BR8505473A - Processo para produzir uma pluralidade de elementos conectores deformaveis,processo para produzir cada parte de um conector de duas partes mecanicamente separavel possuindo multiplos elementos conectores elementos conectores deformaveis e conector multiplo mecanicamente separavel para ligacoes eletricas de componentes microeletronicas - Google Patents

Processo para produzir uma pluralidade de elementos conectores deformaveis,processo para produzir cada parte de um conector de duas partes mecanicamente separavel possuindo multiplos elementos conectores elementos conectores deformaveis e conector multiplo mecanicamente separavel para ligacoes eletricas de componentes microeletronicas

Info

Publication number
BR8505473A
BR8505473A BR8505473A BR8505473A BR8505473A BR 8505473 A BR8505473 A BR 8505473A BR 8505473 A BR8505473 A BR 8505473A BR 8505473 A BR8505473 A BR 8505473A BR 8505473 A BR8505473 A BR 8505473A
Authority
BR
Brazil
Prior art keywords
mechanically
electronically
connector
connecting elements
produce
Prior art date
Application number
BR8505473A
Other languages
English (en)
Inventor
Wolfgang Ehrfeld
Peter Hagmann
Dietrich Munchmeyer
Erwin Willy Becker
Original Assignee
Kernforschungsz Karlsruhe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19843440109 external-priority patent/DE3440109A1/de
Priority claimed from DE3440110A external-priority patent/DE3440110C1/de
Application filed by Kernforschungsz Karlsruhe filed Critical Kernforschungsz Karlsruhe
Publication of BR8505473A publication Critical patent/BR8505473A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
BR8505473A 1984-11-02 1985-11-01 Processo para produzir uma pluralidade de elementos conectores deformaveis,processo para produzir cada parte de um conector de duas partes mecanicamente separavel possuindo multiplos elementos conectores elementos conectores deformaveis e conector multiplo mecanicamente separavel para ligacoes eletricas de componentes microeletronicas BR8505473A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19843440109 DE3440109A1 (de) 1984-11-02 1984-11-02 Verfahren zur herstellung verformbarer vielfach-verbindungen fuer den elektrischen anschluss mikroelektronischer bauelemente und nach diesem verfahren hergestellte vielfachverbindungen
DE3440110A DE3440110C1 (de) 1984-11-02 1984-11-02 Verfahren zur Herstellung mechanisch trennbarer Vielfach-Verbindungen fuer den elektrischen Anschluss mikroelektronischer Bauelemente

Publications (1)

Publication Number Publication Date
BR8505473A true BR8505473A (pt) 1986-08-05

Family

ID=25826190

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8505473A BR8505473A (pt) 1984-11-02 1985-11-01 Processo para produzir uma pluralidade de elementos conectores deformaveis,processo para produzir cada parte de um conector de duas partes mecanicamente separavel possuindo multiplos elementos conectores elementos conectores deformaveis e conector multiplo mecanicamente separavel para ligacoes eletricas de componentes microeletronicas

Country Status (2)

Country Link
US (1) US4703559A (pt)
BR (1) BR8505473A (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
JP2573016B2 (ja) * 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
CA2017743C (en) * 1989-06-30 1996-02-06 William C. Hu Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics
DE4024275A1 (de) * 1990-07-31 1992-02-06 Kernforschungsz Karlsruhe Verfahren zur herstellung von mikrostrukturen mit bereichsweise unterschiedlicher strukturhoehe
US5189777A (en) * 1990-12-07 1993-03-02 Wisconsin Alumni Research Foundation Method of producing micromachined differential pressure transducers
US5206983A (en) * 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
US5378583A (en) * 1992-12-22 1995-01-03 Wisconsin Alumni Research Foundation Formation of microstructures using a preformed photoresist sheet
US5563470A (en) * 1994-08-31 1996-10-08 Cornell Research Foundation, Inc. Tiled panel display assembly
US5722162A (en) * 1995-10-12 1998-03-03 Fujitsu Limited Fabrication procedure for a stable post
US6129559A (en) * 1996-01-19 2000-10-10 Sumitomo Electric Industries, Ltd. Microconnector and method of manufacturing the same
US6089442A (en) * 1996-04-10 2000-07-18 Canon Kabushiki Kaisha Electrode connection method
US5789140A (en) * 1996-04-25 1998-08-04 Fujitsu Limited Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue
US8129845B2 (en) * 2007-09-25 2012-03-06 Stats Chippac, Ltd. Semiconductor device and method of forming interconnect structure in non-active area of wafer

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1379558A (en) * 1971-05-15 1975-01-02 Int Computers Ltd Methods of manufacture of multilayer circuit structures
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3967162A (en) * 1974-07-24 1976-06-29 Amp Incorporated Interconnection of oppositely disposed circuit devices
US3953924A (en) * 1975-06-30 1976-05-04 Rockwell International Corporation Process for making a multilayer interconnect system
US4050756A (en) * 1975-12-22 1977-09-27 International Telephone And Telegraph Corporation Conductive elastomer connector and method of making same
US4067104A (en) * 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
JPS53147968A (en) * 1977-05-30 1978-12-23 Hitachi Ltd Thick film circuit board
DE3039110A1 (de) * 1980-10-16 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Verfahren fuer die spannungsfreie entwicklung von bestrahlten polymethylmetacrylatschichten
US4404059A (en) * 1982-05-26 1983-09-13 Livshits Vladimir I Process for manufacturing panels to be used in microelectronic systems

Also Published As

Publication number Publication date
US4703559A (en) 1987-11-03

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Legal Events

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