over the chips to isolate them from contaminants present in the cooling medium.
Casing 52 is electrically insulated from the annular housing 18 by insulative pad 59 and is attached to housing 18 by screws 74 and 76.
Insulative washers 78 and 80 electrically insulate the screws from cover 53. Cover 53 is spaced apart from the inner wall 84 of the base plate by a distance d to form an arcuate inlet. Nonconductive coolant material, as air or lubricating oil, blowing in a direction generally parallel with the shaft 12, enters the inner cavity of casing 52 between inner wall 84 and cover 53. An example of how hydraulic lubricating oil can be used to cool the various components of a high speed aircraft-type generator is provided in Baits U.S. Patent No. 3,576,143. The flow of the coolant material is provided directly across the surface of wafers 60 and 62 or across the 1 r,otective coating. Because the coolant is in direct contact with the semiconductor material itself, particularly efficient heat removal is attained, thereby allowing the rectifier diodes to operate at substantially lower temperatures and thus increasing the life and reliability of the wafers. Slots 86 in cover 53 provide an outlet for the coolant material and since the rotor and hence the cover are rotating, centrifugal force will cause the coolant to flow over the diodes 60 and 62 and out of the casing 52. As shown in Fig. 1, housing 18 may be provided with channels 88 to enhance coolant flow through the entire housing if desired.
Referring to Fig. 6, an alternative construction of the rectifier assembly is shown. Nonconductive plate 90 forms the base of assembly 92.
Plate 90 has a large center hole 94 which accommodates shaft 12, and six small holes, as hole 96, for cooling, as will be explained below.
Diode triplet assemblies 98 and 100 are secured to the nonconductive base plate 90. Each triplet assembly has three diodes secured to the upper surface of conductive heat sinks 102 and 104, respectively. Conductors ~not shown) are secured to each individual diode wafer of the triplet assembly and to protrusions 106 and 108 on triplet assemblies 98 and 100. The other ends of the conductors are coupled to terminals 110, 112, 114, 116 and 118, which are mounted on nonconductive cover 120. The connection of the conductors with the wafers and the protrusions 106 and 108 correspond to the connections shown in the schematic diagram of Fig. 2. The assembly is encapsulated in epoxy or other suitable material, retaining cover 120 over base plate 90.
The construction of diode triplet assembly 98 will now be described. Wafers 122, 124 and 126 are electrically and mechanically attached to conductive heat sink 102. Eaçh of the wafers represents one-half of the diode pair 40, 42 and 44, respectively, as best shown in Fig. 2. The flat planar cathode surface of each of the wafers 122, 124 and 126 is attached to conductive heat sink 102. Positive DC potential is therefore available from the outwardly extending protrusion 106.
The construction of diode triplet assembly 100 will now be described. Wafers 128 and 130 and a third diode (not shown) are 7~3 1 lectrically and mechanically attached to conductive heat sink 104. Each of the wafers represents one-half of the diode pair 40, 42 and 44, respectively, as best shown in Fig. 2. The flat planar anode surface of each of the wafers 128 and 130 and the third diode is attached to the inductive heat sink 104. Negative DC potential is therefore available from outwardly extending protrusion 108.
Assembly 92 is rigidly attached to the annular housing 18 of AC
armature 16 of the generating system 10 by an adhesive. If housing 18 is provided with suitable passsageways or openings for cooling medium, efficient heat removal occurs when the cooling material traverses the rear side of heat sinks 102 and 104 through the six holes, as hole 96.
The above explanation specifically relates to rectifier assemblies providing full wave rectification. A half wave rectifier, as shown in Fig.
3, could be constructed by providing casings 52, 54 and 56 with a single diode wafer representing diodes 46, 48 and 50 (as shown in Fig. 2).
Similarly, if a half wave rectifier is employed in the assembly shown in F;g. 6, only one diode triplet would be employed. In such a case, rotational balance must be maintained during the operation of the generator.
Finally, although the use of silicone wafers is preferred, diode wafers constructed of other semiconductive materials may also be used.
3o
Claims (3)
1. In a synchronous machine having a rotor, a rectifier assembly rotatable with the rotor for providing rectified DC
from an AC power source to a main rotating field comprising:
a conductive base secured to the rotor;
a first and a second diode wafer having an anode sur-face and a cathode surface, the anode surface of the first diode wafer and the cathode surface of the second diode wafer attached to and electrically conductive with the conductive base;
a cover mounted over the base to form a housing for the first and the second diode wafers;
terminal means mounted on the easing; and connecting means for connecting the cathode of the first diode wafer, the anode of the second diode wafer and the conductive base to the terminal means.
from an AC power source to a main rotating field comprising:
a conductive base secured to the rotor;
a first and a second diode wafer having an anode sur-face and a cathode surface, the anode surface of the first diode wafer and the cathode surface of the second diode wafer attached to and electrically conductive with the conductive base;
a cover mounted over the base to form a housing for the first and the second diode wafers;
terminal means mounted on the easing; and connecting means for connecting the cathode of the first diode wafer, the anode of the second diode wafer and the conductive base to the terminal means.
2. The synchronous machine of claim 1 further including:
means for providing a cooling medium to the first and second diode wafers.
means for providing a cooling medium to the first and second diode wafers.
3. The synchronous machine of claim 2 wherein the means for providing a cooling medium to the first and second diode wafers includes:
an opening in the housing for providing an inlet for the cooling medium; and a plurality of slots in the housing for providing an outlet for the cooling medium.
an opening in the housing for providing an inlet for the cooling medium; and a plurality of slots in the housing for providing an outlet for the cooling medium.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US80530477A | 1977-06-10 | 1977-06-10 | |
| US805,304 | 1985-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1116678A true CA1116678A (en) | 1982-01-19 |
Family
ID=25191205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000301042A Expired CA1116678A (en) | 1977-06-10 | 1978-04-13 | Rectifier assembly for a synchronous machine |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS545534A (en) |
| CA (1) | CA1116678A (en) |
| DE (1) | DE2819824A1 (en) |
| FR (1) | FR2394200A1 (en) |
| GB (1) | GB1588567A (en) |
| IL (1) | IL54747A (en) |
| SU (1) | SU778719A3 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2929553C2 (en) * | 1979-07-18 | 1984-06-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Cooling arrangement for semiconductor rectifier elements |
| US4794510A (en) * | 1986-12-23 | 1988-12-27 | Sundstrand Corporation | Rectifier assembly |
| US7511392B2 (en) * | 2005-06-17 | 2009-03-31 | Hamilton Sundstrand Corporation | Rotating rectifier module |
| US20080218035A1 (en) * | 2007-03-09 | 2008-09-11 | C.E. Niehoff & Co. | Rotating rectifier assembly |
| DE102020216485A1 (en) * | 2020-12-22 | 2022-06-23 | Mahle International Gmbh | Rotatable electrical rectifier for a separately excited synchronous machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1068817B (en) * | 1958-03-22 | 1959-11-12 | Siemens-Schuckertwerke Aktiengesellschaft, Berlin Und Erlangen | Arrangement of semiconductor rectifiers on a rotating shaft |
| US3059168A (en) * | 1959-12-07 | 1962-10-16 | Gen Motors Corp | Brushless generator rectifier assembly |
| FR1524305A (en) * | 1967-03-30 | 1968-05-10 | Unelec | Improved mounting of rectifiers on the rotating part of an electric machine |
| GB1296210A (en) * | 1969-06-09 | 1972-11-15 | ||
| US3576143A (en) * | 1969-09-05 | 1971-04-27 | Sundstrand Corp | Constant speed drive and generator |
| US3739209A (en) * | 1972-08-31 | 1973-06-12 | Gen Motors Corp | Rectifier assembly |
| FR2262232A1 (en) * | 1974-02-27 | 1975-09-19 | Sev Marchal | Anti vibration mounting for diode rectifiers - fitted to small alternators such as on cars |
-
1978
- 1978-04-13 CA CA000301042A patent/CA1116678A/en not_active Expired
- 1978-05-05 DE DE19782819824 patent/DE2819824A1/en active Granted
- 1978-05-08 FR FR787813512A patent/FR2394200A1/en active Granted
- 1978-05-18 IL IL54747A patent/IL54747A/en unknown
- 1978-05-25 GB GB22563/78A patent/GB1588567A/en not_active Expired
- 1978-06-08 JP JP6839178A patent/JPS545534A/en active Pending
- 1978-06-09 SU SU782625452A patent/SU778719A3/en active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2819824A1 (en) | 1978-12-21 |
| IL54747A0 (en) | 1978-07-31 |
| SU778719A3 (en) | 1980-11-07 |
| FR2394200A1 (en) | 1979-01-05 |
| DE2819824C2 (en) | 1988-05-19 |
| JPS545534A (en) | 1979-01-17 |
| IL54747A (en) | 1981-09-13 |
| FR2394200B1 (en) | 1983-08-19 |
| GB1588567A (en) | 1981-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |