BR9201175A - Composicao de resina epoxi utilizavel na preparacao de um laminado eletrico,laminado eletrico e processo para sua preparacao - Google Patents

Composicao de resina epoxi utilizavel na preparacao de um laminado eletrico,laminado eletrico e processo para sua preparacao

Info

Publication number
BR9201175A
BR9201175A BR929201175A BR9201175A BR9201175A BR 9201175 A BR9201175 A BR 9201175A BR 929201175 A BR929201175 A BR 929201175A BR 9201175 A BR9201175 A BR 9201175A BR 9201175 A BR9201175 A BR 9201175A
Authority
BR
Brazil
Prior art keywords
preparation
electric laminate
composition
epoxy resin
resin usable
Prior art date
Application number
BR929201175A
Other languages
English (en)
Inventor
Masahiko Kohno
Takahiko Ohmura
Masanori Noba
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9614691A external-priority patent/JPH05230186A/ja
Priority claimed from JP18836191A external-priority patent/JPH059269A/ja
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of BR9201175A publication Critical patent/BR9201175A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BR929201175A 1991-04-03 1992-04-02 Composicao de resina epoxi utilizavel na preparacao de um laminado eletrico,laminado eletrico e processo para sua preparacao BR9201175A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9614691A JPH05230186A (ja) 1991-04-03 1991-04-03 電気積層板用エポキシ樹脂組成物
JP18836191A JPH059269A (ja) 1991-07-03 1991-07-03 電気積層板用エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
BR9201175A true BR9201175A (pt) 1992-12-01

Family

ID=26437365

Family Applications (1)

Application Number Title Priority Date Filing Date
BR929201175A BR9201175A (pt) 1991-04-03 1992-04-02 Composicao de resina epoxi utilizavel na preparacao de um laminado eletrico,laminado eletrico e processo para sua preparacao

Country Status (5)

Country Link
US (1) US5405931A (pt)
EP (1) EP0507271A3 (pt)
KR (1) KR920019865A (pt)
BR (1) BR9201175A (pt)
MY (1) MY131084A (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998001494A1 (fr) * 1996-07-04 1998-01-15 Tohto Kasei Co., Ltd. Resine phenolique modifiee contenant un groupe hydroxyle, composition reticulable a base d'une telle resine, produit d'epoxydation de ladite resine modifiee, et composition reticulable a base d'un tel produit
TW459016B (en) * 1998-03-13 2001-10-11 Sumitomo Chemical Co Epoxy resin composition and resin-encapsulated semiconductor device
EP1513890A1 (en) * 2002-05-30 2005-03-16 Dow Global Technologies Inc. Halogen free ignition resistant thermoplastic resin compositions
AU2003230910A1 (en) * 2003-02-06 2004-09-06 Dow Global Technologies Inc. Halogen free ignition resistant thermoplastic resin compositions
WO2005017617A1 (en) 2003-07-17 2005-02-24 Honeywell International Inc. Planarization films for advanced microelectronic applications and devices and methods of production thereof
EP1650247A1 (en) * 2004-10-21 2006-04-26 Resolution Research Belgium S.A. Amines-epoxy compositions with high chemical resistance properties
US7623487B2 (en) * 2006-05-24 2009-11-24 Nortel Networks Limited OFDM system and method for supporting a wide range of mobility speeds
US7919567B2 (en) * 2006-06-07 2011-04-05 Dow Global Technologies Llc Oligomeric halogenated chain extenders for preparing epoxy resins
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
JP5798566B2 (ja) 2009-11-06 2015-10-21 ダウ グローバル テクノロジーズ エルエルシー 電気用積層板用の貯蔵安定性エポキシ樹脂組成物関連出願の相互参照本出願は、２００９年１１月６日付で出願された米国特許出願第６１／２５８，８５８号の優先権を主張し、その全内容は、参照により本明細書に組み込まれる。
JP6274112B2 (ja) 2012-12-12 2018-02-07 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4322456A (en) * 1972-03-13 1982-03-30 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
US3931109A (en) * 1972-03-13 1976-01-06 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
US4186036A (en) * 1978-08-25 1980-01-29 The Dow Chemical Company Weldable coating compositions
US4251594A (en) * 1979-09-27 1981-02-17 The Dow Chemical Company Process for preparing resin impregnated substrates for use in preparing electrical laminates
US4549000A (en) * 1983-03-09 1985-10-22 Vernicolor Ag Thermosetting powder lacquer for covering weld seams
CA1276358C (en) * 1984-01-31 1990-11-13 Dieter H. Klein Epoxy resin for preparing electric laminates
US4710429A (en) * 1985-04-15 1987-12-01 The Dow Chemical Company Laminates from epoxidized phenol-hydrocarbon adducts
US4608406A (en) * 1985-04-18 1986-08-26 Celanese Corporation Stable aqueous epoxy resin dispersions
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
IL80163A (en) * 1985-09-27 1990-11-05 Dow Chemical Co Epoxy resin powder coating composition
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US5212262A (en) * 1987-12-03 1993-05-18 The Dow Chemical Company Epoxy resin advanced with diphenol/diglycidyl ether adducts

Also Published As

Publication number Publication date
EP0507271A2 (en) 1992-10-07
US5405931A (en) 1995-04-11
MY131084A (en) 2007-07-31
KR920019865A (ko) 1992-11-20
EP0507271A3 (en) 1993-04-21

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Legal Events

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EE Request for examination
KF Request for proof of payment of annual fee
FD5 Application fees: dismissal - article 86 of industrial property law