BR0213751A - Composição adesiva curável - Google Patents

Composição adesiva curável

Info

Publication number
BR0213751A
BR0213751A BR0213751-8A BR0213751A BR0213751A BR 0213751 A BR0213751 A BR 0213751A BR 0213751 A BR0213751 A BR 0213751A BR 0213751 A BR0213751 A BR 0213751A
Authority
BR
Brazil
Prior art keywords
adhesive composition
curable adhesive
polyepoxide resin
polyaloxide
aminophenyl
Prior art date
Application number
BR0213751-8A
Other languages
English (en)
Other versions
BR0213751B1 (pt
Inventor
Clayton Allen George
William John Schultz
Wendy Lee Thompson
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR0213751A publication Critical patent/BR0213751A/pt
Publication of BR0213751B1 publication Critical patent/BR0213751B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Adhesive Tapes (AREA)

Abstract

"COMPOSIçãO ADESIVA CURáVEL". A invenção refere-se a adesivos à base de poliepóxido contendo resina poliepóxida contendo cicloalifático, resina poliepóxida aromática, e 9,9-bis(3-metil-4-aminofenil) fluoreno. Os adesivos proporcionam resistência ao cisalhamento e destacamento aperfeiçoados.
BRPI0213751-8A 2001-11-08 2002-09-23 composição adesiva curável. BR0213751B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/005,556 US6624213B2 (en) 2001-11-08 2001-11-08 High temperature epoxy adhesive films
PCT/US2002/030155 WO2003040251A1 (en) 2001-11-08 2002-09-23 High temperature epoxy adhesive films

Publications (2)

Publication Number Publication Date
BR0213751A true BR0213751A (pt) 2004-10-19
BR0213751B1 BR0213751B1 (pt) 2012-09-04

Family

ID=21716455

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0213751-8A BR0213751B1 (pt) 2001-11-08 2002-09-23 composição adesiva curável.

Country Status (10)

Country Link
US (1) US6624213B2 (pt)
EP (1) EP1442090B1 (pt)
JP (1) JP4242771B2 (pt)
CN (1) CN1256396C (pt)
AT (1) ATE437932T1 (pt)
BR (1) BR0213751B1 (pt)
CA (1) CA2462454C (pt)
DE (1) DE60233153D1 (pt)
ES (1) ES2330926T3 (pt)
WO (1) WO2003040251A1 (pt)

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US20060261312A1 (en) * 2003-05-28 2006-11-23 Lonza Inc. Quaternary ammonium salts containing non-halogen anions as anticorrosive agents
EP1640396A1 (en) * 2003-06-04 2006-03-29 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
US20060240198A1 (en) * 2003-06-04 2006-10-26 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
US8070994B2 (en) 2004-06-18 2011-12-06 Zephyros, Inc. Panel structure
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
CN101287794A (zh) * 2005-08-24 2008-10-15 亨克尔两合股份公司 具有改进的耐冲击性的环氧组合物
PL2049611T3 (pl) 2006-07-31 2019-04-30 Henkel Ag & Co Kgaa Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
WO2008045270A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
US9353434B2 (en) * 2006-10-12 2016-05-31 C3 International, Llc Methods for providing prophylactic surface treatment for fluid processing systems and components thereof
US20080199642A1 (en) * 2007-02-16 2008-08-21 James Barlow Molded Composite Slip Adapted for Engagement With an Internal Surface of a Metal Tubular
US20090011247A1 (en) * 2007-07-02 2009-01-08 Oil States Industries, Inc. Molded Composite Mandrel for a Downhole Zonal Isolation Tool
GB0717867D0 (en) * 2007-09-14 2007-10-24 3M Innovative Properties Co Flexible epoxy-based compositions
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR20100091196A (ko) * 2007-10-26 2010-08-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 수성 결합제 또는 사이징 조성물
MX2010004855A (es) * 2007-10-30 2010-06-30 Henkel Ag & Co Kgaa Adhesivos de pasta epoxi resistentes al lavado.
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US8623301B1 (en) 2008-04-09 2014-01-07 C3 International, Llc Solid oxide fuel cells, electrolyzers, and sensors, and methods of making and using the same
US20100192321A1 (en) * 2009-01-30 2010-08-05 3M Innovative Properties Company Hair and lint cleaning tool
KR101727345B1 (ko) 2009-09-11 2017-04-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 및 경화된 접착제 조성물
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
US20130146469A1 (en) 2010-02-10 2013-06-13 Ut-Battelle, Llc Low Temperature Electrolytes for Solid Oxide Cells Having High Ionic Conductivity
CN103153604B (zh) 2010-03-04 2016-04-13 泽菲罗斯公司 结构复合层压板
WO2012088693A1 (en) * 2010-12-30 2012-07-05 Dow Global Technologies Llc Exterior thermal insulation system
US8840750B2 (en) 2012-02-29 2014-09-23 United Technologies Corporation Method of bonding a leading edge sheath to a blade body of a fan blade
US20140299268A1 (en) * 2013-04-09 2014-10-09 The Boeing Company Thermally Curable Bonding Film Adhesive with Uniform Thickness
EP3022792A4 (en) 2013-07-15 2016-12-21 Fcet Inc LOW TEMPERATURE solid oxide fuel cells
CN105722933A (zh) 2013-07-26 2016-06-29 泽费罗斯股份有限公司 热固性粘合膜的改进或涉及它的改进
US10087707B2 (en) 2013-09-12 2018-10-02 Weatherford Technology Holdings, Llc Molded composite slip of sheet molded compound for downhole tool
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
CN104388028A (zh) * 2014-12-01 2015-03-04 南京大学 一种韧性耐高温环氧树脂粘合剂
TWI600674B (zh) * 2016-04-15 2017-10-01 南亞塑膠工業股份有限公司 二環戊二烯－酚樹脂與２，６二甲基苯酚共聚物環氧樹脂製造與應用
WO2019116348A1 (en) 2017-12-15 2019-06-20 3M Innovative Properties Company High temperature structural adhesive films
WO2020003122A1 (en) 2018-06-27 2020-01-02 3M Innovative Properties Company Curable compositions and related methods
US20210355268A1 (en) * 2018-10-31 2021-11-18 3M Innovative Properties Company Curable adhesive, bonding film, and method of bonding the same
CN115916862A (zh) * 2020-07-13 2023-04-04 汉高股份有限及两合公司 用于铜粘合的导电环氧树脂组合物
CN112063344A (zh) * 2020-08-07 2020-12-11 江苏东邦科技有限公司 用于汽车内装的高韧性低挥发接着剂及接着剂膜
US20240010889A1 (en) * 2020-12-24 2024-01-11 Sika Technology Ag One-component thermosetting epoxy adhesive with improved adhesion at high temperatures
WO2023168177A1 (en) * 2022-03-03 2023-09-07 Henkel Ag & Co. Kgaa Epoxy structural adhesives resistant to uncured and cured humidity exposure

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US3449280A (en) 1960-04-27 1969-06-10 Minnesota Mining & Mfg Adhesive composition containing high molecular weight polyamides,epoxy resins and curing agents
US3298998A (en) 1961-03-07 1967-01-17 Eastman Kodak Co Bisglycidyl ethers of bisphenols
US3316195A (en) 1961-11-13 1967-04-25 Raybestos Manhattan Inc Curable binder composition comprising epoxy resin, curing agent, and polymeric latex
US3332908A (en) 1965-02-08 1967-07-25 Union Carbide Corp Glycidyl ethers
US3894112A (en) 1969-10-31 1975-07-08 Minnesota Mining & Mfg Bonding film containing polytetramethyleneoxide elastomeric segments and polyepoxide
US3833683A (en) 1970-12-21 1974-09-03 Ford Motor Co Rubber-modified thermosets and process i
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US3864426A (en) 1973-05-23 1975-02-04 Union Carbide Corp Thermal shock resistant epoxy compositions
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US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
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JP2643706B2 (ja) * 1991-11-26 1997-08-20 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置
JPH07165880A (ja) 1993-12-14 1995-06-27 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物
JP3821870B2 (ja) 1994-10-07 2006-09-13 スリーエム カンパニー 難燃性熱硬化性樹脂組成物
JPH08291278A (ja) 1995-04-21 1996-11-05 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物及び接着性フィルム
JPH098178A (ja) 1995-06-14 1997-01-10 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及びそれを用いた半導体装置
US6180696B1 (en) 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6294270B1 (en) 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
JP2001064483A (ja) * 1999-08-27 2001-03-13 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物
US6379799B1 (en) 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners

Also Published As

Publication number Publication date
CN1582320A (zh) 2005-02-16
CA2462454C (en) 2009-11-24
JP4242771B2 (ja) 2009-03-25
CN1256396C (zh) 2006-05-17
BR0213751B1 (pt) 2012-09-04
ES2330926T3 (es) 2009-12-17
EP1442090A1 (en) 2004-08-04
EP1442090B1 (en) 2009-07-29
WO2003040251A1 (en) 2003-05-15
JP2005508436A (ja) 2005-03-31
DE60233153D1 (de) 2009-09-10
US20030125423A1 (en) 2003-07-03
CA2462454A1 (en) 2003-05-15
ATE437932T1 (de) 2009-08-15
US6624213B2 (en) 2003-09-23

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/09/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE. PAGAR RESTAURACAO.

B21H Decision of lapse of a patent or of a certificate of addition of invention cancelled [chapter 21.8 patent gazette]

Free format text: REFERENTE AO DESPACHO 21.6 PUBLICADO NA RPI 2280 DE 16/09/2014.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 13A ANUIDADE.

B21H Decision of lapse of a patent or of a certificate of addition of invention cancelled [chapter 21.8 patent gazette]

Free format text: REFERENTE AO DESPACHOP 21.6 PUBLICADO NA RPI 2324 DE 21/07/2015.

B15K Others concerning applications: alteration of classification

Ipc: C09J 163/00 (2006.01), C08G 59/50 (2006.01), C08K