BE705024A - - Google Patents
Info
- Publication number
- BE705024A BE705024A BE705024A BE705024A BE705024A BE 705024 A BE705024 A BE 705024A BE 705024 A BE705024 A BE 705024A BE 705024 A BE705024 A BE 705024A BE 705024 A BE705024 A BE 705024A
- Authority
- BE
- Belgium
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58542866A | 1966-10-10 | 1966-10-10 | |
US58618766A | 1966-10-12 | 1966-10-12 | |
US58618866A | 1966-10-12 | 1966-10-12 | |
US10032770A | 1970-12-21 | 1970-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE705024A true BE705024A (xx) | 1968-02-15 |
Family
ID=27493123
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE704885A BE704885A (xx) | 1966-10-10 | 1967-10-10 | |
BE705023A BE705023A (xx) | 1966-10-10 | 1967-10-12 | |
BE705024A BE705024A (xx) | 1966-10-10 | 1967-10-12 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE704885A BE704885A (xx) | 1966-10-10 | 1967-10-10 | |
BE705023A BE705023A (xx) | 1966-10-10 | 1967-10-12 |
Country Status (5)
Country | Link |
---|---|
US (2) | US3457472A (xx) |
BE (3) | BE704885A (xx) |
DE (2) | DE1589854C3 (xx) |
GB (3) | GB1191889A (xx) |
SE (3) | SE355436B (xx) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3581163A (en) * | 1968-04-09 | 1971-05-25 | Gen Electric | High-current semiconductor rectifier assemblies |
US3581160A (en) * | 1968-12-23 | 1971-05-25 | Gen Electric | Semiconductor rectifier assembly having high explosion rating |
US3705255A (en) * | 1970-10-27 | 1972-12-05 | Nasa | Hermetically sealed semiconductor |
US3654529A (en) * | 1971-04-05 | 1972-04-04 | Gen Electric | Loose contact press pack |
US3831067A (en) * | 1972-05-15 | 1974-08-20 | Int Rectifier Corp | Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring |
US3852804A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Double-sided heat-pipe cooled power semiconductor device assembly |
US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
US3852803A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat sink cooled power semiconductor device assembly having liquid metal interface |
US3852805A (en) * | 1973-06-18 | 1974-12-03 | Gen Electric | Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit |
DE2332896B2 (de) * | 1973-06-28 | 1978-12-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement |
JPS5241146B2 (xx) * | 1974-01-30 | 1977-10-17 | ||
US4327370A (en) * | 1979-06-28 | 1982-04-27 | Rca Corporation | Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device |
US4924345A (en) * | 1988-05-04 | 1990-05-08 | The Siemon Company | Combined transient voltage and sneak current protector |
JPH0744191B2 (ja) * | 1989-12-15 | 1995-05-15 | 三菱電機株式会社 | 半導体装置およびそのための電極ブロック |
DE19800469A1 (de) * | 1998-01-09 | 1999-07-15 | Asea Brown Boveri | Niederinduktiv angesteuerter, gategesteuerter Thyristor |
JP2000228451A (ja) * | 1999-02-05 | 2000-08-15 | Matsushita Electric Ind Co Ltd | 電子部品 |
EP2447988B1 (en) | 2010-11-02 | 2015-05-06 | GE Energy Power Conversion Technology Limited | Power electronic device with edge passivation |
EP4372806A1 (en) * | 2022-11-15 | 2024-05-22 | GE Energy Power Conversion Technology Ltd | Heatsink for cooling electronic device packages and associated packaging stack |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2662997A (en) * | 1951-11-23 | 1953-12-15 | Bell Telephone Labor Inc | Mounting for semiconductors |
US2904431A (en) * | 1954-08-26 | 1959-09-15 | Rca Corp | Electrographotographic charging means |
US2854609A (en) * | 1955-01-26 | 1958-09-30 | Westinghouse Air Brake Co | Rectifier stack assemblies |
NL111799C (xx) * | 1957-03-01 | 1900-01-01 | ||
BE620870A (xx) * | 1961-08-04 | 1900-01-01 | ||
US3226608A (en) * | 1959-06-24 | 1965-12-28 | Gen Electric | Liquid metal electrical connection |
NL291270A (xx) * | 1961-08-12 | |||
US3248615A (en) * | 1963-05-13 | 1966-04-26 | Bbc Brown Boveri & Cie | Semiconductor device with liquidized solder layer for compensation of expansion stresses |
NL302170A (xx) * | 1963-06-15 | |||
NO118754B (xx) * | 1964-04-20 | 1970-02-09 | Asea Ab | |
US3293508A (en) * | 1964-04-21 | 1966-12-20 | Int Rectifier Corp | Compression connected semiconductor device |
US3313987A (en) * | 1964-04-22 | 1967-04-11 | Int Rectifier Corp | Compression bonded semiconductor device |
US3319136A (en) * | 1964-09-08 | 1967-05-09 | Dunlee Corp | Rectifier |
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1966
- 1966-10-12 US US3457472D patent/US3457472A/en not_active Expired - Lifetime
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1967
- 1967-09-25 GB GB4360867A patent/GB1191889A/en not_active Expired
- 1967-09-25 GB GB4360967A patent/GB1191890A/en not_active Expired
- 1967-09-25 GB GB4360767A patent/GB1191888A/en not_active Expired
- 1967-10-05 SE SE1365567A patent/SE355436B/xx unknown
- 1967-10-07 DE DE1589854A patent/DE1589854C3/de not_active Expired
- 1967-10-10 BE BE704885A patent/BE704885A/xx unknown
- 1967-10-11 DE DE1967G0051296 patent/DE1589857A1/de active Pending
- 1967-10-12 BE BE705023A patent/BE705023A/xx unknown
- 1967-10-12 BE BE705024A patent/BE705024A/xx unknown
- 1967-10-12 SE SE1396667A patent/SE338370B/xx unknown
- 1967-10-12 SE SE1396767A patent/SE334422B/xx unknown
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1970
- 1970-12-21 US US3736474D patent/US3736474A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE1589854C3 (de) | 1975-07-24 |
DE1589854A1 (de) | 1972-02-03 |
BE705023A (xx) | 1968-02-15 |
DE1589854B2 (de) | 1974-11-28 |
SE338370B (xx) | 1971-09-06 |
US3736474A (en) | 1973-05-29 |
GB1191888A (en) | 1970-05-13 |
GB1191890A (en) | 1970-05-13 |
BE704885A (xx) | 1968-02-15 |
DE1589857A1 (de) | 1971-02-18 |
GB1191889A (en) | 1970-05-13 |
SE334422B (xx) | 1971-04-26 |
SE355436B (xx) | 1973-04-16 |
US3457472A (en) | 1969-07-22 |