BE846736A - Procede pour croquer une feuille de matiere cassante - Google Patents

Procede pour croquer une feuille de matiere cassante

Info

Publication number
BE846736A
BE846736A BE171072A BE171072A BE846736A BE 846736 A BE846736 A BE 846736A BE 171072 A BE171072 A BE 171072A BE 171072 A BE171072 A BE 171072A BE 846736 A BE846736 A BE 846736A
Authority
BE
Belgium
Prior art keywords
bunching
sheet
broken matter
broken
matter
Prior art date
Application number
BE171072A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE846736A publication Critical patent/BE846736A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
BE171072A 1975-09-29 1976-09-29 Procede pour croquer une feuille de matiere cassante BE846736A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/617,632 US4068788A (en) 1975-09-29 1975-09-29 Method for cracking brittle material

Publications (1)

Publication Number Publication Date
BE846736A true BE846736A (fr) 1977-01-17

Family

ID=24474406

Family Applications (1)

Application Number Title Priority Date Filing Date
BE171072A BE846736A (fr) 1975-09-29 1976-09-29 Procede pour croquer une feuille de matiere cassante

Country Status (3)

Country Link
US (1) US4068788A (fr)
BE (1) BE846736A (fr)
GB (1) GB1496479A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4235357A (en) * 1978-09-11 1980-11-25 Mti Systems Corporation Substrate separating machine and method
US4352446A (en) * 1978-09-11 1982-10-05 Mti Systems Corporation Substrate separating machine and method
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
US4997792A (en) * 1989-11-21 1991-03-05 Eastman Kodak Company Method for separation of diode array chips during fabrication thereof
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
US5458269A (en) * 1991-12-06 1995-10-17 Loomis; James W. Frangible semiconductor wafer dicing method which employs scribing and breaking
IT1274540B (it) * 1995-05-22 1997-07-17 Alcatel Italia Metodo e dispositivo per eseguire la sfaldatura in ultra-vuoto di porzioni di wafer di semiconduttore processato
US8220685B1 (en) 2005-09-08 2012-07-17 Micro Processing Technology, Inc. System for breaking a semiconductor wafer or other workpiece along a scribe line
CN105382946A (zh) * 2015-12-17 2016-03-09 哈尔滨新力光电技术有限公司 蓝宝石led条自动高效裂片机及裂片方法
JP6949371B2 (ja) * 2017-12-15 2021-10-13 三星ダイヤモンド工業株式会社 基板分断装置
KR20190134004A (ko) * 2018-05-24 2019-12-04 주식회사 탑 엔지니어링 기판 브레이킹 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2659950A (en) * 1950-08-14 1953-11-24 Charles D West Trim molding fastening means and method
US3149765A (en) * 1963-05-28 1964-09-22 Western Electric Co Apparatus for removing waffrs from semiconductor slices
US3602410A (en) * 1967-09-22 1971-08-31 Jones & Laughlin Steel Corp Method or producing steel fibers
CA858142A (en) * 1969-04-26 1970-12-08 R. St. Louis Jacques Method and apparatus for dicing and cleaning semi-conductor slices
US3790051A (en) * 1971-09-07 1974-02-05 Radiant Energy Systems Semiconductor wafer fracturing technique employing a pressure controlled roller
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice

Also Published As

Publication number Publication date
GB1496479A (en) 1977-12-30
US4068788A (en) 1978-01-17

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