BR9608999A - Sistema de resfriamento por lâmina de gás e método para resfriar o material soldado - Google Patents

Sistema de resfriamento por lâmina de gás e método para resfriar o material soldado

Info

Publication number
BR9608999A
BR9608999A BR9608999-7A BR9608999A BR9608999A BR 9608999 A BR9608999 A BR 9608999A BR 9608999 A BR9608999 A BR 9608999A BR 9608999 A BR9608999 A BR 9608999A
Authority
BR
Brazil
Prior art keywords
gas
cooling
cooling system
gas blade
welded
Prior art date
Application number
BR9608999-7A
Other languages
English (en)
Inventor
Joel Brad Bailey
Sabi Avramescu
Tad Formella
Original Assignee
Electrovert Usa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Usa Corp filed Critical Electrovert Usa Corp
Publication of BR9608999A publication Critical patent/BR9608999A/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/085Cooling, heat sink or heat shielding means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Turbine Rotor Nozzle Sealing (AREA)

Abstract

<B>"SISTEMA DE RESFRIAMENTO POR LâMINA DE GáS E MéTODO PARA RESFRIAR O MATERIAL SOLDADO"<D>. Um sistema de resfriamento por lâmina de gás para solda de refluxo de materiais soldados resfriados (12) pelo direcionamento de um jato de gás diretamente sobre os materiais e dessa forma usa-se menos gás de resfriamento. Um aquecedor (32) está associado ao sistema de resfriamento para remover os depósitos de dissolvente. O sistema de resfriamento do aparelho de solda de refluxo está instalado numa seção de resfriamento (18) e compreende pelo menos uma lâmina de gás (24,25) para dirigir um jato de gás nos materiais soldados (12) passando através da seção de resfriamento (18) sobre a esteira (14). Um aquecedor (32) está associado com a lâmina de gás (24,25) o qual é ativado em ciclos de limpeza predeterminados para aquecer a lâmina de gás (24,25) até uma temperatura acima da temperatura de vaporização dos depósitos de dissolventes nos produtos soldados (12).
BR9608999-7A 1995-06-23 1996-05-15 Sistema de resfriamento por lâmina de gás e método para resfriar o material soldado BR9608999A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/493,552 US5577658A (en) 1995-06-23 1995-06-23 Gas knife cooling system
PCT/CA1996/000307 WO1997000752A1 (en) 1995-06-23 1996-05-15 Gas knife cooling system

Publications (1)

Publication Number Publication Date
BR9608999A true BR9608999A (pt) 1999-12-14

Family

ID=23960712

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9608999-7A BR9608999A (pt) 1995-06-23 1996-05-15 Sistema de resfriamento por lâmina de gás e método para resfriar o material soldado

Country Status (14)

Country Link
US (1) US5577658A (pt)
EP (1) EP0833716B1 (pt)
JP (1) JP2001504392A (pt)
KR (1) KR100391219B1 (pt)
CN (1) CN1077476C (pt)
AU (1) AU699983B2 (pt)
BR (1) BR9608999A (pt)
CA (1) CA2224772C (pt)
DE (1) DE69603483T2 (pt)
FI (1) FI112449B (pt)
MY (1) MY115807A (pt)
SG (1) SG92629A1 (pt)
TW (1) TW318158B (pt)
WO (1) WO1997000752A1 (pt)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785233A (en) * 1996-02-01 1998-07-28 Btu International, Inc. Apparatus and method for solder reflow bottom cooling
US5911486A (en) * 1997-02-26 1999-06-15 Conceptronic, Inc. Combination product cooling and flux management apparatus
US5993500A (en) * 1997-10-16 1999-11-30 Speedline Technololies, Inc. Flux management system
US6453810B1 (en) 1997-11-07 2002-09-24 Speedline Technologies, Inc. Method and apparatus for dispensing material in a printer
US6347734B1 (en) * 2000-03-27 2002-02-19 Emc Corporation Methods and apparatus for installing a module on a circuit board using heating and cooling techniques
US6593549B2 (en) * 2001-11-30 2003-07-15 Intel Corporation Cooling device/heater assembly including a supporting bracket for a reflow oven
US20060266793A1 (en) * 2005-05-24 2006-11-30 Caterpillar Inc. Purging system having workpiece movement device
US8110015B2 (en) * 2007-05-30 2012-02-07 Illinois Tool Works, Inc. Method and apparatus for removing contaminants from a reflow apparatus
CN101960931B (zh) * 2008-04-10 2012-09-05 松下电器产业株式会社 流焊装置和流焊方法
DE102008021240B4 (de) * 2008-04-28 2012-11-22 Ersa Gmbh Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung
EP2504121A1 (en) * 2009-11-26 2012-10-03 ATS Automation Tooling Systems Inc. Thermode cleaning method
US20110155707A1 (en) * 2009-12-31 2011-06-30 Du Pont Apollo Limited Laser scribing apparatus and process for solar panel
US8662374B2 (en) 2010-12-16 2014-03-04 Air Liquide Industrial U.S. Lp Method for reduced cycle times in multi-pass welding while providing an inert atmosphere to the welding zone
EP2771145B1 (en) 2011-10-25 2017-02-22 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and device for cooling soldered printed circuit boards
CN102601480A (zh) * 2012-01-01 2012-07-25 刘迎春 一种带喷嘴清洗装置的等离子钎焊***
US20160271716A1 (en) * 2013-10-15 2016-09-22 Luvata Franklin, Inc. Cooling system to reduce liquid metal embrittlement in metal tube and pipe
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
CN117283075B (zh) * 2023-11-23 2024-02-27 徐州工程学院 一种应急照明led灯具生产用无铅波峰焊接机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPS6471571A (en) * 1987-09-11 1989-03-16 Senju Metal Industry Co Reflow furnace
US4912857A (en) * 1988-10-17 1990-04-03 Electrovert Ltd. Cooling and exhaust unit for solder reflow system
US5125556A (en) * 1990-09-17 1992-06-30 Electrovert Ltd. Inerted IR soldering system
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
US5364007A (en) * 1993-10-12 1994-11-15 Air Products And Chemicals, Inc. Inert gas delivery for reflow solder furnaces

Also Published As

Publication number Publication date
CN1188438A (zh) 1998-07-22
WO1997000752A1 (en) 1997-01-09
FI112449B (fi) 2003-12-15
MY115807A (en) 2003-09-30
DE69603483T2 (de) 2000-04-06
SG92629A1 (en) 2002-11-19
KR100391219B1 (ko) 2004-06-12
CN1077476C (zh) 2002-01-09
CA2224772C (en) 2003-02-04
AU699983B2 (en) 1998-12-17
KR19990028362A (ko) 1999-04-15
DE69603483D1 (de) 1999-09-02
EP0833716B1 (en) 1999-07-28
US5577658A (en) 1996-11-26
FI974620A (fi) 1998-01-19
CA2224772A1 (en) 1997-01-09
FI974620A0 (fi) 1997-12-23
EP0833716A1 (en) 1998-04-08
JP2001504392A (ja) 2001-04-03
TW318158B (pt) 1997-10-21
AU5642596A (en) 1997-01-22

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law