BR112012011210A2 - rotating straightening blocks - Google Patents

rotating straightening blocks

Info

Publication number: BR112012011210A2
Authority: BR; Brazil
Prior art keywords: straightening blocks; rotating straightening; rotating; blocks; straightening
Prior art date: 2009-11-12

Application number

BR112012011210A

Other languages

Portuguese (pt)

Inventor

Brant A Moegenburg

Edward J Woo

Gregory A Koehnle

Schoen A Schuknecht

Scott R Culler

Original Assignee

3M Innovative Properties Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-11-12

Filing date

2010-11-09

Publication date

2016-07-05

2010-11-09 Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co

2016-07-05 Publication of BR112012011210A2 publication Critical patent/BR112012011210A2/en

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Polishing Bodies And Polishing Tools (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

BR112012011210A 2009-11-12 2010-11-09 rotating straightening blocks BR112012011210A2 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US26049809P	2009-11-12	2009-11-12
PCT/US2010/055905 WO2011059935A1 (en)	2009-11-12	2010-11-09	Rotary buffing pad

Publications (1)

Publication Number	Publication Date
BR112012011210A2 true BR112012011210A2 (en)	2016-07-05

Family

ID=43558369

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR112012011210A BR112012011210A2 (en)	2009-11-12	2010-11-09	rotating straightening blocks

Country Status (6)

Country	Link
US (1)	US20120258652A1 (en)
EP (1)	EP2498951A1 (en)
CN (1)	CN102639299A (en)
BR (1)	BR112012011210A2 (en)
RU (1)	RU2012116583A (en)
WO (1)	WO2011059935A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI551396B (en)	2013-10-03	2016-10-01	三芳化學工業股份有限公司	Polishing pad and method for making the same
CN104625945B (en) *	2013-11-07	2017-03-01	三芳化学工业股份有限公司	Polishing pad and its manufacture method
US9643294B2 (en) *	2015-07-14	2017-05-09	K&D Pads LLC	Buffing pad and methods of making and using the same
JP6760385B2 (en) *	2016-09-14	2020-09-23	ソニー株式会社	Sensors, input devices and electronics
USD876195S1 (en)	2018-06-13	2020-02-25	Kenneth Luna	Polishing pad
CN113635216A (en) *	2021-08-26	2021-11-12	业成科技（成都）有限公司	Abrasive paper, metallographic grinding method and device
CN115026705B (en) *	2022-06-28	2024-04-12	广东先导微电子科技有限公司	Polishing machine

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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US4962562A (en)	1989-01-18	1990-10-16	Minnesota Mining And Manufacturing Company	Compounding, glazing or polishing pad
USRE37997E1 (en) *	1990-01-22	2003-02-18	Micron Technology, Inc.	Polishing pad with controlled abrasion rate
US5020283A (en) *	1990-01-22	1991-06-04	Micron Technology, Inc.	Polishing pad with uniform abrasion
US5527215A (en)	1992-01-10	1996-06-18	Schlegel Corporation	Foam buffing pad having a finishing surface with a splash reducing configuration
US5329734A (en) *	1993-04-30	1994-07-19	Motorola, Inc.	Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5441598A (en) *	1993-12-16	1995-08-15	Motorola, Inc.	Polishing pad for chemical-mechanical polishing of a semiconductor substrate
DE19700636C2 (en) *	1997-01-10	1999-08-12	Brasseler Gmbh & Co Kg Geb	Grinding tools for dental purposes
US6273806B1 (en) *	1997-05-15	2001-08-14	Applied Materials, Inc.	Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5919082A (en) *	1997-08-22	1999-07-06	Micron Technology, Inc.	Fixed abrasive polishing pad
US6331137B1 (en) *	1998-08-28	2001-12-18	Advanced Micro Devices, Inc	Polishing pad having open area which varies with distance from initial pad surface
KR20000025003A (en) *	1998-10-07	2000-05-06	윤종용	Polishing pad used for chemical and mechanical polishing of semiconductor substrate
US6443809B1 (en) *	1999-11-16	2002-09-03	Chartered Semiconductor Manufacturing, Ltd.	Polishing apparatus and method for forming an integrated circuit
US6520834B1 (en) *	2000-08-09	2003-02-18	Micron Technology, Inc.	Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates
US6620031B2 (en) *	2001-04-04	2003-09-16	Lam Research Corporation	Method for optimizing the planarizing length of a polishing pad
KR100646702B1 (en) *	2001-08-16	2006-11-17	에스케이씨 주식회사	Chemical mechanical polishing pad having holes and/or grooves
CN1318469C (en) *	2002-11-18	2007-05-30	东省A&T株式会社	Method of fabricating polyurethane foam with micro pores and polishing pad therefrom
US7377840B2 (en) *	2004-07-21	2008-05-27	Neopad Technologies Corporation	Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
JP3872081B2 (en) *	2004-12-29	2007-01-24	東邦エンジニアリング株式会社	Polishing pad
US7244170B2 (en) *	2005-09-16	2007-07-17	3M Innovative Properties Co.	Abrasive article and methods of making same
USD536714S1 (en) *	2005-09-16	2007-02-13	3M Innovative Properties Company	Abrasive article with holes
USD538312S1 (en) *	2005-09-16	2007-03-13	3M Innovative Properties Company	Abrasive article with holes
USD554813S1 (en) *	2006-02-11	2007-11-06	Boler Jr Lewyn B	Buffing pad
US20070204420A1 (en)	2006-03-06	2007-09-06	Hornby David M	Polishing pad and method of making
US20070243798A1 (en) *	2006-04-18	2007-10-18	3M Innovative Properties Company	Embossed structured abrasive article and method of making and using the same
US7906051B2 (en)	2006-05-01	2011-03-15	Lake County Manufacturing, Inc.	Foam buffing pad with random or strategically placed collapsed cell structures
US7452265B2 (en) *	2006-12-21	2008-11-18	3M Innovative Properties Company	Abrasive article and methods of making same
US7959694B2 (en) *	2007-03-05	2011-06-14	3M Innovative Properties Company	Laser cut abrasive article, and methods
US8080072B2 (en) *	2007-03-05	2011-12-20	3M Innovative Properties Company	Abrasive article with supersize coating, and methods
US7628829B2 (en) *	2007-03-20	2009-12-08	3M Innovative Properties Company	Abrasive article and method of making and using the same
US20080233850A1 (en) *	2007-03-20	2008-09-25	3M Innovative Properties Company	Abrasive article and method of making and using the same
USD586370S1 (en) *	2007-08-09	2009-02-10	3M Innovative Properties Company	Random hole abrasive disc
TWM352126U (en) *	2008-10-23	2009-03-01	Bestac Advanced Material Co Ltd	Polishing pad

2010
- 2010-11-09 CN CN2010800511806A patent/CN102639299A/en active Pending
- 2010-11-09 WO PCT/US2010/055905 patent/WO2011059935A1/en active Application Filing
- 2010-11-09 EP EP10779390A patent/EP2498951A1/en not_active Withdrawn
- 2010-11-09 RU RU2012116583/02A patent/RU2012116583A/en not_active Application Discontinuation
- 2010-11-09 US US13/497,621 patent/US20120258652A1/en not_active Abandoned
- 2010-11-09 BR BR112012011210A patent/BR112012011210A2/en not_active IP Right Cessation

Also Published As

Publication number	Publication date
WO2011059935A1 (en)	2011-05-19
RU2012116583A (en)	2013-12-20
CN102639299A (en)	2012-08-15
US20120258652A1 (en)	2012-10-11
EP2498951A1 (en)	2012-09-19

Legal Events

Date	Code	Title	Description
2016-09-27	B08F	Application fees: application dismissed [chapter 8.6 patent gazette]	Free format text: REFERENTE A 6A ANUIDADE.
2017-01-17	B08K	Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]	Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2386 DE 27-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.
2021-06-01	B350	Update of information on the portal [chapter 15.35 patent gazette]

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