Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
  • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
  • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/10—Details of semiconductor or other solid state devices to be connected
  • H01L2924/11—Device type
  • H01L2924/13—Discrete devices, e.g. 3 terminal devices
  • H01L2924/1301—Thyristor

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Die Bonding (AREA)
• Thyristors (AREA)
• Ignition Installations For Internal Combustion Engines (AREA)
• Spark Plugs (AREA)
• Wire Bonding (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=5857001

Family Applications (1)

Country Status (12)

Families Citing this family (10)

Family Cites Families (7)

• 1972
  • 1972-09-21 DE DE722246423A patent/DE2246423C3/en not_active Expired
• 1973
  • 1973-06-26 GB GB3034273A patent/GB1379017A/en not_active Expired
  • 1973-07-05 CH CH982573A patent/CH562514A5/xx not_active IP Right Cessation
  • 1973-07-19 AT AT639673A patent/AT322041B/en not_active IP Right Cessation
  • 1973-08-10 NL NL7311103A patent/NL7311103A/xx unknown
  • 1973-09-14 US US39740373 patent/US3886586A/en not_active Expired - Lifetime
  • 1973-09-18 IT IT2901973A patent/IT993272B/en active
  • 1973-09-20 JP JP10641173A patent/JPS4971876A/ja active Pending
  • 1973-09-20 CA CA181,510A patent/CA998475A/en not_active Expired
  • 1973-09-20 FR FR7333756A patent/FR2200626B1/fr not_active Expired
  • 1973-09-21 BE BE135914A patent/BE805166A/en unknown
  • 1973-09-21 SE SE7312920A patent/SE395202B/en unknown

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