BR9606213A - Colocação de componentes - Google Patents
Colocação de componentesInfo
- Publication number
- BR9606213A BR9606213A BR9606213A BR9606213A BR9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A BR 9606213 A BR9606213 A BR 9606213A
- Authority
- BR
- Brazil
- Prior art keywords
- component placement
- placement
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/580,882 US5933349A (en) | 1995-12-29 | 1995-12-29 | Component placement |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9606213A true BR9606213A (pt) | 1998-08-25 |
Family
ID=24322969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9606213A BR9606213A (pt) | 1995-12-29 | 1996-12-30 | Colocação de componentes |
Country Status (7)
Country | Link |
---|---|
US (1) | US5933349A (pt) |
JP (1) | JPH1022695A (pt) |
CN (1) | CN1104836C (pt) |
BR (1) | BR9606213A (pt) |
GB (1) | GB2308682B (pt) |
SG (1) | SG94693A1 (pt) |
TW (2) | TW365105B (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980007918A (ko) * | 1996-06-29 | 1998-03-30 | 배순훈 | 자삽 경로 작성장치 및 그 자삽 경로생성 방법 |
JP2917969B2 (ja) * | 1997-06-06 | 1999-07-12 | 日本電気株式会社 | 論理等価性検証方法および論理等価性検証装置 |
US6195618B1 (en) * | 1998-10-15 | 2001-02-27 | Microscribe, Llc | Component position verification using a probe apparatus |
US6779726B1 (en) * | 1999-11-03 | 2004-08-24 | Solectron Corporation | Method and apparatus for controlling a production operation using printed information on a component tape |
US6689035B1 (en) * | 2000-04-11 | 2004-02-10 | Gerber Scientific Products, Inc. | Method and apparatus for designing and creating a package |
US6832122B1 (en) * | 2000-07-06 | 2004-12-14 | Siemens Electronics Assembly Systems, Inc. | System and method for comparing electronics manufacturing data |
US6594531B2 (en) * | 2000-12-22 | 2003-07-15 | Koninklijke Philips Electronics N.V. | Modular optimizer with foreign module learning feature for optimization of component placement machines |
JP4108298B2 (ja) * | 2001-07-06 | 2008-06-25 | 松下電器産業株式会社 | 電子部品実装装置における生産シミュレーション装置および生産シミュレーション方法 |
JP3711054B2 (ja) * | 2001-09-21 | 2005-10-26 | 三洋電機株式会社 | 部品装着装置における部品配置方法 |
US6829514B2 (en) * | 2003-01-17 | 2004-12-07 | Motorola, Inc. | Balancing workloads in an electronics assembly factory |
EP1583411A3 (en) * | 2004-03-16 | 2007-10-24 | Assembléon N.V. | Method and system for placing components by means of at least one component placement unit |
US7475472B2 (en) * | 2004-08-31 | 2009-01-13 | Milegon Llc | System for assembling a customized printed circuit board |
US7295888B2 (en) * | 2005-09-30 | 2007-11-13 | Caterpillar Inc. | System for evaluating a parts carrier |
US9008836B2 (en) * | 2007-01-09 | 2015-04-14 | Abb Inc. | Method and system for robotic assembly parameter optimization |
TWI406045B (zh) * | 2008-06-30 | 2013-08-21 | Ibm | 具有smt元件作為光閘之光學接觸面板及在該面板上之形成光閘的方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593363A (en) * | 1983-08-12 | 1986-06-03 | International Business Machines Corporation | Simultaneous placement and wiring for VLSI chips |
US4910859A (en) * | 1984-04-06 | 1990-03-27 | Holcomb Gregory W | Circuit assembly system |
JPH0668696B2 (ja) * | 1985-02-22 | 1994-08-31 | 株式会社日立製作所 | 挿入機用ncデータ作成方法 |
US4914808A (en) * | 1987-10-16 | 1990-04-10 | Sanyo Electric Co., Ltd | Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences |
JP2503082B2 (ja) * | 1989-09-05 | 1996-06-05 | 富士機械製造株式会社 | 電子部品装着装置 |
US5155679A (en) * | 1989-12-18 | 1992-10-13 | Hewlett-Packard Company | Set-up optimization for flexible manufacturing systems |
US5040291A (en) * | 1990-05-04 | 1991-08-20 | Universal Instruments Corporation | Multi-spindle pick and place method and apparatus |
JP2800064B2 (ja) * | 1990-06-21 | 1998-09-21 | 松下電器産業株式会社 | 電子部品実装装置およびこれを利用する電子部品実装方法 |
JP2547658B2 (ja) * | 1990-08-10 | 1996-10-23 | 三洋電機株式会社 | 部品装着装置 |
US5212881A (en) * | 1990-09-20 | 1993-05-25 | Tokico Ltd. | Electronic component mounting apparatus |
JP2793033B2 (ja) * | 1990-10-24 | 1998-09-03 | 三洋電機株式会社 | 部品装着装置 |
JP2966082B2 (ja) * | 1990-11-06 | 1999-10-25 | 株式会社日立製作所 | 実装順序決定方法及びその実装方法 |
JPH056212A (ja) * | 1991-06-27 | 1993-01-14 | Mitsubishi Electric Corp | 部品搭載機用データ作成方法 |
JPH05304396A (ja) * | 1991-07-12 | 1993-11-16 | Canon Inc | 部品の実装順序の決定方法及びその装置 |
JPH0618215A (ja) * | 1992-07-01 | 1994-01-25 | Yamaha Motor Co Ltd | 部品装着方法及び装置 |
JP3461532B2 (ja) * | 1993-07-02 | 2003-10-27 | 松下電器産業株式会社 | 実装順序の決定方法 |
-
1995
- 1995-12-29 US US08/580,882 patent/US5933349A/en not_active Expired - Fee Related
-
1996
- 1996-12-23 GB GB9626811A patent/GB2308682B/en not_active Expired - Fee Related
- 1996-12-27 SG SG9611927A patent/SG94693A1/en unknown
- 1996-12-29 CN CN96123898A patent/CN1104836C/zh not_active Expired - Fee Related
- 1996-12-30 BR BR9606213A patent/BR9606213A/pt unknown
-
1997
- 1997-01-06 JP JP9000171A patent/JPH1022695A/ja active Pending
- 1997-01-17 TW TW086100486A patent/TW365105B/zh not_active IP Right Cessation
- 1997-01-17 TW TW087117263A patent/TW404150B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH1022695A (ja) | 1998-01-23 |
GB2308682A (en) | 1997-07-02 |
US5933349A (en) | 1999-08-03 |
GB2308682B (en) | 2000-03-08 |
CN1160985A (zh) | 1997-10-01 |
TW365105B (en) | 1999-07-21 |
GB9626811D0 (en) | 1997-02-12 |
TW404150B (en) | 2000-09-01 |
CN1104836C (zh) | 2003-04-02 |
SG94693A1 (en) | 2003-03-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |