BR9908708A - Aparelho para colocação de componente - Google Patents

Aparelho para colocação de componente

Info

Publication number
BR9908708A
BR9908708A BR9908708-1A BR9908708A BR9908708A BR 9908708 A BR9908708 A BR 9908708A BR 9908708 A BR9908708 A BR 9908708A BR 9908708 A BR9908708 A BR 9908708A
Authority
BR
Brazil
Prior art keywords
pick
component
head
place
component placement
Prior art date
Application number
BR9908708-1A
Other languages
English (en)
Inventor
John Michael Lowe
Original Assignee
John Michael Lowe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by John Michael Lowe filed Critical John Michael Lowe
Publication of BR9908708A publication Critical patent/BR9908708A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Vehicle Body Suspensions (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Vending Machines For Individual Products (AREA)
  • Basic Packing Technique (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Massaging Devices (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

Patente de Invenção: <B>"APARELHO PARA COLOCAçãO DE COMPONENTE"<D>. Um aparelho para colocação de componente (1)compreende uma central de colocação de componente (2) tendo uma mesa de suporte (3)para posicionar uma folha de cartões de circuito impresso (4). Três placas transportadoras (7a, b e c) circundam o aparelho para colocação de componente (1). A placa (7a) se move para além de uma montagem de cabeça (8)na qual as cabeças para pegar e posicionar (9)são montadas. A montagem da cabeça (8) é movida para cima e para baixo em um plano vertical, e a placa (7a) se move para baixo das cabeças para pegar e posicionar (9) em um plano horizontal. Fitas (10) transportam microchips ou outros componentes (11) são movidos sobre os cilindros (12) em um plano horizontal na mesma direção que a placa (7 a). As placas (7 a, b e c) têm orifícios (13) através da placa e reentrâncias (14) para receber os componentes (11). As cabeças para pegar e colocar (9) se movem para cima e para baixo através dos orifícios (13) à medida que a placa (7a) passa pela montagem de cabeça (8) e as cabeças (9) pegam um componente (11) da fita (10)e o elevam acima da placa (7 a). à medida que a placa (7 a)continua a se mover, as cabeças (9) descem novamente e depositam os componentes (11) nas reentrâncias (14), onde são mantidos na posição por um efeito de vácuo através dos orifícios na placa (7 a). A placa (7a) é, então, movida para permitir que os componentes
BR9908708-1A 1998-01-29 1999-01-28 Aparelho para colocação de componente BR9908708A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9801875A GB2333904B (en) 1998-01-29 1998-01-29 Component placement apparatus
PCT/GB1999/000297 WO1999039559A1 (en) 1998-01-29 1999-01-28 Component placement apparatus

Publications (1)

Publication Number Publication Date
BR9908708A true BR9908708A (pt) 2000-12-05

Family

ID=10826083

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9908708-1A BR9908708A (pt) 1998-01-29 1999-01-28 Aparelho para colocação de componente

Country Status (16)

Country Link
US (1) US6557247B1 (pt)
EP (1) EP1051893B1 (pt)
JP (1) JP2002502136A (pt)
KR (1) KR100631222B1 (pt)
AT (1) ATE224131T1 (pt)
AU (1) AU741235B2 (pt)
BR (1) BR9908708A (pt)
CA (1) CA2318153A1 (pt)
DE (1) DE69902882T2 (pt)
DK (1) DK1051893T3 (pt)
ES (1) ES2184410T3 (pt)
GB (1) GB2333904B (pt)
HK (1) HK1032709A1 (pt)
PT (1) PT1051893E (pt)
RU (1) RU2218682C2 (pt)
WO (1) WO1999039559A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA02007208A (es) * 2001-07-30 2003-02-06 Esec Trading Sa Dispositivo para el transporte y dotacion de substratos con chips semiconductores.
WO2004034441A2 (en) * 2002-10-10 2004-04-22 Ofer Avineri Apparatus and method for assembling arrays of functional elements to substrates
TW200604060A (en) * 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
KR101070916B1 (ko) * 2006-02-24 2011-10-06 삼성테크윈 주식회사 기판 스트립 및 반도체 패키지 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2108015B (en) * 1981-08-24 1985-03-06 Tdk Electronics Co Ltd Apparatus for mounting chip type circuit elements on printed circuit boards
DE3502257A1 (de) * 1985-01-24 1986-07-24 Robert 7992 Tettnang Buck Bestueckungsautomat
EP0190372A1 (en) * 1985-01-29 1986-08-13 TEKMA KINOMAT S.p.A. Process for the automatic positioning of chips on printed circuits and machine for carrying out the same
BE903742A (nl) * 1985-11-29 1986-05-29 Burndy Electra Nv Machine en werkwijze voor het selektief insteken van electrische kontaktpennen in een plaat met gedrukte schakelingen.
DE3623031A1 (de) * 1986-07-09 1988-01-14 Raetz Klaus Montagevorrichtung fuer elektronikleiterplatten der mikroelektronik
JPH01295500A (ja) * 1988-05-24 1989-11-29 Taiyo Yuden Co Ltd チップ状電子部品マウント方法及びその装置
US5042709A (en) * 1990-06-22 1991-08-27 International Business Machines Corporation Methods and apparatus for precise alignment of objects
DE4022316A1 (de) * 1990-07-13 1992-01-16 Neubecker Karl A Verfahren zum herstellen von mit elektronischen baugruppen bestueckten leiterplatten
DE59202991D1 (de) * 1991-01-28 1995-08-31 Siemens Ag Vorrichtung zum Bestücken von Leiterplatten.

Also Published As

Publication number Publication date
JP2002502136A (ja) 2002-01-22
HK1032709A1 (en) 2001-07-27
ATE224131T1 (de) 2002-09-15
EP1051893B1 (en) 2002-09-11
ES2184410T3 (es) 2003-04-01
DE69902882T2 (de) 2003-04-30
AU2290699A (en) 1999-08-16
EP1051893A1 (en) 2000-11-15
KR20010040454A (ko) 2001-05-15
KR100631222B1 (ko) 2006-10-02
WO1999039559A1 (en) 1999-08-05
DE69902882D1 (de) 2002-10-17
GB2333904A (en) 1999-08-04
PT1051893E (pt) 2003-01-31
GB9801875D0 (en) 1998-03-25
RU2218682C2 (ru) 2003-12-10
US6557247B1 (en) 2003-05-06
DK1051893T3 (da) 2002-10-14
CA2318153A1 (en) 1999-08-05
GB2333904B (en) 2002-07-17
AU741235B2 (en) 2001-11-29

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Free format text: TECHNOLOGY DEVELOPMENT ASSOCIATE OPERATION LIMITED (GB)

B25D Requested change of name of applicant approved

Owner name: TDAO LIMITED (GB)

Free format text: ALTERADO DE: TECHNOLOGY DEVELOPMENT ASSOCIATE OPERATIONS LIMITED

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1990 DE 25/02/2009.