BRPI0401708A - Método para ligar substratos, artigo, e, composição adesiva termorreversìvel reativa à umidade - Google Patents

Método para ligar substratos, artigo, e, composição adesiva termorreversìvel reativa à umidade

Info

Publication number
BRPI0401708A
BRPI0401708A BRPI0401708A BRPI0401708A BR PI0401708 A BRPI0401708 A BR PI0401708A BR PI0401708 A BRPI0401708 A BR PI0401708A BR PI0401708 A BRPI0401708 A BR PI0401708A
Authority
BR
Brazil
Prior art keywords
article
reactively
adhesive composition
heat
reactive adhesive
Prior art date
Application number
Other languages
English (en)
Inventor
Mark Alan Kesselmayer
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of BRPI0401708A publication Critical patent/BRPI0401708A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
    • C08G18/4018—Mixtures of compounds of group C08G18/42 with compounds of group C08G18/48
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6625—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6629—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/36 or hydroxylated esters of higher fatty acids of C08G18/38
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/20—Compositions for hot melt adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

"MéTODO PARA LIGAR SUBSTRATOS, ARTIGO, E, COMPOSIçãO ADESIVA TERMORREVERSìVEL REATIVA à UMIDADE". é fornecida uma composição adesiva termorreversível reativa à umidade ,útil como adesivo. A composição é particularmente útil como um adesivo para ligação de artigos de perfil-invólucro. é também provido um método para fabricação de artigos de perfil-invólucro usando a composição, e os artigos de perfil-invólucro produzidos desta forma.
BRPI0401708 2003-05-13 2004-05-06 Método para ligar substratos, artigo, e, composição adesiva termorreversìvel reativa à umidade BRPI0401708A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US46998803P 2003-05-13 2003-05-13

Publications (1)

Publication Number Publication Date
BRPI0401708A true BRPI0401708A (pt) 2005-01-18

Family

ID=33030122

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0401708 BRPI0401708A (pt) 2003-05-13 2004-05-06 Método para ligar substratos, artigo, e, composição adesiva termorreversìvel reativa à umidade

Country Status (7)

Country Link
US (1) US7955471B2 (pt)
EP (1) EP1477502B1 (pt)
JP (1) JP4279155B2 (pt)
CN (1) CN1261516C (pt)
BR (1) BRPI0401708A (pt)
MX (1) MXPA04004283A (pt)
TW (1) TW200506023A (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829615B2 (en) * 2003-06-09 2010-11-09 Henkel Ag & Co. Kgaa Reactive hot melt adhesives
US20070037955A1 (en) * 2005-08-15 2007-02-15 Richards James L Polymeric diluents for structural adhesives
US8475944B2 (en) * 2007-06-28 2013-07-02 Kennametal Inc. Coated ceramic cutting insert and method for making the same
CN102933671A (zh) * 2010-05-26 2013-02-13 日东电工株式会社 压敏胶粘片
US9309439B2 (en) 2010-07-22 2016-04-12 Construction Research & Technology Gmbh Sealant and adhesive using green prepolymer
EP2596038A1 (en) * 2010-07-22 2013-05-29 Construction Research & Technology GmbH Reduction in modulus of polyurethane sealants and adhesives
US9481777B2 (en) 2012-03-30 2016-11-01 The Procter & Gamble Company Method of dewatering in a continuous high internal phase emulsion foam forming process
EP2837647A1 (de) * 2013-08-16 2015-02-18 BASF Coatings GmbH Carboxyfunktionelle Poly- und Diesterderivate
KR102625370B1 (ko) 2016-11-10 2024-01-15 헨켈 아게 운트 코. 카게아아 반응성 핫 멜트 접착제 조성물 및 이의 용도

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021507A (en) * 1986-05-05 1991-06-04 National Starch And Chemical Investment Holding Corporation Arcylic modified reactive urethane hot melt adhesive compositions
US4889915A (en) * 1987-04-14 1989-12-26 Caschem, Inc. Urethane adhesives
US5234519A (en) * 1991-02-19 1993-08-10 Glen Oak Lumber And Milling, Inc. Veneer profile wrapping method and product
US5252155A (en) * 1992-03-10 1993-10-12 National Starch And Chemical Investment Holding Corporation Shrink film labeling with polyurethane hot melts
JP2951506B2 (ja) * 1993-06-22 1999-09-20 サンアプロ株式会社 ポリウレタン樹脂組成物および外科用キャスティングテープ
US5747627A (en) * 1994-12-27 1998-05-05 The Yokohama Rubber Co., Ltd. Room temperature curing polyurethane compositions
WO1996035734A1 (en) * 1995-05-10 1996-11-14 Minnesota Mining And Manufacturing Company Moisture-curable, hot melt composition
US5827926A (en) * 1996-11-08 1998-10-27 Minnesota Mining And Manufacturing Company Moisture-curable, hot-melt composition
US6465104B1 (en) * 1997-12-01 2002-10-15 Henkel Kommanditgesellschaft Auf Aktien Modified polyurethane hotmelt adhesive
WO2000043432A1 (en) 1999-01-20 2000-07-27 H.B. Fuller Licensing & Financing, Inc. Moisture curable polyurethane compositions
US6274674B1 (en) * 1999-02-25 2001-08-14 Ashland Inc. Reactive hot melt adhesive
US6365700B1 (en) * 1999-06-07 2002-04-02 National Starch And Chemical Investment Holding Corporation High green strength reactive hot melt by a prepolymerization in the main reactor
US6482878B1 (en) * 2000-04-21 2002-11-19 National Starch And Chemical Investment Holding Corporation Polyurethane hotmelt adhesives with acrylic copolymers and thermoplastic resins
US6613836B2 (en) * 2001-06-15 2003-09-02 National Starch And Chemical Investment Holding Corporation Reactive hot melt adhesive
US20030010443A1 (en) * 2001-07-09 2003-01-16 Rumack Daniel T. Reactive hot melt adhesive
DE10149142A1 (de) * 2001-10-05 2003-04-24 Henkel Kgaa Modifizierter reaktiver Schmelzklebstoff und dessen Verwendung
US7025853B2 (en) * 2002-07-03 2006-04-11 Rohm And Haas Company Reactive hot-melt adhesive compositions with improved green strength

Also Published As

Publication number Publication date
US7955471B2 (en) 2011-06-07
US20040229048A1 (en) 2004-11-18
EP1477502A3 (en) 2006-05-24
CN1550533A (zh) 2004-12-01
CN1261516C (zh) 2006-06-28
JP4279155B2 (ja) 2009-06-17
EP1477502B1 (en) 2012-09-12
JP2004339469A (ja) 2004-12-02
TW200506023A (en) 2005-02-16
MXPA04004283A (es) 2004-11-18
EP1477502A2 (en) 2004-11-17

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A, 6A, 7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO NAO CUMPRIMENTO DESPACHO 8.6 NA RPI 2160 DE 29/05/2012