BR112013033489A2 - método para a produção, tintura e montagem de carimbos para impressão por microcontato - Google Patents

método para a produção, tintura e montagem de carimbos para impressão por microcontato

Info

Publication number
BR112013033489A2
BR112013033489A2 BR112013033489A BR112013033489A BR112013033489A2 BR 112013033489 A2 BR112013033489 A2 BR 112013033489A2 BR 112013033489 A BR112013033489 A BR 112013033489A BR 112013033489 A BR112013033489 A BR 112013033489A BR 112013033489 A2 BR112013033489 A2 BR 112013033489A2
Authority
BR
Brazil
Prior art keywords
microcontact printing
stamp
stamps
dyeing
assembling
Prior art date
Application number
BR112013033489A
Other languages
English (en)
Inventor
P Meehan Daniel
J O'hare Jonathan
L Pekurovsky Mikhail
W Greger Richard
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR112013033489A2 publication Critical patent/BR112013033489A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
    • B41K1/26—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor with stamping surfaces adapted for application to non-flat surfaces
    • B41K1/28—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor with stamping surfaces adapted for application to non-flat surfaces flexible
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Printing Methods (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

resumo “método para a produção, tintura e montagem de carimbos para impressão por microcontato” a presente invenção refere-se a um método de preparação de um carimbo de impressão por microcontato dotado de um padrão para impressão por microcontato que inclui fazer uma submatriz, por exemplo, de epóxi, contra a qual um carimbo de impressão por microcontato de polidimetilsiloxano ou outro material de formação do carimbo pode ser formado. o carimbo de impressão por microcontato pode, em seguida, ser exposto a um material de tintura, enquanto que o carimbo de impressão por microcontato ainda permanece contra a submatriz, resultando em um carimbo de impressão por microcontato capaz de fazer inúmeras impressões antes de o material de tintura se esgotar. 1 / 1
BR112013033489A 2011-06-30 2012-06-27 método para a produção, tintura e montagem de carimbos para impressão por microcontato BR112013033489A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161503220P 2011-06-30 2011-06-30
PCT/US2012/044317 WO2013003412A2 (en) 2011-06-30 2012-06-27 Method for making,inking, and mounting stamps for micro-contact printing

Publications (1)

Publication Number Publication Date
BR112013033489A2 true BR112013033489A2 (pt) 2019-09-24

Family

ID=47424778

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013033489A BR112013033489A2 (pt) 2011-06-30 2012-06-27 método para a produção, tintura e montagem de carimbos para impressão por microcontato

Country Status (6)

Country Link
US (1) US9701045B2 (pt)
EP (1) EP2726299A4 (pt)
KR (1) KR101919643B1 (pt)
CN (1) CN103635330B (pt)
BR (1) BR112013033489A2 (pt)
WO (1) WO2013003412A2 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103648782B (zh) 2011-06-30 2016-05-18 3M创新有限公司 用于在不定长度幅材上微接触印刷的设备和方法
CN103796834B (zh) 2011-09-16 2016-02-24 3M创新有限公司 将微接触印刷的压模施加至压印辊的方法和设备
WO2014099507A1 (en) * 2012-12-20 2014-06-26 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
KR102320712B1 (ko) 2013-11-06 2021-11-02 쓰리엠 이노베이티브 프로퍼티즈 캄파니 기능적 특징부를 갖는 미세접촉 인쇄 스탬프
US9463658B2 (en) * 2014-08-27 2016-10-11 JP Design Works, LLC Method and apparatus for stamping concrete
US20170368858A1 (en) * 2014-12-31 2017-12-28 3M Innovative Properties Company Apparatus and method of microcontact printing for improving uniformity
WO2019202571A1 (en) * 2018-04-19 2019-10-24 3M Innovative Properties Company Cast tooling and methods for casting tools
WO2020052749A1 (en) * 2018-09-12 2020-03-19 Applied Materials, Inc. Method of manufacturing a stamp for imprint lithography, stamp for imprint lithography, imprint roller and roll-to-roll substrate processing apparatus
US11319678B2 (en) 2019-04-26 2022-05-03 Unlimited Innovation, Llc Method and apparatus for interlocking stamps
CN114556211A (zh) 2019-12-02 2022-05-27 Ev 集团 E·索尔纳有限责任公司 用于脱离印模的方法和装置
CN111832687B (zh) * 2020-06-23 2022-09-20 厦门大学 一种rfid标签及其制备方法
US11567417B2 (en) 2021-01-20 2023-01-31 Applied Materials, Inc. Anti-slippery stamp landing ring
CN114179536A (zh) * 2021-12-15 2022-03-15 上海豪承信息技术有限公司 一种图案的处理方法
CN117341370B (zh) * 2023-09-21 2024-04-05 浙江大学 一种无外力下贴合曲面物体的软光刻***的制备方法及其产品和应用

Family Cites Families (22)

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Publication number Priority date Publication date Assignee Title
US3019201A (en) * 1959-06-08 1962-01-30 Carter S Ink Co Methods of making porous applicator structures
US3603250A (en) * 1968-11-27 1971-09-07 Mckenna Equipment Co Inc Marking device
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
JP2989453B2 (ja) * 1993-11-30 1999-12-13 三菱鉛筆株式会社 連続気孔を有する多孔性ゴム印材
DE69524247T2 (de) * 1995-08-04 2002-08-08 Ibm Stempel für lithographie-verfahren
US5937758A (en) 1997-11-26 1999-08-17 Motorola, Inc. Micro-contact printing stamp
US6655281B1 (en) * 2000-08-08 2003-12-02 3M Innovative Properties Company Flexographic printing elements with improved air bleed
US6817293B2 (en) 2001-03-28 2004-11-16 Dainippon Printing Co., Ltd. Patterning method with micro-contact printing and its printed product
US20030127002A1 (en) * 2002-01-04 2003-07-10 Hougham Gareth Geoffrey Multilayer architechture for microcontact printing stamps
US7117790B2 (en) * 2002-01-11 2006-10-10 Massachusetts Institute Of Technology Microcontact printing
US6881366B2 (en) * 2002-04-22 2005-04-19 International Business Machines Corporation Process of fabricating a precision microcontact printing stamp
US6656308B2 (en) * 2002-04-22 2003-12-02 International Business Machines Corporation Process of fabricating a precision microcontact printing stamp
GB0323903D0 (en) * 2003-10-11 2003-11-12 Koninkl Philips Electronics Nv Elastomeric stamp,patterning method using such a stamp and method for producing such a stamp
EP1542074A1 (en) * 2003-12-11 2005-06-15 Heptagon OY Manufacturing a replication tool, sub-master or replica
US20060021533A1 (en) * 2004-07-30 2006-02-02 Jeans Albert H Imprint stamp
JP5276436B2 (ja) * 2005-06-10 2013-08-28 オブデュキャット、アクチボラグ 中間スタンプによるパターン複製
KR101358066B1 (ko) * 2006-04-11 2014-02-06 다우 코닝 코포레이션 열변형이 적은 실리콘 복합 모울드
NL1033461C2 (nl) * 2007-02-27 2008-08-28 Richard Gerritse Stempel zichzelf vormend naar onregelmatige ondergronden.
US20090025595A1 (en) * 2007-07-25 2009-01-29 Nano Terra Inc. Contact Printing Method Using an Elastomeric Stamp Having a Variable Surface Area and Variable Shape
JP5727788B2 (ja) * 2007-11-21 2015-06-03 モレキュラー・インプリンツ・インコーポレーテッド ナノインプリント・リソグラフィ用の多孔質テンプレートおよびインプリント用スタック
WO2010002788A1 (en) * 2008-06-30 2010-01-07 3M Innovative Properties Company Solvent assisted method of microcontact printing
CN103648782B (zh) 2011-06-30 2016-05-18 3M创新有限公司 用于在不定长度幅材上微接触印刷的设备和方法

Also Published As

Publication number Publication date
US9701045B2 (en) 2017-07-11
KR20140045517A (ko) 2014-04-16
CN103635330A (zh) 2014-03-12
EP2726299A4 (en) 2015-03-18
CN103635330B (zh) 2016-06-29
WO2013003412A3 (en) 2013-04-25
EP2726299A2 (en) 2014-05-07
WO2013003412A2 (en) 2013-01-03
US20140110879A1 (en) 2014-04-24
KR101919643B1 (ko) 2018-11-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.