BR7305010D0 - Involucro para pastilhas de lsi e um processo para fabrica-lo - Google Patents
Involucro para pastilhas de lsi e um processo para fabrica-loInfo
- Publication number
- BR7305010D0 BR7305010D0 BR5010/73A BR501073A BR7305010D0 BR 7305010 D0 BR7305010 D0 BR 7305010D0 BR 5010/73 A BR5010/73 A BR 5010/73A BR 501073 A BR501073 A BR 501073A BR 7305010 D0 BR7305010 D0 BR 7305010D0
- Authority
- BR
- Brazil
- Prior art keywords
- manufacture
- lsi package
- package insulation
- insulation
- lsi
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2924/0001—Technical content checked by a classifier
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Making Paper Articles (AREA)
- Air Bags (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27044872A | 1972-07-10 | 1972-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR7305010D0 true BR7305010D0 (pt) | 1974-08-22 |
Family
ID=23031361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR5010/73A BR7305010D0 (pt) | 1972-07-10 | 1973-07-05 | Involucro para pastilhas de lsi e um processo para fabrica-lo |
Country Status (7)
Country | Link |
---|---|
US (1) | US4115837A (pt) |
JP (1) | JPS5228547B2 (pt) |
AT (1) | AT356713B (pt) |
BR (1) | BR7305010D0 (pt) |
ES (1) | ES417197A1 (pt) |
IT (1) | IT991087B (pt) |
NO (1) | NO143441C (pt) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5433830Y2 (pt) * | 1974-05-31 | 1979-10-17 | ||
JPS5213772A (en) * | 1975-07-22 | 1977-02-02 | Kyocera Corp | Ic package |
JPS5236472A (en) * | 1975-09-17 | 1977-03-19 | Mitsubishi Electric Corp | Semiconductor unit |
JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
DE3061383D1 (en) * | 1979-02-19 | 1983-01-27 | Fujitsu Ltd | Semiconductor device and method for manufacturing the same |
US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
EP0054069A1 (en) * | 1980-06-19 | 1982-06-23 | Digital Equipment Corporation | Heat pin integrated circuit packaging |
JPS59139652A (ja) * | 1983-12-02 | 1984-08-10 | Hitachi Ltd | 電子回路装置の実装構造 |
US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
DE3567771D1 (en) * | 1984-11-02 | 1989-02-23 | Siemens Ag | Wave resistance-adapted chip support for a microwave semiconductor |
US4916515A (en) * | 1985-06-03 | 1990-04-10 | Levi Clifford A | Microwave circuit integrating |
JPS63181399A (ja) * | 1987-01-22 | 1988-07-26 | 日本特殊陶業株式会社 | 高熱伝導性厚膜多層配線基板 |
US5159750A (en) * | 1989-12-20 | 1992-11-03 | National Semiconductor Corporation | Method of connecting an IC component with another electrical component |
US5008734A (en) * | 1989-12-20 | 1991-04-16 | National Semiconductor Corporation | Stadium-stepped package for an integrated circuit with air dielectric |
DE69009429T2 (de) * | 1989-12-29 | 1994-09-15 | Sumitomo Electric Industries | Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit. |
JPH04164361A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 樹脂封止型半導体装置 |
US5325268A (en) * | 1993-01-28 | 1994-06-28 | National Semiconductor Corporation | Interconnector for a multi-chip module or package |
EP1805809B1 (en) * | 2004-10-22 | 2019-10-09 | Signify Holding B.V. | Semiconductor light emitting device with improved heatsinking |
EP2737527A4 (en) * | 2011-07-25 | 2015-04-22 | Interplex Ind Inc | HERMETIC CIRCUIT BOX WITHOUT CONNECTION GRID |
US10374387B2 (en) * | 2017-11-10 | 2019-08-06 | Finisar Corporation | High power cavity package for light emitters |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202925C (pt) * | 1969-04-30 | 1900-01-01 | ||
US3277957A (en) * | 1964-04-03 | 1966-10-11 | Westinghouse Electric Corp | Heat transfer apparatus for electronic component |
US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
JPS5332233B1 (pt) * | 1968-12-25 | 1978-09-07 | ||
US3634600A (en) * | 1969-07-22 | 1972-01-11 | Ceramic Metal Systems Inc | Ceramic package |
US3601522A (en) * | 1970-06-18 | 1971-08-24 | American Lava Corp | Composite ceramic package breakaway notch |
-
1972
- 1972-11-14 JP JP47114643A patent/JPS5228547B2/ja not_active Expired
-
1973
- 1973-07-05 AT AT594773A patent/AT356713B/de not_active IP Right Cessation
- 1973-07-05 BR BR5010/73A patent/BR7305010D0/pt unknown
- 1973-07-09 IT IT26386/73A patent/IT991087B/it active
- 1973-07-09 NO NO2813/73A patent/NO143441C/no unknown
- 1973-07-10 ES ES417197A patent/ES417197A1/es not_active Expired
-
1974
- 1974-12-20 US US05/534,853 patent/US4115837A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ES417197A1 (es) | 1976-06-01 |
ATA594773A (de) | 1979-10-15 |
JPS4938575A (pt) | 1974-04-10 |
AT356713B (de) | 1980-05-27 |
NO143441B (no) | 1980-11-03 |
NO143441C (no) | 1981-02-11 |
IT991087B (it) | 1975-07-30 |
JPS5228547B2 (pt) | 1977-07-27 |
US4115837A (en) | 1978-09-19 |
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