BR0213421A - método para formar uma camada de metal condutor em uma superfìcie não condutora - Google Patents
método para formar uma camada de metal condutor em uma superfìcie não condutoraInfo
- Publication number
- BR0213421A BR0213421A BRPI0213421-7A BR0213421A BR0213421A BR 0213421 A BR0213421 A BR 0213421A BR 0213421 A BR0213421 A BR 0213421A BR 0213421 A BR0213421 A BR 0213421A
- Authority
- BR
- Brazil
- Prior art keywords
- forming
- metal layer
- conductive metal
- nonconductive surface
- conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
"MéTODO PARA FORMAR UMA CAMADA DE METAL CONDUTOR EM UMA SUPERFìCIE NãO CONDUTORA". Expõe-se um método para formar uma camada de metal condutor em uma superfície não condutora, o qual inclui proporcionar uma superfície não condutora; contactar a superfície não condutora com uma solução aquosa ou mistura que contém um sal estânico para formar uma superfície sensibilizada; contactar a superfície sensibilizada com uma solução aquosa ou mistura que contém um sal de prata dotado de um pH na faixa de cerca de 5 até cerca de 10 para formar uma superfície catalisada; e chapear sem eletrólise a superficie catalisada, mediante aplicação de uma solução de chapeamento sem eletrólise à superfície catalisada.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/981,587 US6645557B2 (en) | 2001-10-17 | 2001-10-17 | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
PCT/US2002/030444 WO2003033764A2 (en) | 2001-10-17 | 2002-09-25 | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0213421A true BR0213421A (pt) | 2006-05-23 |
Family
ID=25528490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0213421-7A BR0213421A (pt) | 2001-10-17 | 2002-09-25 | método para formar uma camada de metal condutor em uma superfìcie não condutora |
Country Status (8)
Country | Link |
---|---|
US (1) | US6645557B2 (pt) |
EP (1) | EP1453988B1 (pt) |
JP (1) | JP4729255B2 (pt) |
CN (1) | CN100338259C (pt) |
AT (1) | ATE512236T1 (pt) |
AU (1) | AU2002327725A1 (pt) |
BR (1) | BR0213421A (pt) |
WO (1) | WO2003033764A2 (pt) |
Families Citing this family (49)
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US20130084395A1 (en) * | 2011-09-29 | 2013-04-04 | Roshan V. Chapaneri | Treatment of Plastic Surfaces After Etching in Nitric Acid Containing Media |
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EP2610365B1 (en) | 2011-12-31 | 2020-02-26 | Rohm and Haas Electronic Materials LLC | Electroless plating method |
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JP6085833B2 (ja) * | 2012-07-04 | 2017-03-01 | 福井県 | 紙への無電解めっき方法 |
US9364822B2 (en) | 2013-06-28 | 2016-06-14 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds |
RU2588918C1 (ru) * | 2014-12-03 | 2016-07-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Саратовский государственный технический университет имени Гагарина Ю.А." | Способ беспалладиевой активации поверхности пластмасс |
US10151035B2 (en) | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
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CN106350788A (zh) * | 2016-09-18 | 2017-01-25 | 电子科技大学 | 化学镀前表面修饰体系及有机聚合物基材的表面修饰方法 |
KR102456518B1 (ko) * | 2016-10-27 | 2022-10-19 | 도쿄엘렉트론가부시키가이샤 | 도금 처리 방법, 도금 처리 장치 및 기억 매체 |
JP6580119B2 (ja) | 2017-12-28 | 2019-09-25 | 石原ケミカル株式会社 | ポリイミド樹脂上への金属皮膜形成方法 |
JP2021524525A (ja) | 2018-07-13 | 2021-09-13 | ソルベイ スペシャルティ ポリマーズ ユーエスエー, エルエルシー | ポリマー成分と金属コーティングとを含む物品/部品 |
WO2020011813A1 (en) | 2018-07-13 | 2020-01-16 | Solvay Specialty Polymers Usa, Llc | Article/part comprising a polymeric component and a metallic coating |
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-
2001
- 2001-10-17 US US09/981,587 patent/US6645557B2/en not_active Expired - Fee Related
-
2002
- 2002-09-25 BR BRPI0213421-7A patent/BR0213421A/pt not_active Application Discontinuation
- 2002-09-25 AU AU2002327725A patent/AU2002327725A1/en not_active Abandoned
- 2002-09-25 EP EP02763729A patent/EP1453988B1/en not_active Expired - Lifetime
- 2002-09-25 WO PCT/US2002/030444 patent/WO2003033764A2/en active Application Filing
- 2002-09-25 AT AT02763729T patent/ATE512236T1/de not_active IP Right Cessation
- 2002-09-25 CN CNB02820574XA patent/CN100338259C/zh not_active Expired - Fee Related
- 2002-09-25 JP JP2003536482A patent/JP4729255B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1592799A (zh) | 2005-03-09 |
ATE512236T1 (de) | 2011-06-15 |
AU2002327725A1 (en) | 2003-04-28 |
US20030113452A1 (en) | 2003-06-19 |
EP1453988B1 (en) | 2011-06-08 |
JP2005537387A (ja) | 2005-12-08 |
EP1453988A2 (en) | 2004-09-08 |
JP4729255B2 (ja) | 2011-07-20 |
WO2003033764A3 (en) | 2004-06-24 |
CN100338259C (zh) | 2007-09-19 |
US6645557B2 (en) | 2003-11-11 |
WO2003033764A2 (en) | 2003-04-24 |
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