BR112021020874A2 - Material absorvente, dispositivo eletrônico, uso de material absorvente e método de absorção de ondas eletromagnéticas milimétricas - Google Patents

Material absorvente, dispositivo eletrônico, uso de material absorvente e método de absorção de ondas eletromagnéticas milimétricas

Info

Publication number
BR112021020874A2
BR112021020874A2 BR112021020874A BR112021020874A BR112021020874A2 BR 112021020874 A2 BR112021020874 A2 BR 112021020874A2 BR 112021020874 A BR112021020874 A BR 112021020874A BR 112021020874 A BR112021020874 A BR 112021020874A BR 112021020874 A2 BR112021020874 A2 BR 112021020874A2
Authority
BR
Brazil
Prior art keywords
absorbent material
electromagnetic wave
electronic device
wave absorption
absorption method
Prior art date
Application number
BR112021020874A
Other languages
English (en)
Inventor
Erik Gubbels
Ingolf Hennig
Martina Schoemer
Peter Eibeck
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BR112021020874A2 publication Critical patent/BR112021020874A2/pt

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/004—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems using non-directional dissipative particles, e.g. ferrite powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0856—Iron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

material absorvente, dispositivo eletrônico, uso de material absorvente e método de absorção de ondas eletromagnéticas milimétricas. a presente invenção refere-se a um material absorvente de ondas eletromagnéticas milimétricas, preferencialmente que possui resistividade de volume de mais de 1 ocm, que contém partículas sólidas que possuem razão de aspecto (comprimento:diâmetro) de pelo menos 5 de um primeiro material condutor de eletricidade, em que as partículas possuem razão de aspecto (comprimento:diâmetro) de menos de 5 de segundo material condutor de eletricidade e um polímero não condutor de eletricidade, em que o material absorvente é capaz de absorver ondas eletromagnéticas na faixa de frequências de 60 ghz ou mais. a presente invenção também se refere ao seu uso e método de absorção, bem como a um aparelho sensor que compreende o mencionado material absorvente.
BR112021020874A 2019-06-05 2020-05-27 Material absorvente, dispositivo eletrônico, uso de material absorvente e método de absorção de ondas eletromagnéticas milimétricas BR112021020874A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019006227 2019-06-05
PCT/EP2020/064697 WO2020244995A1 (en) 2019-06-05 2020-05-27 Electromagnetic waves absorbing material

Publications (1)

Publication Number Publication Date
BR112021020874A2 true BR112021020874A2 (pt) 2021-12-21

Family

ID=70922016

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021020874A BR112021020874A2 (pt) 2019-06-05 2020-05-27 Material absorvente, dispositivo eletrônico, uso de material absorvente e método de absorção de ondas eletromagnéticas milimétricas

Country Status (9)

Country Link
US (1) US20220225551A1 (pt)
EP (1) EP3980486A1 (pt)
JP (1) JP2022536109A (pt)
KR (1) KR20220019022A (pt)
CN (1) CN113993938A (pt)
BR (1) BR112021020874A2 (pt)
CA (1) CA3142607A1 (pt)
MX (1) MX2021014780A (pt)
WO (1) WO2020244995A1 (pt)

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KR20230109184A (ko) 2020-11-30 2023-07-19 바스프 에스이 전자기파 흡수 재료
EP4023709A1 (en) * 2020-12-31 2022-07-06 SHPP Global Technologies B.V. Pbt-carbon fiber composites for microwave shielding
CN113745850B (zh) * 2021-08-05 2024-04-09 江苏大学 一种碳基宽带太赫兹吸收器及其制备方法
KR102549185B1 (ko) * 2022-09-16 2023-06-28 임윤희 레이더 흡수 조성물
CN115521710A (zh) * 2022-09-28 2022-12-27 湖南航天磁电有限责任公司 一种低频吸波涂层及其制备方法
CN116573901B (zh) * 2023-03-31 2023-12-05 重庆大学溧阳智慧城市研究院 基于3d打印技术的定向钢纤维电磁吸波混凝土超结构

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Also Published As

Publication number Publication date
CN113993938A (zh) 2022-01-28
JP2022536109A (ja) 2022-08-12
MX2021014780A (es) 2022-01-18
EP3980486A1 (en) 2022-04-13
CA3142607A1 (en) 2020-12-10
WO2020244995A1 (en) 2020-12-10
KR20220019022A (ko) 2022-02-15
US20220225551A1 (en) 2022-07-14

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