BE825692A - Procede de deposition electrolytique - Google Patents
Procede de deposition electrolytiqueInfo
- Publication number
- BE825692A BE825692A BE153483A BE153483A BE825692A BE 825692 A BE825692 A BE 825692A BE 153483 A BE153483 A BE 153483A BE 153483 A BE153483 A BE 153483A BE 825692 A BE825692 A BE 825692A
- Authority
- BE
- Belgium
- Prior art keywords
- deposition process
- electrolytic deposition
- electrolytic
- deposition
- Prior art date
Links
- 238000005137 deposition process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US443624A US3926747A (en) | 1974-02-19 | 1974-02-19 | Selective electrodeposition of gold on electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
BE825692A true BE825692A (fr) | 1975-06-16 |
Family
ID=23761548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE153483A BE825692A (fr) | 1974-02-19 | 1975-02-19 | Procede de deposition electrolytique |
Country Status (3)
Country | Link |
---|---|
US (1) | US3926747A (fr) |
BE (1) | BE825692A (fr) |
CA (1) | CA1034898A (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4062750A (en) * | 1974-12-18 | 1977-12-13 | James Francis Butler | Thin film electrochemical electrode and cell |
US4095876A (en) * | 1975-12-08 | 1978-06-20 | Rca Corporation | Liquid crystal device and method for preparing same |
US4176443A (en) * | 1977-03-08 | 1979-12-04 | Sgs-Ates Componenti Elettronici S.P.A. | Method of connecting semiconductor structure to external circuits |
US4414076A (en) * | 1983-03-01 | 1983-11-08 | The United States Of America As Represented By The Secretary Of The Navy | Low resistance ohmic contact |
JPH05206134A (ja) * | 1991-11-12 | 1993-08-13 | Nec Corp | 半導体装置とその製造方法 |
JPH06326297A (ja) * | 1993-03-19 | 1994-11-25 | Nec Corp | 半導体装置 |
US6476623B1 (en) * | 2000-09-21 | 2002-11-05 | Motorola, Inc. | Percent backsputtering as a control parameter for metallization |
DE10360206B4 (de) * | 2003-12-13 | 2008-05-29 | Infineon Technologies Ag | Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung |
US20130175677A1 (en) * | 2012-01-06 | 2013-07-11 | Texas Instruments Incorporated | Integrated Circuit Device With Wire Bond Connections |
US9851337B2 (en) * | 2013-12-06 | 2017-12-26 | The University Of Akron | Universal water condition monitoring device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1862231A (en) * | 1928-06-22 | 1932-06-07 | Wadsworth Watch Case Co | Decorating base metals or alloys of base metals |
US1750418A (en) * | 1928-12-05 | 1930-03-11 | Wadsworth Watch Case Co | Etching and decorating metal surfaces |
US2367314A (en) * | 1941-06-24 | 1945-01-16 | Western Electric Co | Electrolytic method of coating localized areas of articles |
BE570082A (fr) * | 1957-08-07 | 1900-01-01 | ||
US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
US3274670A (en) * | 1965-03-18 | 1966-09-27 | Bell Telephone Labor Inc | Semiconductor contact |
US3388048A (en) * | 1965-12-07 | 1968-06-11 | Bell Telephone Labor Inc | Fabrication of beam lead semiconductor devices |
GB1175667A (en) * | 1966-04-07 | 1969-12-23 | Associated Semiconductor Mft | Improvements in the Electrodeposition of Metals using a Composite Mask |
US3663279A (en) * | 1969-11-19 | 1972-05-16 | Bell Telephone Labor Inc | Passivated semiconductor devices |
US3708403A (en) * | 1971-09-01 | 1973-01-02 | L Terry | Self-aligning electroplating mask |
US3809625A (en) * | 1972-08-15 | 1974-05-07 | Gen Motors Corp | Method of making contact bumps on flip-chips |
-
1974
- 1974-02-19 US US443624A patent/US3926747A/en not_active Expired - Lifetime
-
1975
- 1975-02-18 CA CA220,365A patent/CA1034898A/fr not_active Expired
- 1975-02-19 BE BE153483A patent/BE825692A/fr not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US3926747A (en) | 1975-12-16 |
CA1034898A (fr) | 1978-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: WESTERN ELECTRIC CY INC. Effective date: 19870228 |