BR8500047A - Dispositivo semicondutor de potencia aglutinado por compressao - Google Patents
Dispositivo semicondutor de potencia aglutinado por compressaoInfo
- Publication number
- BR8500047A BR8500047A BR8500047A BR8500047A BR8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A BR 8500047 A BR8500047 A BR 8500047A
- Authority
- BR
- Brazil
- Prior art keywords
- agglutinated
- semi
- compression
- power device
- conductive power
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56907784A | 1984-01-09 | 1984-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8500047A true BR8500047A (pt) | 1985-08-13 |
Family
ID=24274012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8500047A BR8500047A (pt) | 1984-01-09 | 1985-01-07 | Dispositivo semicondutor de potencia aglutinado por compressao |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0152168A3 (pt) |
JP (1) | JPS60161625A (pt) |
BR (1) | BR8500047A (pt) |
CA (1) | CA1218765A (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115020525B (zh) * | 2022-07-12 | 2023-11-07 | 晶澳(扬州)太阳能科技有限公司 | 一种背结太阳能电池及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL135878C (pt) * | 1961-08-12 | |||
JPS552734B2 (pt) * | 1972-08-31 | 1980-01-22 | ||
DE2257078A1 (de) * | 1972-11-21 | 1974-05-30 | Siemens Ag | Halbleiterbauelement mit druckkontakt |
JPS5510134A (en) * | 1978-07-05 | 1980-01-24 | Arai Pump Mfg Co Ltd | Shaft sealing unit |
JPS6014507B2 (ja) * | 1980-05-26 | 1985-04-13 | 三菱電機株式会社 | 加圧接触形半導体装置 |
-
1985
- 1985-01-07 BR BR8500047A patent/BR8500047A/pt unknown
- 1985-01-08 EP EP85300126A patent/EP0152168A3/en not_active Withdrawn
- 1985-01-08 CA CA000471666A patent/CA1218765A/en not_active Expired
- 1985-01-08 JP JP47485A patent/JPS60161625A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
CA1218765A (en) | 1987-03-03 |
EP0152168A3 (en) | 1987-01-21 |
JPS60161625A (ja) | 1985-08-23 |
EP0152168A2 (en) | 1985-08-21 |
JPH0247103B2 (pt) | 1990-10-18 |
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