BR112014020269A8 - Formulação polimérica semicondutora e seu uso, fio ou cabo - Google Patents
Formulação polimérica semicondutora e seu uso, fio ou caboInfo
- Publication number
- BR112014020269A8 BR112014020269A8 BR112014020269A BR112014020269A BR112014020269A8 BR 112014020269 A8 BR112014020269 A8 BR 112014020269A8 BR 112014020269 A BR112014020269 A BR 112014020269A BR 112014020269 A BR112014020269 A BR 112014020269A BR 112014020269 A8 BR112014020269 A8 BR 112014020269A8
- Authority
- BR
- Brazil
- Prior art keywords
- wire
- cable
- semiconductor
- formulation
- polymer formulation
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/14—Copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/24—Sheathing; Armouring; Screening; Applying other protective layers by extrusion
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/10—Peculiar tacticity
- C08L2207/14—Amorphous or atactic polypropylene
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Conductive Materials (AREA)
- Organic Insulating Materials (AREA)
Abstract
FORMULAÇÃO POLIMÉRICA SEMICONDUTORA E SEU USO, FIO OU CABO. A presente invenção refere-se a uma formulação polimérica semicondutora caracterizada por um copolímero etilênico compreendendo unidades comonoméricas polares; um homopolímero ou copolímero olefínico; e uma carga condutora; onde o homopolímero ou copolímero olefínico possui grau de cristalinidade abaixo de 20%. A invenção também se refere a um fico ou cabo caracterizados pela referida formulação polimérica semicondutora e ao uso da referida formulação para a produção de uma camada, preferencialmente uma camada de blindagem semicondutora de um fio ou cabo.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12001032 | 2012-02-16 | ||
PCT/EP2013/000283 WO2013120582A1 (en) | 2012-02-16 | 2013-01-31 | Semi-conductive polymer composition |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112014020269A2 BR112014020269A2 (pt) | 2017-06-20 |
BR112014020269A8 true BR112014020269A8 (pt) | 2017-07-11 |
Family
ID=47678686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014020269A BR112014020269A8 (pt) | 2012-02-16 | 2013-01-31 | Formulação polimérica semicondutora e seu uso, fio ou cabo |
Country Status (8)
Country | Link |
---|---|
US (1) | US11688529B2 (pt) |
EP (1) | EP2814883B2 (pt) |
KR (1) | KR101653210B1 (pt) |
CN (1) | CN104080853B (pt) |
BR (1) | BR112014020269A8 (pt) |
EA (1) | EA026888B9 (pt) |
IN (1) | IN2014DN05918A (pt) |
WO (1) | WO2013120582A1 (pt) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3029003B1 (fr) * | 2014-11-26 | 2018-06-29 | Nexans | Dispositif electrique a moyenne ou haute tension |
ES2713195T3 (es) * | 2014-12-17 | 2019-05-20 | Prysmian Spa | Cable de alimentación que tiene una capa semiconductora desprendible en frío |
KR102580573B1 (ko) | 2016-06-30 | 2023-09-21 | 다우 글로벌 테크놀로지스 엘엘씨 | 용접선 및 돌출부가 없는 반도체 차폐물 |
RU2645939C2 (ru) * | 2016-07-06 | 2018-03-01 | Открытое акционерное общество Всероссийский научно-исследовательский, проектно-конструкторский и технологический институт кабельной промышленности (ВНИИ КП) | Полимерная композиция |
WO2018119619A1 (zh) * | 2016-12-27 | 2018-07-05 | 辛范范 | 电缆用屏蔽材料 |
US10975469B2 (en) | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
KR101880534B1 (ko) * | 2017-08-02 | 2018-07-23 | 주식회사 디와이엠 솔루션 | 전력케이블용 반도전성 수지 조성물 및 이의 제조 방법 |
US10626260B2 (en) * | 2017-08-04 | 2020-04-21 | Dym Solution Co., Ltd. | Semiconductive composition for cable |
TW201942234A (zh) * | 2018-03-28 | 2019-11-01 | 美商陶氏全球科技有限責任公司 | 非極性有機聚合物、極性有機聚合物及超低可濕性碳黑之複合物 |
KR102425313B1 (ko) * | 2020-10-23 | 2022-07-27 | (주)티에스씨 | 통신 케이블 조성물, 및 이로 피복된 절연 전선 및 통신 케이블 |
US20240043649A1 (en) * | 2021-02-18 | 2024-02-08 | Borealis Ag | Upgraded polyolefin for electrical components |
KR20220120155A (ko) * | 2021-02-23 | 2022-08-30 | 한화솔루션 주식회사 | 가공성이 우수한 초고압 케이블의 반도전성 수지 조성물 및 이의 제조방법 |
KR20230155640A (ko) * | 2022-05-03 | 2023-11-13 | 한화솔루션 주식회사 | 반도전 컴파운드 조성물 및 이의 제조방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3770531A (en) * | 1972-05-04 | 1973-11-06 | Bell Telephone Labor Inc | Bonding substance for the fabrication of integrated circuits |
US3951871A (en) | 1974-05-16 | 1976-04-20 | Union Carbide Corporation | Deformation resistant shielding composition |
JPS57158906A (en) * | 1981-03-25 | 1982-09-30 | Mitsubishi Petrochemical Co | Semiconductive resin composition |
EP0129617B1 (en) | 1983-06-13 | 1988-02-03 | Du Pont-Mitsui Polychemicals Co., Ltd. | Semiconducting compositions and wires and cables using the same |
JPH06116362A (ja) | 1992-10-02 | 1994-04-26 | Nippon Petrochem Co Ltd | 半導電性樹脂組成物 |
US5889117A (en) | 1995-03-20 | 1999-03-30 | Bicc Cables Corporation | Polymeric compositions for power cables |
JP3551755B2 (ja) * | 1998-04-03 | 2004-08-11 | 日立電線株式会社 | 剥離容易性半導電性樹脂組成物及び電線・ケーブル |
US6455771B1 (en) | 2001-03-08 | 2002-09-24 | Union Carbide Chemicals & Plastics Technology Corporation | Semiconducting shield compositions |
WO2005031761A1 (en) | 2003-09-25 | 2005-04-07 | Dow Global Technologies Inc. | Strippable semiconductive shield and compositions therefor |
EP2037463B1 (en) * | 2007-09-12 | 2011-03-09 | Borealis Technology Oy | Cable comprising with reduced amount of volatile compounds |
EP2128195A1 (en) * | 2008-05-27 | 2009-12-02 | Borealis AG | Strippable semiconductive composition comprising low melt temperature polyolefin |
DE602008005863D1 (de) * | 2008-05-27 | 2011-05-12 | Borealis Ag | Ablösbare halbleitende Zusammensetzung mit bei niedriger Temperatur schmelzenden Polyolefinen |
FR2937041B1 (fr) | 2008-10-09 | 2012-07-20 | Arkema France | Composition semi-conductrice pour cables electriques |
ES2404607T3 (es) | 2010-03-01 | 2013-05-28 | Borealis Ag | Composición de polímero semiconductor que comprende un copolímero polar |
KR101909012B1 (ko) | 2010-06-10 | 2018-10-17 | 보레알리스 아게 | 새로운 조성물 및 이의 용도 |
-
2013
- 2013-01-31 EA EA201491389A patent/EA026888B9/ru not_active IP Right Cessation
- 2013-01-31 EP EP13702910.4A patent/EP2814883B2/en active Active
- 2013-01-31 BR BR112014020269A patent/BR112014020269A8/pt not_active Application Discontinuation
- 2013-01-31 KR KR1020147022264A patent/KR101653210B1/ko active IP Right Grant
- 2013-01-31 CN CN201380006726.XA patent/CN104080853B/zh active Active
- 2013-01-31 IN IN5918DEN2014 patent/IN2014DN05918A/en unknown
- 2013-01-31 WO PCT/EP2013/000283 patent/WO2013120582A1/en active Application Filing
- 2013-01-31 US US14/374,408 patent/US11688529B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2013120582A1 (en) | 2013-08-22 |
EA026888B1 (ru) | 2017-05-31 |
CN104080853A (zh) | 2014-10-01 |
EP2814883A1 (en) | 2014-12-24 |
IN2014DN05918A (pt) | 2015-06-05 |
BR112014020269A2 (pt) | 2017-06-20 |
US11688529B2 (en) | 2023-06-27 |
KR101653210B1 (ko) | 2016-09-01 |
KR20140112063A (ko) | 2014-09-22 |
EP2814883B2 (en) | 2019-05-15 |
EA026888B9 (ru) | 2017-07-31 |
CN104080853B (zh) | 2017-04-26 |
US20150004411A1 (en) | 2015-01-01 |
EP2814883B1 (en) | 2016-07-27 |
EA201491389A1 (ru) | 2015-01-30 |
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Legal Events
Date | Code | Title | Description |
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B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |