BRPI0916519A2 - conjunto sensor de colisão, e, método para montar um sensor de colisão. - Google Patents
conjunto sensor de colisão, e, método para montar um sensor de colisão.Info
- Publication number
- BRPI0916519A2 BRPI0916519A2 BRPI0916519A BRPI0916519A BRPI0916519A2 BR PI0916519 A2 BRPI0916519 A2 BR PI0916519A2 BR PI0916519 A BRPI0916519 A BR PI0916519A BR PI0916519 A BRPI0916519 A BR PI0916519A BR PI0916519 A2 BRPI0916519 A2 BR PI0916519A2
- Authority
- BR
- Brazil
- Prior art keywords
- collision sensor
- mounting
- sensor assembly
- assembly
- collision
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
- B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
- B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
- B60R21/013—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents including means for detecting collisions, impending collisions or roll-over
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Air Bags (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connection Or Junction Boxes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8412408P | 2008-07-28 | 2008-07-28 | |
US61/084124 | 2008-07-28 | ||
PCT/US2009/051849 WO2010014550A2 (en) | 2008-07-28 | 2009-07-27 | Method and apparatus for packaging crash sensors |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0916519A2 true BRPI0916519A2 (pt) | 2015-11-10 |
BRPI0916519B1 BRPI0916519B1 (pt) | 2019-07-16 |
Family
ID=41610924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0916519-3A BRPI0916519B1 (pt) | 2008-07-28 | 2009-07-27 | Conjunto sensor de colisão, e, método para montar um sensor de colisão |
Country Status (7)
Country | Link |
---|---|
US (1) | US8966975B2 (pt) |
EP (1) | EP2310232A4 (pt) |
JP (1) | JP5685187B2 (pt) |
KR (1) | KR101296426B1 (pt) |
CN (1) | CN102105335B (pt) |
BR (1) | BRPI0916519B1 (pt) |
WO (1) | WO2010014550A2 (pt) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8234034B2 (en) | 2009-06-26 | 2012-07-31 | Autoliv Asp, Inc. | Enhanced electronic assembly |
US8914183B2 (en) | 2010-09-20 | 2014-12-16 | Joshua Forwerck | Enhanced electronic assembly |
DE102011087328B4 (de) * | 2011-11-29 | 2024-03-14 | Zf Friedrichshafen Ag | Verfahren zur Herstellung einer umspritzten Sensorbaugruppe sowie eine Sensorbaugruppe |
US9975510B2 (en) | 2012-05-22 | 2018-05-22 | Trw Automotive U.S. Llc | Hybrid vehicle/pedestrian impact detecting method and apparatus |
US9235937B1 (en) | 2013-06-05 | 2016-01-12 | Analog Devices, Inc. | Mounting method for satellite crash sensors |
US9682500B2 (en) * | 2013-09-30 | 2017-06-20 | Apple Inc. | Insert molded parts and methods for forming the same |
US9648721B2 (en) | 2014-03-06 | 2017-05-09 | Trw Automotive U.S. Llc | Apparatus for mounting a printed circuit board |
US9260071B2 (en) | 2014-03-11 | 2016-02-16 | Trw Automotive U.S. Llc | Apparatus for snap mounting a crash sensor |
US20150268261A1 (en) * | 2014-03-18 | 2015-09-24 | Trw Automotive U.S. Llc | Circuit mounting apparatus and method using a segmented lead-frame |
US9470595B2 (en) | 2014-08-29 | 2016-10-18 | Trw Automotive U.S. Llc | Apparatus for dry side mounting a crash pressure sensor |
US10142532B2 (en) * | 2016-04-08 | 2018-11-27 | Magna Electronics Inc. | Camera for vehicle vision system |
US10203228B2 (en) | 2016-07-20 | 2019-02-12 | Veoneer Us, Inc. | Crash sensor assembly |
USD797646S1 (en) | 2016-08-18 | 2017-09-19 | Ford Motor Company | Sensor cover |
USD809995S1 (en) * | 2016-08-18 | 2018-02-13 | Ford Motor Company | Sensor cover |
USD838230S1 (en) | 2016-08-18 | 2019-01-15 | Ford Motor Company | Sensor cover |
USD838231S1 (en) | 2016-08-18 | 2019-01-15 | Ford Motor Company | Sensor cover |
US10488231B2 (en) | 2016-08-18 | 2019-11-26 | Ford Global Technologies, Llc | Sensor cover |
US10286867B2 (en) * | 2017-06-26 | 2019-05-14 | Trw Automotive U.S. Llc | System for sensing vehicle conditions |
US10883863B2 (en) * | 2017-11-21 | 2021-01-05 | Veoneer Us, Inc. | Interchangeable sensor mounting |
US10451645B2 (en) * | 2018-03-12 | 2019-10-22 | Veoneer Us Inc. | Remote sensor construction via integrated vacuum manufacture process |
US10340211B1 (en) * | 2018-03-15 | 2019-07-02 | Nxp B.V. | Sensor module with blade insert |
US10673184B2 (en) | 2018-03-27 | 2020-06-02 | Veoneer Us Inc. | Rigid electrical connection to strain sensitive sensing component |
US10524367B2 (en) | 2018-03-28 | 2019-12-31 | Veoneer Us Inc. | Solderless sensor unit with substrate carrier |
US10775402B2 (en) | 2018-03-30 | 2020-09-15 | Veoneer Us Inc. | Device with terminal-containing sensor |
WO2020096517A1 (en) | 2018-11-08 | 2020-05-14 | Delaval Holding Ab | A control module, and a control arrangement for a milking plant |
US11525709B2 (en) | 2019-04-11 | 2022-12-13 | Veoneer Us, Llc | Electronic unit with vent integrated with terminal aperture |
US11114218B2 (en) * | 2019-12-11 | 2021-09-07 | Vitesco Technologies USA, LLC | Mechanical stress isolation conductors in lead frames |
KR20210101665A (ko) * | 2020-02-10 | 2021-08-19 | 현대모비스 주식회사 | 차량용 에어백 제어기 |
KR20220090319A (ko) | 2020-12-22 | 2022-06-29 | 한국단자공업 주식회사 | 차량용 충돌 센서 조립체 |
WO2022216509A2 (en) * | 2021-04-07 | 2022-10-13 | Kemet Electronics Corporation | Overmolded film capacitor |
JP2023110456A (ja) * | 2022-01-28 | 2023-08-09 | 住友電装株式会社 | 複合成形部品 |
JP2023110457A (ja) * | 2022-01-28 | 2023-08-09 | 住友電装株式会社 | 複合成形部品 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7635043B2 (en) * | 1991-07-09 | 2009-12-22 | Automotive Technologies International, Inc. | Crash sensor arrangement for controlling deployment of an occupant restraint device |
JP2602666Y2 (ja) * | 1993-10-05 | 2000-01-24 | オートリブ・ジャパン株式会社 | 乗員保護システムの作動装置 |
DE4406499C2 (de) * | 1994-02-28 | 1996-02-08 | Siemens Ag | Sensoreinheit zum Steuern eines Insassenschutzsystems eines Kraftfahrzeugs |
US5462622A (en) * | 1994-06-09 | 1995-10-31 | Illinois Tool Works Inc. | Molding an electrical element within a premold element and an overmold element to provide a one-piece component |
KR19990023449U (ko) * | 1997-12-05 | 1999-07-05 | 김영환 | 후방 경고 시스템용 센서 어셈블리 |
DE19918202A1 (de) * | 1999-04-22 | 2000-10-26 | Bayer Ag | Sicherheitsstoßfänger |
JP2003083774A (ja) * | 2001-07-02 | 2003-03-19 | Nsk Ltd | センサ及びセンサ付軸受装置 |
JP2003028646A (ja) * | 2001-07-17 | 2003-01-29 | Canon Inc | 多軸半導体センサ |
US6891239B2 (en) * | 2002-03-06 | 2005-05-10 | The Charles Stark Draper Laboratory, Inc. | Integrated sensor and electronics package |
EP1720018A3 (en) * | 2003-02-03 | 2007-03-21 | Denso Corporation | Ceramic package for mounting electronic components |
JP4421824B2 (ja) * | 2003-02-03 | 2010-02-24 | 株式会社デンソー | センサ装置 |
JP3859599B2 (ja) | 2003-02-07 | 2006-12-20 | 株式会社クボタ | 草刈機の制動操作構造 |
JP4126551B2 (ja) | 2003-07-22 | 2008-07-30 | 日本精工株式会社 | センサ付転動装置 |
JP2005155827A (ja) * | 2003-11-27 | 2005-06-16 | Fujitsu Ten Ltd | 固定構造 |
JP4222196B2 (ja) * | 2003-12-01 | 2009-02-12 | 株式会社デンソー | 電気回路機器の破壊防止構造 |
JP2005319922A (ja) * | 2004-05-10 | 2005-11-17 | Koyo Seiko Co Ltd | 電動パワーステアリング装置 |
DE102004031557B4 (de) * | 2004-06-29 | 2016-12-22 | Conti Temic Microelectronic Gmbh | Verfahren und Crash-Sensor für eine Vorrichtung zur insassengefährdungsrelevanten Aktivierung von Insassen-Schutzeinrichtungen in einem Kraftfahrzeug bei Crashfällen |
US7181968B2 (en) * | 2004-08-25 | 2007-02-27 | Autoliv Asp, Inc. | Configurable accelerometer assembly |
US7500394B2 (en) * | 2005-08-19 | 2009-03-10 | Tk Holdings Inc. | Fastener integrated sensor |
US7331212B2 (en) * | 2006-01-09 | 2008-02-19 | Delphi Technologies, Inc. | Sensor module |
JP4904928B2 (ja) * | 2006-05-30 | 2012-03-28 | 横浜ゴム株式会社 | 注型用硬化性樹脂組成物およびタイヤ空気圧センサー |
US7819004B2 (en) * | 2006-09-27 | 2010-10-26 | Tk Holdings, Inc. | Vehicle sensor |
US8154114B2 (en) * | 2007-08-06 | 2012-04-10 | Infineon Technologies Ag | Power semiconductor module |
-
2009
- 2009-07-27 BR BRPI0916519-3A patent/BRPI0916519B1/pt not_active IP Right Cessation
- 2009-07-27 EP EP09803443.2A patent/EP2310232A4/en not_active Ceased
- 2009-07-27 US US13/002,696 patent/US8966975B2/en active Active
- 2009-07-27 CN CN2009801292659A patent/CN102105335B/zh active Active
- 2009-07-27 JP JP2011521222A patent/JP5685187B2/ja active Active
- 2009-07-27 WO PCT/US2009/051849 patent/WO2010014550A2/en active Application Filing
- 2009-07-27 KR KR1020117003303A patent/KR101296426B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2011529420A (ja) | 2011-12-08 |
US8966975B2 (en) | 2015-03-03 |
US20110107835A1 (en) | 2011-05-12 |
EP2310232A4 (en) | 2017-05-31 |
KR20110036836A (ko) | 2011-04-11 |
WO2010014550A3 (en) | 2010-03-25 |
BRPI0916519B1 (pt) | 2019-07-16 |
WO2010014550A2 (en) | 2010-02-04 |
JP5685187B2 (ja) | 2015-03-18 |
CN102105335A (zh) | 2011-06-22 |
CN102105335B (zh) | 2013-07-24 |
KR101296426B1 (ko) | 2013-08-13 |
EP2310232A2 (en) | 2011-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 27/07/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 27/07/2009, OBSERVADAS AS CONDICOES LEGAIS |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 12A ANUIDADE. |
|
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2630 DE 01-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |