BR8606709A - PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES BEFORE METAL COATING - Google Patents

PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES BEFORE METAL COATING

Info

Publication number
BR8606709A
BR8606709A BR8606709A BR8606709A BR8606709A BR 8606709 A BR8606709 A BR 8606709A BR 8606709 A BR8606709 A BR 8606709A BR 8606709 A BR8606709 A BR 8606709A BR 8606709 A BR8606709 A BR 8606709A
Authority
BR
Brazil
Prior art keywords
conditioning
metal coating
plastic substrates
substrates before
before metal
Prior art date
Application number
BR8606709A
Other languages
Portuguese (pt)
Inventor
Constantine I Courduvelis
David E Stone
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of BR8606709A publication Critical patent/BR8606709A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
BR8606709A 1985-06-24 1986-05-28 PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES BEFORE METAL COATING BR8606709A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74811985A 1985-06-24 1985-06-24
PCT/US1986/001199 WO1987000391A1 (en) 1985-06-24 1986-05-28 Process for conditioning the surface of plastic substrates prior to metal plating

Publications (1)

Publication Number Publication Date
BR8606709A true BR8606709A (en) 1987-08-11

Family

ID=25008108

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8606709A BR8606709A (en) 1985-06-24 1986-05-28 PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES BEFORE METAL COATING

Country Status (9)

Country Link
EP (1) EP0227746A4 (en)
JP (1) JPS63500249A (en)
KR (1) KR880700620A (en)
AU (1) AU580433B2 (en)
BR (1) BR8606709A (en)
CA (1) CA1249188A (en)
ES (1) ES8800992A1 (en)
IL (1) IL79044A0 (en)
WO (1) WO1987000391A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4846929A (en) * 1988-07-13 1989-07-11 Ibm Corporation Wet etching of thermally or chemically cured polyimide
US5015329A (en) * 1988-11-07 1991-05-14 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US4941940A (en) * 1988-11-07 1990-07-17 Jp Laboratories, Inc. Pre-swelling and etching of plastics for plating
US5049230A (en) * 1988-11-07 1991-09-17 Jp Laboratories, Inc. Single step pre-swelling and etching of plastics for plating
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
DE3922477A1 (en) * 1989-07-06 1991-01-17 Schering Ag SOURCING AGENT FOR PRE-TREATING SYNTHETIC RESIN BEFORE ELECTRICIZED METALIZATION
US5183552A (en) * 1989-09-14 1993-02-02 Schering Aktiengesellschaft Process for metallization of a nonconductor surface, especially on a circuit board having preexisting copper surfaces

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333628B1 (en) * 1969-09-05 1978-09-14
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3758332A (en) * 1971-08-20 1973-09-11 Western Electric Co Method of metal coating an epoxy surface
US3790400A (en) * 1972-07-24 1974-02-05 Macdermid Inc Preparation of plastic substrates for electroless plating and solutions therefor
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
JPS5584330A (en) * 1978-12-22 1980-06-25 Teijin Chem Ltd Plating of polycarbonate resin molded article
JPS5827963B2 (en) * 1979-05-17 1983-06-13 日東電工株式会社 Method for manufacturing selectively permeable membrane
US4424095A (en) * 1981-01-12 1984-01-03 Kollmorgen Technologies Corporation Radiation stress relieving of polymer articles
CA1162354A (en) * 1981-09-30 1984-02-21 John F. Fogarty Process for electroless metal plating of a polysulfone substrate
JPS61252691A (en) * 1985-05-02 1986-11-10 キヤノン株式会社 Manufacture of printed circuit board

Also Published As

Publication number Publication date
IL79044A0 (en) 1986-09-30
EP0227746A1 (en) 1987-07-08
ES8800992A1 (en) 1987-12-01
AU5991486A (en) 1987-01-30
WO1987000391A1 (en) 1987-01-15
KR880700620A (en) 1988-03-15
CA1249188A (en) 1989-01-24
EP0227746A4 (en) 1987-10-06
ES556423A0 (en) 1987-12-01
JPS63500249A (en) 1988-01-28
AU580433B2 (en) 1989-01-12

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