CA1112769A - Substance-sensitive electrical structures and method for making same - Google Patents
Substance-sensitive electrical structures and method for making sameInfo
- Publication number
- CA1112769A CA1112769A CA317,549A CA317549A CA1112769A CA 1112769 A CA1112769 A CA 1112769A CA 317549 A CA317549 A CA 317549A CA 1112769 A CA1112769 A CA 1112769A
- Authority
- CA
- Canada
- Prior art keywords
- substance
- sensitive
- layer
- photoresist
- test medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Disclosed is a substance-sensitive semiconductor and a method for making the same, wherein a substance-sensitive material is combined with photoresist material and applied to an electronic device structure. The substance-sensitive material may be applied before or after the photoresist material, or even may be combined with the photoresist material to form a substance-sensitive layer of photoresist material on the semi-conductor. The photoresist material is then processed, such that unwanted, or undesirable areas are free from the photoresist material and the areas of desired substance sensitivity have a fully processed photoresist layer. A further embodiment of the present disclosure provides multiple layers sensitive to different ions on a single sheet or semiconductor or electromagnetically active material.
Disclosed is a substance-sensitive semiconductor and a method for making the same, wherein a substance-sensitive material is combined with photoresist material and applied to an electronic device structure. The substance-sensitive material may be applied before or after the photoresist material, or even may be combined with the photoresist material to form a substance-sensitive layer of photoresist material on the semi-conductor. The photoresist material is then processed, such that unwanted, or undesirable areas are free from the photoresist material and the areas of desired substance sensitivity have a fully processed photoresist layer. A further embodiment of the present disclosure provides multiple layers sensitive to different ions on a single sheet or semiconductor or electromagnetically active material.
Description
7~
BACKGROUND O~' TEIE INVENTION
The present invention relates generally to electronic and electromagnetic devices for the determina-tion of the presence and strength of selected substances which include ions, molecules and ligands.
Often times it is advant:ageous to detect the exis-tence and/or concentration of substances in the atmosphere or solutions.
Generally such detectors involved exposure of a chemical com-pound to the test medium with the indication of existence and/or concentration being provided by a color change, the formation of a precipitate, etc.
In the recent past, however, i-t has become possible to provide semiconductors which are sensitive to the existence of specific substances in liquids or gases, and provide an alectrical indication of both the presence an~ concentration therein.
Examples of these are the ion-sensitive field effect transistor (ISFET), one example of which is shown in U.SO Patent 3,831,432~
and the ion controlled diode disclosed in U.SO Patent ~,103,227, which issued July 25, 1978. Both devices .
.
~ ~ ' ' ' , ,.
.
\. '. . . ' . .
:' ' ' : .
' .
' ' . ' ' ,' ' . ~ ., ~ . , . .. ~ ... . .. ; , .
- . . -. -, . . . , . ~ . : : . . :
:, ~ .
~27~
incorporate an ion sen5itive membrane which form~ a charge layex near the semiconductor ~unction which i~
dependPnt upon the concentration of the ion, molecule or co~lex, whose concentration is to b~ determuned~
The s~bstance-sensitive ma1:erial varies widely in its individual makeup dependent upon the parti~u~ar 3ubstance to which the material is sen~itive. Many dif~erent materials can be used in the me~brane con~t~uction in order to achie~e varied substance-~en~itivity. ~or example, one such substance-sensitive material which is sensiti~e to potassium ions ~K~ ions ) valinomycin. Some other substance-sensitive ~aterials are listPd in Me~brane E~ectrodes by N. ~akshminar2yanaiah~
_ .
Academic Press, 1976. - `
In ~he prior art substance-sensitive de~ices t the ~ubstance-sensitive material is formed into a cast mbrane which is then located over ~he semueonductor deYice. Al~ernately, the semiconductor de~ice can be ~oated with the appropriate materialO ~hile these ~hods o~ ~orming the substan e-sensitive m~mbrane are u~table for a single de~ic~ capable of providing an .
. ~ . 3 ~
- ' ' ... . , , , , . -. .. - ' .' -. . : : . ~ : :,:. ~
. ~ . . ~ . . .
. ~ : . . : ~ ..
electxical indication o:E t:he concentration of a s~ngle oomplex, it is extremely diffisult to utilize cas~
mRmbraneQ, or ~u~tance-~ensitive coatings, to render only discr~te portion~ of a Large-Scale Integrated (LSI) circuit involving s~miconductors, microwave striplines or lntegrat~d optical st:ructures sensitive to the substance. Thu5, in the comm~n mass productio~ of ~ntegrated cir~uits, it i~ extremely difficult-, if not.
~ mpossible, to provide appropxiate amplifier circuitxy along with a substance-sensor in a mass-produced ~ntegrated semiconductor, microwave or optical circuit.
. - The dificulty of obtaining prPcise placem~nt - : ~measuxed in microns) of a cas~ membr~ne, eliminates the applica~ility of cast membran~s to LSI structures., If existing LSI structures are coated with substance-sensitiYe materials, it would be possible to detect : only ane substance! and not a plurali y of different stances.
S UMMA RY OF T HE INVENT ION
Therefore, it is an object o~ ~he prese~t invention ~ provide a semiconductor, microwave, or optical device which i~ sensitive and provides an electrical indication , - .
~ -- 4 --7~
of the existenca and/or co~centration of a predetermined .~ubstance, which device can be produced ~ accordance with existing mass production techni~ues.
It is a furthe~ ob~ject of the present invention to provide a method of forming a substance-sensitiv~
semiconductor, microwave or optical device under current mass produc~ion ~echnol~gy.
It is a still further object of the presen~
invention to provide a method of forming substance-~ensitive layers on semiconductors, mucrowave or optical devices which are sens~tive ~o different ~ub~tances utilizing curren~ ma-~s production techn~logy.
. An additio~al object of the present invention is to provide a substance-sensitive semiconductor having a substance-sensitive photoresist layer which is compatible with large-scale integrated circuit technology.
It is a still further object o~ the present ~nvention to provide a substance-sensitive semiconductor which incorpora~es multiple substance-sensitive sensvrs.
The above, and other ob jects, are achiPved by the method of incorporating substance-sensitive material with pho~oresist material, and applying the combination to the required portion of a semiconductor. The ' ,' :
. ~ 5 ~
. . . . : . .. .; . .. .
, ~ , .: .
.. , ,. ,. . . . ,: .. . ., . : :
- . . . - . .. . .
~: :
7~ ~
photoresist material is masked, exposed to radiation, etched and chemucally treated to leav~ a ~ubstance-~Qnsitive photoresist layer only on selected portion~
of ~he semiconductor mate~ria~. In preferred enbodiments, a plurality of photoresist layers sensitiYe to differing substances can be provided on adjacent portion-q of a laxge scale integrated circuit chip~
.
BRIEF DESCRIPTION OF_THE DRAWINGS
A mors complete appreciation of the invention, and ~he attendant advanta~s thereof, will be more clearly understood ~y reference to the following drawings, wherein:
Figures la-lj are partial, cut-away views of semiconductor material showin~ the steps utilized in preparing two substance-sensitive membranes, each membrane sensitive to a different substance;
Figure 2 is a schematic view of a capacitive ~ application of the substance-sensitive layer; and ; Fi~ure 3 is a schematic ~iew of an inductlve application ~f the substan~e~sensitive la~er.
- 6 ~
~ .
. , ' ' ' .
, ~: .
.
". " : , 7!69 DETAIL~D DESCRIPTION OF A PREFE~ED EMBODIMENT
... . ..
The term photoresist material applie~ to a large number o f comm~rcially available material~ which are used in the preparation of semiconduct:ox circuitry.
The unique property of photoresist material is that .exposure to radiation cause~, or prevents, polymerization o the photoresist material, such that the unpolymerized material can be later removed from the device to which the photoresist was initially applied. The term .
photore~is~ material, as applied to the present invention, incorporates all materials which are sensiti~e to radiation exposure (whether it be visible light, ul~raviolet, ~nfrared, X-ray, electron ~eam, ion be~m, ~tc. radiation) when th~ activation (exposure, or ~on~
expo~ure1 prevents, or causes, a change ~n ~he etching rate o.r po~ymerization in the material itself. It i~
this property which enable~ the pre~ent me~hod to achieve the very precise edge de~inition to substance-sensitive .
~ m~mbranes ~rhich.has heretofore been impo~sible with : cast, or coating, type membranes.
As noted eaxlier in the Background ~f the Presen~
~ ~ Invention, there are a number of materials which are : ~ .
. .
: .
' ~27Çi~
sen~itive to the prese~ce an~/or concentrat1on of various s~tances ~ion3, molecules, ligands and other chemical groups~. Because the etching or removal rate of photoresist material changes when activated (by exposure, or non-exposu:re, to particular r~diation~
depending upon the type of photore~ist~, small quantitites of ~ubstance-seslsitive materials ~an be dissolved, and ~hen, ~ixed in the photoresist material by the activation process. If a photoresist material is doped with a substance-sensitive material, and s~sequently ac~iva~ed, ~he result i~ a substance-sensitive layer which will remain on the surface of the structure to which the phot~resist-material i~ initially applied.
~e~ Vs~
Eccua_c the combina-tion of pho~oresist material and substance-sensitive ~aterial produces a ma~erial whose xemaining existence on a surface is dependent upon whether or not it has been exposed to the radiation or not, extremely sharp and precise definition can be given to the edges of photoresist material having the ~ubstance-sensitive material suspended therein. Thus, substance-sensitive photoresi3t layers can be placed on sur~acles with an accuracy measured in microns, - 8 -:
'' .
.
.
.
- : , .
.
7Ç~
permitting the application of a plurality of extrem~ly accurate chemical sensors to be produced on.a singl~
sub~trateO
The negative photoresist is act~vated when exposed to the appropriate radiation, and the positive-type photoresist is activated unless it i~ exposed to ~he appropriate radiation.
It i~ understood that th~ ~erm nproce~sing~
encompasses the ~teps o~ selectively activating and removing substance-sensitive photoresist material to leave a substance-sensitive photoresist layer at a designated location, ~aid steps dependent upon the type ~f photoresist material chosen.
By the same token, layers of substance-sensitive photoresist can be applied to the same substrate, each layer beinq sen~itive to a differenk type o~ substance.
An exa~ple of ~he inventive method applied to a two substance-sensitive semiconductor i~ shown in Figures la-l~ O
A ~emiconductor substrate 10 is shown in Figure la, comprising P-type and N-type semiconductor material~.
Because several substance-sensitive elements are going :, ' . . . ' ' -- g _ .
.
~27~
to be placed on the single substrate, a pluxali'cy of P/N junctions are pxovided. A passivation layer 12 is applied to the ~ubstrate, with 'che exception of the prepared places 14 asld 16 where th~ membrc~e layers arç~
~ he placed~ The prepared places may include a blocking layer to prevent either electxonic or ionic conduction, or mass diffusion, as hecessaryO The passivation l~yer may comprise silicon dioxide ~SiO2), or any other suitable isolation material known t~ those ~n the art.
A first layer o substance-sensitive photoresist material is applied over prepared places 14 and 16, as well as the passivation layer 12. The substance-sensitive photoresist layer can be applied by first coating the passiva ion layer, and prepared spaces~ with a layer of substance-sensitive material, over which is placed a layer of photoresist material, such that ~he substance-sensitive diffuses into the photoresist layer.
Alternatively, a layer vf photoresist material oan be.
. . -: . . .
applied with a coating of substance-sensitive material hereover. The substance-sensitive material is permitted to difuse into the photoresist material, fonning a .
-- 10 -- .
.:
' -. ~ . . :
~ . . .
.. . ..
: ' `
.
,:
., :
~276~
~ubstance-sensit~ve photoresist layer. In a pr~ferred embodiment, a substance-sensitive material - i~ first mixed with the photoresist material, and then, applie~ to the substrate as a ~ubst~nce-sensitive photore~ist layer.
-. The ~ubstrate, covered with the substance-sensitive photoresist layer 18, is covered by a suitable mask 20, and subjected to an appropriate radiation indicated by arrows 22. A~ is known, photoresi6t material comprises two primary groups, positive and negative photoresi~t.
In ~his instance, a negative-type polymerizable photo-xesist material is depicted, with an appropriate mas~ 20 to polymerize the substance-sen~itive photo-resist materiai in the vicinity of prepared space l~v If a positive-type photoresist material were used, the mask would cover only the vicinity o~ prepared space 14, allowing the rest of the photoresist material to be exposed to radiation 2~, thus, preventing its polymeri~ation~
The unpolymeri~ed substance-sensitive photoresist material is ~emoved by conventional etching procedures, leaving a single substance-sensitive photoresis~ layer .
'.
: . -, , - : , . . . :
- , ; - : :
.. i , . . , ~ . . ~ .
.
76~
24 in the region of prepared spac~ 14.
A second layer of substance-sensikive photoresi~t material 26 is placed over the substrate and isolation layer. However, the second layex o substance-sensitive photoresist may be sensitive to a substance di~ferent from that of said ~irst substa~ce-sensitive pho~cresist layer~ As shown in Flgure 1~, a suit~ble ma~k 28 is placed over ~he coated sub~trate, with arrows 22 indicating the radiation for polymerizing ~he photoresist layer in the vicinity o~ prepared space 16. ~fter suitable etching and processing steps, tlle substrate, as indicated in Fi~ure lh, has a substance-sensitive photoresist layexs 24 and 26, ~hich are responsive to different substances. ~fter ~he addition o~ reference electrodes 30 and 32, and suitable contact electrodes 34, the chemical sensor is ready for operational use/ as indicated in Figure lj.
It should be noted that, although a multiple substance-sensitive chemical sensor has been shown ln Figure~ la-lj, the procedure would be precisely the same for ma~ing only a single substance-sensitive photo re3ist layer, or fox making a plurality of substance~
:.
.
, ,. , :
- 12 ~ -, :~
~:
.' -' . .- :.
.
.
~27~
~ensitive photoresist layexs which are sensiti~e to diferent substancesO
I'c is clear that many differ~llt types o photo-resist material, both positive and negative, can be utilized in accordance with the present invention. The process of photopolymeri~ation and the physic21 and chemLcal properties of a number o~ different photo-resist materials are further discussed in Solid State Technology, J~e and September, 1971, and Electronic Components, June 29, July 27 and August of 19 73 .
For providing a 3ubstance-sensitive pll~toresist layer whicn ~s ~ensitive to potassiwn ~S+) ions ,. ~.7alino~cin can be utilized, which is avail2ble from Cal-}3io Chem, Eas~
Rutherford, New Jersey. One specific photoresist material which was used is type AZ }350J, available ~om Ship ley, All entown , Pe nns yl vani a O I t is cle ar that many other types of pho~oresist material, bo th po~iti~re and negative, can be utilized in accordance with the present inver tion.
Sim~larly, in order to obtain pho~oresist layers which are sensitiYe to different su~stance, differerlt .
.
::
?~
,h,~,~. .
., - ` ' ' ' ' ' ' ~, . .. , , ~ ... .
~2~
substance-sensitive ma~erial can be utilized as herein before noted. ~n a prefexred embodiment in which the sub~tance-sensitive material i~ mixed with the photo-resist mat~rial and then applied to the ~ubstrate, 10 mg. of valino~cin WclS di~solved in 10 cc. of negative photoresist material. The substance-sensitive pho~oresist material was spun onto a ~ilicon wafer coated with a 6,000 A thick lay~r of silicon dioxid~, utili~ing standard methods. The substance-sensitiye photoresist layer was preb~ked at a te~perature o~ 50 C for a short period of time and then exposed to ultraviolet radiation in a s~andard mask aligner in ordex to polymerize the materials. Two micron ~hick and thinner layers of substance-sensiti~e photoresist material have been provided, which. give the necessary sensitivity to the existence, and concentration, of pot~ssium ions.
Instead of providing multiple layer~ on an ion controlled diode, as represented in Figures la~ he applicants' inventive method could be applied to providing substance-sensitive photoresist layers on ion sensitive field-effect transistors (ISFET) as tauyht in , ' ' ' . ' ' .
.
. j .. - ~ ' ' " ' ~
., . . ~ ,. .
, .
7~
UO S. Patent 3,~31,432. Although the operation of ~he semiconductor device is diEferent from that of an ion controlled diode, the effect of the substance-~erlsitive photoresist la~yer is simllar, and the inventive method can be utilized interch~ngeably for ion co~trolled diodes, ISFET's or combinations thereof.
In fact, the inventive method o~ the present invention can be applied to electronic structures other khan semiconductors. Figure 2 illustrates the utilization of a substance-~ensitive photoresist layer to vary the capacitance between the xeference electrode 40 and a base electrode 4Z. The test medium 44 (the material in which it is desired to sense the presencé, or concentrakion, of ~he desired substance) cause~
changes in the dielectric constant of the substance~
sensitive photoresist layer 24, when ~he desired ~ubsta~ce is present. An isolation layer 41, upon which the photoresist layer is applied, sexves to prevent the test medium from shortiny the capacitor plates or ~he photoresist layer. The above is a pre~erred embodiment, although one could easily locate the phoko~
resist layer on its o~n isolation layer at any point - LS -' : . . - ~ . .- . .
~ . . - . .--- .- - ' . - : : :: . . . ' . :.
,C3 between the capacitor plates. These changes in the dielectric constant are reflected in changes in capacitance between the reference electrode 40 and the base electrode 42. These changes in capacitance can be measured, such that a digital outpu-t indicative of the concentra-tion of the unknown complex is provided, as is shown in the above-mentioned U.S. Patent No.
4,103,227. .
Similarly, changes in permittivity and permeability in the substance-sensitive photoresist layer in response to the presence o the desired substance, can be reflected in changes of the coupling between two lines, as is shown in Figure 3. An input line 50, and an output line 52, are coupled in part by a substance-sensitive photoresist layer 24. Test medium 44 causes changes in the permittivity and permeability of the substance-sensitive photoresist layer, which ultimately causes a change in the coupling between the input line 50 and the output line 52, which change can be measured providing an indication of the con-centration of the desired substance. While the Figure 2 embodi-ment would have a D.C. or low frequency application, the Figure 3
BACKGROUND O~' TEIE INVENTION
The present invention relates generally to electronic and electromagnetic devices for the determina-tion of the presence and strength of selected substances which include ions, molecules and ligands.
Often times it is advant:ageous to detect the exis-tence and/or concentration of substances in the atmosphere or solutions.
Generally such detectors involved exposure of a chemical com-pound to the test medium with the indication of existence and/or concentration being provided by a color change, the formation of a precipitate, etc.
In the recent past, however, i-t has become possible to provide semiconductors which are sensitive to the existence of specific substances in liquids or gases, and provide an alectrical indication of both the presence an~ concentration therein.
Examples of these are the ion-sensitive field effect transistor (ISFET), one example of which is shown in U.SO Patent 3,831,432~
and the ion controlled diode disclosed in U.SO Patent ~,103,227, which issued July 25, 1978. Both devices .
.
~ ~ ' ' ' , ,.
.
\. '. . . ' . .
:' ' ' : .
' .
' ' . ' ' ,' ' . ~ ., ~ . , . .. ~ ... . .. ; , .
- . . -. -, . . . , . ~ . : : . . :
:, ~ .
~27~
incorporate an ion sen5itive membrane which form~ a charge layex near the semiconductor ~unction which i~
dependPnt upon the concentration of the ion, molecule or co~lex, whose concentration is to b~ determuned~
The s~bstance-sensitive ma1:erial varies widely in its individual makeup dependent upon the parti~u~ar 3ubstance to which the material is sen~itive. Many dif~erent materials can be used in the me~brane con~t~uction in order to achie~e varied substance-~en~itivity. ~or example, one such substance-sensitive material which is sensiti~e to potassium ions ~K~ ions ) valinomycin. Some other substance-sensitive ~aterials are listPd in Me~brane E~ectrodes by N. ~akshminar2yanaiah~
_ .
Academic Press, 1976. - `
In ~he prior art substance-sensitive de~ices t the ~ubstance-sensitive material is formed into a cast mbrane which is then located over ~he semueonductor deYice. Al~ernately, the semiconductor de~ice can be ~oated with the appropriate materialO ~hile these ~hods o~ ~orming the substan e-sensitive m~mbrane are u~table for a single de~ic~ capable of providing an .
. ~ . 3 ~
- ' ' ... . , , , , . -. .. - ' .' -. . : : . ~ : :,:. ~
. ~ . . ~ . . .
. ~ : . . : ~ ..
electxical indication o:E t:he concentration of a s~ngle oomplex, it is extremely diffisult to utilize cas~
mRmbraneQ, or ~u~tance-~ensitive coatings, to render only discr~te portion~ of a Large-Scale Integrated (LSI) circuit involving s~miconductors, microwave striplines or lntegrat~d optical st:ructures sensitive to the substance. Thu5, in the comm~n mass productio~ of ~ntegrated cir~uits, it i~ extremely difficult-, if not.
~ mpossible, to provide appropxiate amplifier circuitxy along with a substance-sensor in a mass-produced ~ntegrated semiconductor, microwave or optical circuit.
. - The dificulty of obtaining prPcise placem~nt - : ~measuxed in microns) of a cas~ membr~ne, eliminates the applica~ility of cast membran~s to LSI structures., If existing LSI structures are coated with substance-sensitiYe materials, it would be possible to detect : only ane substance! and not a plurali y of different stances.
S UMMA RY OF T HE INVENT ION
Therefore, it is an object o~ ~he prese~t invention ~ provide a semiconductor, microwave, or optical device which i~ sensitive and provides an electrical indication , - .
~ -- 4 --7~
of the existenca and/or co~centration of a predetermined .~ubstance, which device can be produced ~ accordance with existing mass production techni~ues.
It is a furthe~ ob~ject of the present invention to provide a method of forming a substance-sensitiv~
semiconductor, microwave or optical device under current mass produc~ion ~echnol~gy.
It is a still further object of the presen~
invention to provide a method of forming substance-~ensitive layers on semiconductors, mucrowave or optical devices which are sens~tive ~o different ~ub~tances utilizing curren~ ma-~s production techn~logy.
. An additio~al object of the present invention is to provide a substance-sensitive semiconductor having a substance-sensitive photoresist layer which is compatible with large-scale integrated circuit technology.
It is a still further object o~ the present ~nvention to provide a substance-sensitive semiconductor which incorpora~es multiple substance-sensitive sensvrs.
The above, and other ob jects, are achiPved by the method of incorporating substance-sensitive material with pho~oresist material, and applying the combination to the required portion of a semiconductor. The ' ,' :
. ~ 5 ~
. . . . : . .. .; . .. .
, ~ , .: .
.. , ,. ,. . . . ,: .. . ., . : :
- . . . - . .. . .
~: :
7~ ~
photoresist material is masked, exposed to radiation, etched and chemucally treated to leav~ a ~ubstance-~Qnsitive photoresist layer only on selected portion~
of ~he semiconductor mate~ria~. In preferred enbodiments, a plurality of photoresist layers sensitiYe to differing substances can be provided on adjacent portion-q of a laxge scale integrated circuit chip~
.
BRIEF DESCRIPTION OF_THE DRAWINGS
A mors complete appreciation of the invention, and ~he attendant advanta~s thereof, will be more clearly understood ~y reference to the following drawings, wherein:
Figures la-lj are partial, cut-away views of semiconductor material showin~ the steps utilized in preparing two substance-sensitive membranes, each membrane sensitive to a different substance;
Figure 2 is a schematic view of a capacitive ~ application of the substance-sensitive layer; and ; Fi~ure 3 is a schematic ~iew of an inductlve application ~f the substan~e~sensitive la~er.
- 6 ~
~ .
. , ' ' ' .
, ~: .
.
". " : , 7!69 DETAIL~D DESCRIPTION OF A PREFE~ED EMBODIMENT
... . ..
The term photoresist material applie~ to a large number o f comm~rcially available material~ which are used in the preparation of semiconduct:ox circuitry.
The unique property of photoresist material is that .exposure to radiation cause~, or prevents, polymerization o the photoresist material, such that the unpolymerized material can be later removed from the device to which the photoresist was initially applied. The term .
photore~is~ material, as applied to the present invention, incorporates all materials which are sensiti~e to radiation exposure (whether it be visible light, ul~raviolet, ~nfrared, X-ray, electron ~eam, ion be~m, ~tc. radiation) when th~ activation (exposure, or ~on~
expo~ure1 prevents, or causes, a change ~n ~he etching rate o.r po~ymerization in the material itself. It i~
this property which enable~ the pre~ent me~hod to achieve the very precise edge de~inition to substance-sensitive .
~ m~mbranes ~rhich.has heretofore been impo~sible with : cast, or coating, type membranes.
As noted eaxlier in the Background ~f the Presen~
~ ~ Invention, there are a number of materials which are : ~ .
. .
: .
' ~27Çi~
sen~itive to the prese~ce an~/or concentrat1on of various s~tances ~ion3, molecules, ligands and other chemical groups~. Because the etching or removal rate of photoresist material changes when activated (by exposure, or non-exposu:re, to particular r~diation~
depending upon the type of photore~ist~, small quantitites of ~ubstance-seslsitive materials ~an be dissolved, and ~hen, ~ixed in the photoresist material by the activation process. If a photoresist material is doped with a substance-sensitive material, and s~sequently ac~iva~ed, ~he result i~ a substance-sensitive layer which will remain on the surface of the structure to which the phot~resist-material i~ initially applied.
~e~ Vs~
Eccua_c the combina-tion of pho~oresist material and substance-sensitive ~aterial produces a ma~erial whose xemaining existence on a surface is dependent upon whether or not it has been exposed to the radiation or not, extremely sharp and precise definition can be given to the edges of photoresist material having the ~ubstance-sensitive material suspended therein. Thus, substance-sensitive photoresi3t layers can be placed on sur~acles with an accuracy measured in microns, - 8 -:
'' .
.
.
.
- : , .
.
7Ç~
permitting the application of a plurality of extrem~ly accurate chemical sensors to be produced on.a singl~
sub~trateO
The negative photoresist is act~vated when exposed to the appropriate radiation, and the positive-type photoresist is activated unless it i~ exposed to ~he appropriate radiation.
It i~ understood that th~ ~erm nproce~sing~
encompasses the ~teps o~ selectively activating and removing substance-sensitive photoresist material to leave a substance-sensitive photoresist layer at a designated location, ~aid steps dependent upon the type ~f photoresist material chosen.
By the same token, layers of substance-sensitive photoresist can be applied to the same substrate, each layer beinq sen~itive to a differenk type o~ substance.
An exa~ple of ~he inventive method applied to a two substance-sensitive semiconductor i~ shown in Figures la-l~ O
A ~emiconductor substrate 10 is shown in Figure la, comprising P-type and N-type semiconductor material~.
Because several substance-sensitive elements are going :, ' . . . ' ' -- g _ .
.
~27~
to be placed on the single substrate, a pluxali'cy of P/N junctions are pxovided. A passivation layer 12 is applied to the ~ubstrate, with 'che exception of the prepared places 14 asld 16 where th~ membrc~e layers arç~
~ he placed~ The prepared places may include a blocking layer to prevent either electxonic or ionic conduction, or mass diffusion, as hecessaryO The passivation l~yer may comprise silicon dioxide ~SiO2), or any other suitable isolation material known t~ those ~n the art.
A first layer o substance-sensitive photoresist material is applied over prepared places 14 and 16, as well as the passivation layer 12. The substance-sensitive photoresist layer can be applied by first coating the passiva ion layer, and prepared spaces~ with a layer of substance-sensitive material, over which is placed a layer of photoresist material, such that ~he substance-sensitive diffuses into the photoresist layer.
Alternatively, a layer vf photoresist material oan be.
. . -: . . .
applied with a coating of substance-sensitive material hereover. The substance-sensitive material is permitted to difuse into the photoresist material, fonning a .
-- 10 -- .
.:
' -. ~ . . :
~ . . .
.. . ..
: ' `
.
,:
., :
~276~
~ubstance-sensit~ve photoresist layer. In a pr~ferred embodiment, a substance-sensitive material - i~ first mixed with the photoresist material, and then, applie~ to the substrate as a ~ubst~nce-sensitive photore~ist layer.
-. The ~ubstrate, covered with the substance-sensitive photoresist layer 18, is covered by a suitable mask 20, and subjected to an appropriate radiation indicated by arrows 22. A~ is known, photoresi6t material comprises two primary groups, positive and negative photoresi~t.
In ~his instance, a negative-type polymerizable photo-xesist material is depicted, with an appropriate mas~ 20 to polymerize the substance-sen~itive photo-resist materiai in the vicinity of prepared space l~v If a positive-type photoresist material were used, the mask would cover only the vicinity o~ prepared space 14, allowing the rest of the photoresist material to be exposed to radiation 2~, thus, preventing its polymeri~ation~
The unpolymeri~ed substance-sensitive photoresist material is ~emoved by conventional etching procedures, leaving a single substance-sensitive photoresis~ layer .
'.
: . -, , - : , . . . :
- , ; - : :
.. i , . . , ~ . . ~ .
.
76~
24 in the region of prepared spac~ 14.
A second layer of substance-sensikive photoresi~t material 26 is placed over the substrate and isolation layer. However, the second layex o substance-sensitive photoresist may be sensitive to a substance di~ferent from that of said ~irst substa~ce-sensitive pho~cresist layer~ As shown in Flgure 1~, a suit~ble ma~k 28 is placed over ~he coated sub~trate, with arrows 22 indicating the radiation for polymerizing ~he photoresist layer in the vicinity o~ prepared space 16. ~fter suitable etching and processing steps, tlle substrate, as indicated in Fi~ure lh, has a substance-sensitive photoresist layexs 24 and 26, ~hich are responsive to different substances. ~fter ~he addition o~ reference electrodes 30 and 32, and suitable contact electrodes 34, the chemical sensor is ready for operational use/ as indicated in Figure lj.
It should be noted that, although a multiple substance-sensitive chemical sensor has been shown ln Figure~ la-lj, the procedure would be precisely the same for ma~ing only a single substance-sensitive photo re3ist layer, or fox making a plurality of substance~
:.
.
, ,. , :
- 12 ~ -, :~
~:
.' -' . .- :.
.
.
~27~
~ensitive photoresist layexs which are sensiti~e to diferent substancesO
I'c is clear that many differ~llt types o photo-resist material, both positive and negative, can be utilized in accordance with the present invention. The process of photopolymeri~ation and the physic21 and chemLcal properties of a number o~ different photo-resist materials are further discussed in Solid State Technology, J~e and September, 1971, and Electronic Components, June 29, July 27 and August of 19 73 .
For providing a 3ubstance-sensitive pll~toresist layer whicn ~s ~ensitive to potassiwn ~S+) ions ,. ~.7alino~cin can be utilized, which is avail2ble from Cal-}3io Chem, Eas~
Rutherford, New Jersey. One specific photoresist material which was used is type AZ }350J, available ~om Ship ley, All entown , Pe nns yl vani a O I t is cle ar that many other types of pho~oresist material, bo th po~iti~re and negative, can be utilized in accordance with the present inver tion.
Sim~larly, in order to obtain pho~oresist layers which are sensitiYe to different su~stance, differerlt .
.
::
?~
,h,~,~. .
., - ` ' ' ' ' ' ' ~, . .. , , ~ ... .
~2~
substance-sensitive ma~erial can be utilized as herein before noted. ~n a prefexred embodiment in which the sub~tance-sensitive material i~ mixed with the photo-resist mat~rial and then applied to the ~ubstrate, 10 mg. of valino~cin WclS di~solved in 10 cc. of negative photoresist material. The substance-sensitive pho~oresist material was spun onto a ~ilicon wafer coated with a 6,000 A thick lay~r of silicon dioxid~, utili~ing standard methods. The substance-sensitiye photoresist layer was preb~ked at a te~perature o~ 50 C for a short period of time and then exposed to ultraviolet radiation in a s~andard mask aligner in ordex to polymerize the materials. Two micron ~hick and thinner layers of substance-sensiti~e photoresist material have been provided, which. give the necessary sensitivity to the existence, and concentration, of pot~ssium ions.
Instead of providing multiple layer~ on an ion controlled diode, as represented in Figures la~ he applicants' inventive method could be applied to providing substance-sensitive photoresist layers on ion sensitive field-effect transistors (ISFET) as tauyht in , ' ' ' . ' ' .
.
. j .. - ~ ' ' " ' ~
., . . ~ ,. .
, .
7~
UO S. Patent 3,~31,432. Although the operation of ~he semiconductor device is diEferent from that of an ion controlled diode, the effect of the substance-~erlsitive photoresist la~yer is simllar, and the inventive method can be utilized interch~ngeably for ion co~trolled diodes, ISFET's or combinations thereof.
In fact, the inventive method o~ the present invention can be applied to electronic structures other khan semiconductors. Figure 2 illustrates the utilization of a substance-~ensitive photoresist layer to vary the capacitance between the xeference electrode 40 and a base electrode 4Z. The test medium 44 (the material in which it is desired to sense the presencé, or concentrakion, of ~he desired substance) cause~
changes in the dielectric constant of the substance~
sensitive photoresist layer 24, when ~he desired ~ubsta~ce is present. An isolation layer 41, upon which the photoresist layer is applied, sexves to prevent the test medium from shortiny the capacitor plates or ~he photoresist layer. The above is a pre~erred embodiment, although one could easily locate the phoko~
resist layer on its o~n isolation layer at any point - LS -' : . . - ~ . .- . .
~ . . - . .--- .- - ' . - : : :: . . . ' . :.
,C3 between the capacitor plates. These changes in the dielectric constant are reflected in changes in capacitance between the reference electrode 40 and the base electrode 42. These changes in capacitance can be measured, such that a digital outpu-t indicative of the concentra-tion of the unknown complex is provided, as is shown in the above-mentioned U.S. Patent No.
4,103,227. .
Similarly, changes in permittivity and permeability in the substance-sensitive photoresist layer in response to the presence o the desired substance, can be reflected in changes of the coupling between two lines, as is shown in Figure 3. An input line 50, and an output line 52, are coupled in part by a substance-sensitive photoresist layer 24. Test medium 44 causes changes in the permittivity and permeability of the substance-sensitive photoresist layer, which ultimately causes a change in the coupling between the input line 50 and the output line 52, which change can be measured providing an indication of the con-centration of the desired substance. While the Figure 2 embodi-ment would have a D.C. or low frequency application, the Figure 3
2~ ~ embodiment would primarily apply to high frequency devices.
' : , ' '.
' , ` ' ~ .
- - . . ~ . ., , ' ~ ' ', 6~
The electronic structures schematically depicted in ~igure.~ 2 and 3 may be applied to r~cxowave strip-line~ and integrated optical ~txucture~, as well as .other electronic devices, which will become obvious to those of ordinary skill in the art in view of the above teachings. Therefore, it i~ belie~ed that the present inventive method and apparatu i~ not limited to the specific embodiments herein di~cussed, and many modifications and variation~ thereof will be readily apparent to those skilled in the art, in the light of the abo~e teachings. It is, therefore, to be under-stood that, within the scope of the appended claimst the invention may be practiced otherwise than as s~eci~ically described, , , : ' "
' .
- - ~ , , .: -, - :
' . .
~ . . .
:': . ' - ' : .- . ~ . .. : . -~ : ~ . . :
' : , ' '.
' , ` ' ~ .
- - . . ~ . ., , ' ~ ' ', 6~
The electronic structures schematically depicted in ~igure.~ 2 and 3 may be applied to r~cxowave strip-line~ and integrated optical ~txucture~, as well as .other electronic devices, which will become obvious to those of ordinary skill in the art in view of the above teachings. Therefore, it i~ belie~ed that the present inventive method and apparatu i~ not limited to the specific embodiments herein di~cussed, and many modifications and variation~ thereof will be readily apparent to those skilled in the art, in the light of the abo~e teachings. It is, therefore, to be under-stood that, within the scope of the appended claimst the invention may be practiced otherwise than as s~eci~ically described, , , : ' "
' .
- - ~ , , .: -, - :
' . .
~ . . .
:': . ' - ' : .- . ~ . .. : . -~ : ~ . . :
Claims (10)
- Claim 1. A method of forming a substance-sensitive membrane on a structure! for providing an electrical indication of the concentration of at least a selected substance, said membrane formed on said structure by the method comprising the steps of:
providing a layer of substance sensitive photo-resist material on said structure, and processing said photoresist to form a substance-sensitive membrane on said structure. - Claim 2. The method of Claim 1, wherein said step of providing a layer comprises the steps of:
applying a substance-sensitive material to said structure;
applying a layer of photoresist over said substance-sensitive material on said structure; and allowing said substance-sensitive material to diffuse into said photoresist material before said processing step. - Claim 3. The method of Claim 1, wherein said step of providing a layer comprises the steps of:
applying a layer of photoresist on said structure;
applying a substance-sensitive material to said photoresist layer; and allowing said substance-sensitive material to diffuse into said photoresist layer before said processing step. - Claim 4. The method of Claim 1, wherein said step of providing a layer comprises the steps of:
combining a substance-sensitive material with said photoresist; and applying a layer of said substance-sensitive material/photoresist combination to said structure. - Claim 5. A substance-sensitive structure for sensing the presence and/or concentration of a substance in a test medium; said structure comprising:
an electronic structure, responsive to change in a dielectric constant, for indicating the concentration of said substance in said test medium as determined by said change in said dielectric constant; and a substance-sensitive layer for separating said structure from said test medium and for changing dielectric constant in response to the concentration of said substance in said test medium, said layer comprised of substance-sensitive photoresist material. - Claim 6. The structure of Claim 5, wherein said electronic structure comprises a semiconductor diode having a P/N junction with said substance-sensitive photoresist material separating said P/N junction from said test medium.
- Claim 7. The structure of Claim 5, wherein said electronic structure is a capacitor having at least two plates, at least one of which is insulated from said test medium and said substance-sensitive photo-resist material is disposed on an insulator between said plates, and said test medium separates said plates.
- Claim 8. A substance-sensitive structure for sensing the presence and/or concentration of a substance in a test medium, said structure comprising:
an electronic structure responsive to changes in a dielectric constant for indicating the concentration of said substance in said test medium indicated by said change in said dielectric constant; and a substance-sensitive layer disposed in said test medi for changing dielectric constant in response to the concentration of said complex, said electronic structure being a pair of lines coupled through said substance-sensitive layer, said layer comprised of substance-sensitive photoresist material. - Claim 9. A substance-sensitive structure for sensing the presence and/or concentration of at least a first substance and a second substance in a test medium, said structure comprising:
a first electronic structure responsive to change in a dielectric constant for indicating the concentration of said first substance in said test medium by said change in said dielectric constant;
a first substance-sensitive layer for separating said first electronic structure from said test medium and for changing dielectric constant in response to the concentration of said first substance;
a second electronic structure, integral with said first electronic structure, responsive to change in a dielectric constant for indicating the concentration of said second substance in said test medium, by said change in said dielectric constant; and second substance-sensitive layer for separating said second electronic structure from said test medium and for changing dielectric constant in response to the concentration of said second substance, both of said substance-sensitive layers being comprised of substance-sensitive photoresist material. - 10. The method of claim 1, wherein the step of processing said photoresist includes a heat-treatment thereof.
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US858,906 | 1977-12-08 | ||
| US05/858,906 US4302530A (en) | 1977-12-08 | 1977-12-08 | Method for making substance-sensitive electrical structures by processing substance-sensitive photoresist material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1112769A true CA1112769A (en) | 1981-11-17 |
Family
ID=25329473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA317,549A Expired CA1112769A (en) | 1977-12-08 | 1978-12-07 | Substance-sensitive electrical structures and method for making same |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4302530A (en) |
| JP (1) | JPS5494397A (en) |
| AU (1) | AU520257B2 (en) |
| BE (1) | BE872596A (en) |
| CA (1) | CA1112769A (en) |
| CH (1) | CH639201A5 (en) |
| DE (1) | DE2852870A1 (en) |
| FR (1) | FR2411490B1 (en) |
| GB (1) | GB2010516B (en) |
| IT (1) | IT1108532B (en) |
| NL (1) | NL7811927A (en) |
| SE (1) | SE7812508L (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2947050C2 (en) * | 1979-11-22 | 1992-11-26 | Karoly Dr. 4600 Dortmund Dobos | Arrangement for the detection of ions, atoms and molecules in gases or solutions |
| GB2072418B (en) * | 1980-03-19 | 1984-03-14 | Olympus Optical Co | Ion sensor and method of manufacturing the same |
| DE3029153A1 (en) * | 1980-07-31 | 1982-03-04 | Siemens AG, 1000 Berlin und 8000 München | Gas permeable polymer membrane for analysis devices - has perforated metal or glass backing disc |
| US4456522A (en) * | 1981-09-23 | 1984-06-26 | Critikon, Inc. | Support and anchoring mechanism for membranes in selectively responsive field effect devices |
| US4486292A (en) * | 1981-09-23 | 1984-12-04 | Critikon, Inc. | Support and anchoring mechanism for membranes in selectively responsive field effect devices |
| US4571543A (en) * | 1983-03-28 | 1986-02-18 | Southwest Medical Products, Inc. | Specific material detection and measuring device |
| GB8322418D0 (en) * | 1983-08-19 | 1983-09-21 | Emi Ltd | Humidity sensor |
| NL8400916A (en) * | 1984-03-22 | 1985-10-16 | Stichting Ct Voor Micro Elektr | METHOD FOR MANUFACTURING AN ISFET AND ISFET MADE THEREFORE |
| US4576884A (en) * | 1984-06-14 | 1986-03-18 | Microelectronics Center Of North Carolina | Method and apparatus for exposing photoresist by using an electron beam and controlling its voltage and charge |
| US4767695A (en) * | 1984-10-29 | 1988-08-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Nonplanar lithography and devices formed thereby |
| US4675863A (en) | 1985-03-20 | 1987-06-23 | International Mobile Machines Corp. | Subscriber RF telephone system for providing multiple speech and/or data signals simultaneously over either a single or a plurality of RF channels |
| GB8522785D0 (en) * | 1985-09-14 | 1985-10-16 | Emi Plc Thorn | Chemical-sensitive semiconductor device |
| US4948707A (en) * | 1988-02-16 | 1990-08-14 | International Business Machines Corporation | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon |
| US4836012A (en) * | 1988-05-26 | 1989-06-06 | Ametek, Inc. | Gas sensor |
| US6306594B1 (en) | 1988-11-14 | 2001-10-23 | I-Stat Corporation | Methods for microdispensing patterened layers |
| US5063081A (en) * | 1988-11-14 | 1991-11-05 | I-Stat Corporation | Method of manufacturing a plurality of uniform microfabricated sensing devices having an immobilized ligand receptor |
| US5200051A (en) * | 1988-11-14 | 1993-04-06 | I-Stat Corporation | Wholly microfabricated biosensors and process for the manufacture and use thereof |
| US5145717A (en) * | 1990-01-31 | 1992-09-08 | E. I. Du Pont De Nemours And Company | Stripping method for removing resist from a printed circuit board |
| US6129896A (en) * | 1998-12-17 | 2000-10-10 | Drawn Optical Components, Inc. | Biosensor chip and manufacturing method |
| US6634213B1 (en) * | 2000-02-18 | 2003-10-21 | Honeywell International Inc. | Permeable protective coating for a single-chip hydrogen sensor |
| AU2002258715A1 (en) * | 2002-04-04 | 2003-10-20 | Illusion Technologies, Llc | Miniature/micro scale power generation system |
| US6627959B1 (en) | 2002-04-16 | 2003-09-30 | Boston Microsystems, Inc. | P-n junction sensor |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL134388C (en) * | 1964-05-15 | 1900-01-01 | ||
| US3831432A (en) * | 1972-09-05 | 1974-08-27 | Texas Instruments Inc | Environment monitoring device and system |
| FR2273370A1 (en) * | 1974-05-29 | 1975-12-26 | Radiotechnique Compelec | Thin layer particle sensor mfg method - uses doped material held rigidly by a semiconductor disc |
| US3966580A (en) * | 1974-09-16 | 1976-06-29 | The University Of Utah | Novel protein-immobilizing hydrophobic polymeric membrane, process for producing same and apparatus employing same |
| US4020830A (en) * | 1975-03-12 | 1977-05-03 | The University Of Utah | Selective chemical sensitive FET transducers |
| FR2341859A1 (en) * | 1976-02-18 | 1977-09-16 | Radiotechnique Compelec | PROBE FOR THE SELECTIVE DETECTION OF VAPORS, ESPECIALLY FOR THE DETECTION OF WATER VAPOR |
| US4103227A (en) * | 1977-03-25 | 1978-07-25 | University Of Pennsylvania | Ion-controlled diode |
| US4158807A (en) * | 1977-04-25 | 1979-06-19 | Massachusetts Institute Of Technology | Gapped gate charge-flow transistor with a thin film sensor having two modes of conduction within the gapped gate used to sense a property of the ambient environment |
| US4180771A (en) * | 1977-12-02 | 1979-12-25 | Airco, Inc. | Chemical-sensitive field-effect transistor |
-
1977
- 1977-12-08 US US05/858,906 patent/US4302530A/en not_active Expired - Lifetime
-
1978
- 1978-12-05 SE SE7812508A patent/SE7812508L/en unknown
- 1978-12-06 AU AU42246/78A patent/AU520257B2/en not_active Expired
- 1978-12-06 GB GB7847410A patent/GB2010516B/en not_active Expired
- 1978-12-07 NL NL7811927A patent/NL7811927A/en not_active Application Discontinuation
- 1978-12-07 BE BE192190A patent/BE872596A/en not_active IP Right Cessation
- 1978-12-07 FR FR7834504A patent/FR2411490B1/en not_active Expired
- 1978-12-07 IT IT69818/78A patent/IT1108532B/en active
- 1978-12-07 DE DE19782852870 patent/DE2852870A1/en not_active Withdrawn
- 1978-12-07 CA CA317,549A patent/CA1112769A/en not_active Expired
- 1978-12-08 JP JP15119378A patent/JPS5494397A/en active Pending
- 1978-12-08 CH CH1257178A patent/CH639201A5/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| NL7811927A (en) | 1979-06-12 |
| GB2010516A (en) | 1979-06-27 |
| GB2010516B (en) | 1982-09-22 |
| SE7812508L (en) | 1979-06-09 |
| IT1108532B (en) | 1985-12-09 |
| AU4224678A (en) | 1979-06-14 |
| AU520257B2 (en) | 1982-01-21 |
| BE872596A (en) | 1979-06-07 |
| DE2852870A1 (en) | 1979-06-13 |
| IT7869818A0 (en) | 1978-12-07 |
| FR2411490B1 (en) | 1985-07-19 |
| US4302530A (en) | 1981-11-24 |
| CH639201A5 (en) | 1983-10-31 |
| JPS5494397A (en) | 1979-07-26 |
| FR2411490A1 (en) | 1979-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1112769A (en) | Substance-sensitive electrical structures and method for making same | |
| US4644380A (en) | Substance-sensitive electrical structures | |
| US5135891A (en) | Method for forming film of uniform thickness on semiconductor substrate having concave portion | |
| US4468857A (en) | Method of manufacturing an integrated circuit device | |
| JPH03138920A (en) | Semiconductor device | |
| EP0211609A2 (en) | Chemically sensitive semiconductor devices and their production | |
| GB1569931A (en) | Manufacture of semiconductor devices | |
| JPH02268265A (en) | Electrode cell having minute hole for electrochemical measurement and manufacture thereof | |
| JPH03222409A (en) | Manufacture of semiconductor device | |
| JPS63228010A (en) | Method for measuring depth of groove in semiconductor | |
| US5286610A (en) | Method of patterning organic macromolecular film | |
| US3669669A (en) | Cyclic polyisoprene photoresist compositions | |
| US20060210427A1 (en) | Integrated chemical sensing system | |
| Clark et al. | Microimage Photoresist Evaluation | |
| JPH0727950B2 (en) | Method for manufacturing semiconductor device | |
| JPH04224B2 (en) | ||
| JPH05158245A (en) | Production of semiconductor device | |
| KR100293268B1 (en) | Pressure sensor and method for fabricating the same | |
| JPH01301159A (en) | Very small electrode cell for electrochemical measurement and production thereof | |
| Domanský et al. | A Technique for Depositing Sensing Layers in Integrated Microsensor Arrays by Automated Fluid Dispensing | |
| KR100188022B1 (en) | Etching rate measuring method of semiconductor film | |
| JPH0682762B2 (en) | Semiconductor device | |
| KR950034411A (en) | Measuring method of ion implantation in ion implantation process | |
| Crooke et al. | Photolithography in semiconductor manufacture | |
| KR970013155A (en) | Contact etching monitoring method for metal wiring |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |