BR0007562A - Componente eletrônico e utilização de uma estrutura de proteção nele contida - Google Patents
Componente eletrônico e utilização de uma estrutura de proteção nele contidaInfo
- Publication number
- BR0007562A BR0007562A BR0007562-0A BR0007562A BR0007562A BR 0007562 A BR0007562 A BR 0007562A BR 0007562 A BR0007562 A BR 0007562A BR 0007562 A BR0007562 A BR 0007562A
- Authority
- BR
- Brazil
- Prior art keywords
- electronic component
- protection structure
- structure contained
- guard structure
- conductive surfaces
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Semiconductor Integrated Circuits (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Credit Cards Or The Like (AREA)
- Emergency Protection Circuit Devices (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
Patente de Invenção: "COMPONENTE ELETRôNICO E UTILIZAçãO DE UMA ESTRUTURA DE PROTEçãO NELE CONTIDA". A invenção refere-se a um componente eletrônico com uma camada dielétrica (2) formada numa substrato (10), com superfícies que conduzem eletricidade (4;14) formadas na camada dielétrica e com uma estrutura de proteção que conduz eletricidade (6) que é disposta numa plano acima das superfícies que conduzem eletricidade (6) de tal modo que as superfícies que conduzem eletricidade (4;14) não são (completamente) cobertas pela estrutura de proteção (6).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19901384A DE19901384A1 (de) | 1999-01-15 | 1999-01-15 | Elektronisches Bauelement und Verwendung einer darin enthaltenen Schutzstruktur |
PCT/DE2000/000112 WO2000042657A1 (de) | 1999-01-15 | 2000-01-13 | Elektronisches bauelement und verwendung einer darin enthaltenen schutzstruktur |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0007562A true BR0007562A (pt) | 2001-10-23 |
Family
ID=7894368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0007562-0A BR0007562A (pt) | 1999-01-15 | 2000-01-13 | Componente eletrônico e utilização de uma estrutura de proteção nele contida |
Country Status (11)
Country | Link |
---|---|
US (1) | US6714392B2 (pt) |
EP (1) | EP1129485B1 (pt) |
JP (1) | JP4035289B2 (pt) |
KR (1) | KR100426232B1 (pt) |
CN (1) | CN1150622C (pt) |
AT (1) | ATE357743T1 (pt) |
BR (1) | BR0007562A (pt) |
DE (2) | DE19901384A1 (pt) |
RU (1) | RU2220476C2 (pt) |
UA (1) | UA72234C2 (pt) |
WO (1) | WO2000042657A1 (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9922572D0 (en) * | 1999-09-24 | 1999-11-24 | Koninkl Philips Electronics Nv | Capacitive sensing array devices |
DE10059099C1 (de) * | 2000-11-28 | 2002-06-06 | Infineon Technologies Ag | Bauelement mit ESD-Schutz, z.B. Foliensensor zur biometrischen Erkennung (Fingerabdruckerkennungssensor) |
DE10110724A1 (de) * | 2001-03-06 | 2002-09-26 | Infineon Technologies Ag | Fingerabdrucksensor mit Potentialmodulation des ESD-Schutzgitters |
DE10119782C1 (de) * | 2001-04-23 | 2002-10-17 | Infineon Technologies Ag | Verfahren zum Schutz eines IC vor Auslesen sicherheitsrelevanter Daten (Reverse-Engineering) |
US6515488B1 (en) * | 2001-05-07 | 2003-02-04 | Stmicroelectronics, Inc. | Fingerprint detector with scratch resistant surface and embedded ESD protection grid |
DE10126839A1 (de) * | 2001-06-01 | 2002-12-19 | Infineon Technologies Ag | Biometrischer Sensor |
DE10139414A1 (de) * | 2001-08-17 | 2003-02-27 | Giesecke & Devrient Gmbh | Halbleiterschaltungsanordnung mit biometrischem Sensor und Auswerteeinheit |
DE10309614A1 (de) * | 2003-03-05 | 2004-09-23 | Infineon Technologies Ag | Halbleiterstruktur und Verfahren zur Herstellung derselben |
KR101219750B1 (ko) * | 2004-12-07 | 2013-01-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그의 제작방법 |
JP5025134B2 (ja) * | 2005-01-21 | 2012-09-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US7329605B2 (en) * | 2005-03-31 | 2008-02-12 | Agere Systems Inc. | Semiconductor structure formed using a sacrificial structure |
CN101401106B (zh) * | 2006-02-24 | 2012-07-11 | Jds尤尼弗思公司 | 减少绝缘体上导电体的静电放电的方法 |
KR102007000B1 (ko) | 2011-03-04 | 2019-08-02 | 비자 인터네셔널 서비스 어소시에이션 | 지불 카드 시스템 및 방법 |
EP3206027B1 (en) | 2016-02-11 | 2019-09-11 | Sensirion AG | Sensor chip comprising electrostatic discharge protection element |
US20170285778A1 (en) * | 2016-04-01 | 2017-10-05 | Intel Corporation | Electronic device with fingerprint sensor |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2244164A (en) * | 1990-05-18 | 1991-11-20 | Philips Electronic Associated | Fingerprint sensing |
US5357397A (en) * | 1993-03-15 | 1994-10-18 | Hewlett-Packard Company | Electric field emitter device for electrostatic discharge protection of integrated circuits |
US5686761A (en) * | 1995-06-06 | 1997-11-11 | Advanced Micro Devices, Inc. | Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology |
GB9513420D0 (en) * | 1995-06-30 | 1995-09-06 | Philips Electronics Uk Ltd | Power semiconductor devices |
US6114862A (en) * | 1996-02-14 | 2000-09-05 | Stmicroelectronics, Inc. | Capacitive distance sensor |
US6259804B1 (en) * | 1997-05-16 | 2001-07-10 | Authentic, Inc. | Fingerprint sensor with gain control features and associated methods |
US6483931B2 (en) * | 1997-09-11 | 2002-11-19 | Stmicroelectronics, Inc. | Electrostatic discharge protection of a capacitve type fingerprint sensing array |
US6087253A (en) * | 1998-03-03 | 2000-07-11 | Vanguard International Semiconductor Corporation | Method of forming landing plugs for PMOS and NMOS |
US6002569A (en) * | 1998-06-29 | 1999-12-14 | Hewlett-Packard Company | Electrostatic discharge protection apparatus |
-
1999
- 1999-01-15 DE DE19901384A patent/DE19901384A1/de not_active Ceased
-
2000
- 2000-01-13 RU RU2001122809/09A patent/RU2220476C2/ru not_active IP Right Cessation
- 2000-01-13 CN CNB008028125A patent/CN1150622C/zh not_active Expired - Fee Related
- 2000-01-13 EP EP00907422A patent/EP1129485B1/de not_active Expired - Lifetime
- 2000-01-13 AT AT00907422T patent/ATE357743T1/de not_active IP Right Cessation
- 2000-01-13 UA UA2001074959A patent/UA72234C2/uk unknown
- 2000-01-13 KR KR10-2001-7008944A patent/KR100426232B1/ko not_active IP Right Cessation
- 2000-01-13 DE DE50014183T patent/DE50014183D1/de not_active Expired - Lifetime
- 2000-01-13 WO PCT/DE2000/000112 patent/WO2000042657A1/de active IP Right Grant
- 2000-01-13 BR BR0007562-0A patent/BR0007562A/pt not_active IP Right Cessation
- 2000-01-13 JP JP2000594156A patent/JP4035289B2/ja not_active Expired - Fee Related
-
2001
- 2001-07-16 US US09/906,475 patent/US6714392B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020066942A1 (en) | 2002-06-06 |
US6714392B2 (en) | 2004-03-30 |
DE19901384A1 (de) | 2000-07-27 |
KR100426232B1 (ko) | 2004-04-08 |
EP1129485A1 (de) | 2001-09-05 |
KR20010101546A (ko) | 2001-11-14 |
UA72234C2 (uk) | 2005-02-15 |
DE50014183D1 (de) | 2007-05-03 |
WO2000042657A1 (de) | 2000-07-20 |
RU2220476C2 (ru) | 2003-12-27 |
JP4035289B2 (ja) | 2008-01-16 |
JP2002535837A (ja) | 2002-10-22 |
CN1337066A (zh) | 2002-02-20 |
EP1129485B1 (de) | 2007-03-21 |
ATE357743T1 (de) | 2007-04-15 |
CN1150622C (zh) | 2004-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR0007562A (pt) | Componente eletrônico e utilização de uma estrutura de proteção nele contida | |
ATE233434T1 (de) | Optoelektronisches sensor-bauelement | |
ATE400447T1 (de) | Optisch variables element mit elektrisch aktiver schicht | |
BR0309043A (pt) | Blindagem de interferência eletromagnética (emi) de nìvel de placa | |
ES2182550T3 (es) | Dispositivo sensor para la deteccion de caracteristicas biometricas, especialmente huellas dactilares. | |
IT1276178B1 (it) | Componente elettronico pluripolare montabile sulla superficie | |
TW200601959A (en) | Electromagnetic shield assembly | |
KR920007199A (ko) | 반도체기억장치 | |
KR970006534B1 (en) | Semiconductor integrated circuit package and its manufacture and its mounting method | |
ATE352977T1 (de) | Leiterplatte mit mindestens einem elektronischen bauteil | |
SE9802157D0 (sv) | Elektrisk komponent | |
DE69904889D1 (de) | Elektrisch leitende Paste und Glassubstrat mit aufgetragenem elektrischen Schaltkreis | |
ATE240581T1 (de) | Folie für einen folienkondensator und folienkondensator | |
BR0015835A (pt) | Suporte plano com ao menos um chip semicondutor | |
BR9714669A (pt) | Placa condutora para aparelhos elétricos com componentes hf, especialmente para aparelhos móveis de radio telecomunicação. | |
DE59510918D1 (de) | Halbleiterbauelement mit isolierendem Gehäuse | |
TW200505256A (en) | Electroluminescent device with improved light decoupling | |
SE0001504D0 (sv) | Elektrisk komponent och denna användande radioterminal | |
KR950034895A (ko) | 무선 전화기에 장착한 안테나 소자 | |
SG131744A1 (en) | Circuit board protection cover and circuit board having circuit board protection cover | |
AU5621199A (en) | Improvements in or relating to electronic components | |
TW200505315A (en) | Conductive sheet having more than one through hole or via hole | |
ATE533177T1 (de) | Dielektrischer film | |
MXPA01008753A (es) | Revestimiento conductor o de disipacion estatica. | |
WO2002096164A3 (de) | Verfahren zur abschirmung einer auf einer leiterplatte realisierten elektrischen schaltung und eine entsprechende kombination einer leiterplatte mit einer abschirmung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 11A ANUIDADE(S). |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2125 DE 27/09/2011. |