BE630876A - - Google Patents
Info
- Publication number
- BE630876A BE630876A BE630876DA BE630876A BE 630876 A BE630876 A BE 630876A BE 630876D A BE630876D A BE 630876DA BE 630876 A BE630876 A BE 630876A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
- H01J19/28—Non-electron-emitting electrodes; Screens
- H01J19/32—Anodes
- H01J19/36—Cooling of anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
- H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0001—Electrodes and electrode systems suitable for discharge tubes or lamps
- H01J2893/0012—Constructional arrangements
- H01J2893/0027—Mitigation of temperature effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US220261A US3277346A (en) | 1962-08-29 | 1962-08-29 | Cooler package for electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
BE630876A true BE630876A (de) |
Family
ID=22822803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE630876D BE630876A (de) | 1962-08-29 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3277346A (de) |
JP (1) | JPS4015780B1 (de) |
BE (1) | BE630876A (de) |
CH (1) | CH423994A (de) |
GB (1) | GB976053A (de) |
NL (2) | NL122287C (de) |
SE (1) | SE310220B (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3356902A (en) * | 1966-10-20 | 1967-12-05 | Lear Siegler Inc | Mounting chassis for electrical components |
CA828390A (en) * | 1967-02-15 | 1969-11-25 | Powercube Corporation | Modular circuit package |
US3434014A (en) * | 1967-06-13 | 1969-03-18 | Rca Corp | Packaging of electrical equipment |
US3961666A (en) * | 1972-11-24 | 1976-06-08 | Sony Corporation | Heat dispersion device for use in an electronic apparatus |
US3967874A (en) * | 1975-09-30 | 1976-07-06 | Calabro Anthony Denis | Uniformly cooled printed circuit board mounting assembly |
US5038088A (en) * | 1985-12-30 | 1991-08-06 | Arends Gregory E | Stepper motor system |
US4779031A (en) * | 1985-12-30 | 1988-10-18 | Intellico, Inc. | Motor system |
US4691274A (en) * | 1986-04-29 | 1987-09-01 | Modular Power Corporation | Modular electronic power supply |
US4730235A (en) * | 1987-01-16 | 1988-03-08 | Itek Corporation | Cascadable carrier for high power semiconductors or other electronic components |
DE4015030C1 (de) * | 1990-05-10 | 1991-11-21 | Bicc-Vero Elektronics Gmbh, 2800 Bremen, De | |
US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
GB9301049D0 (en) * | 1993-01-20 | 1993-03-10 | The Technology Partnership Plc | Mounting assembly |
US5353863A (en) * | 1994-03-07 | 1994-10-11 | Yu Chi T | Pentium CPU cooling device |
JP3942248B2 (ja) * | 1997-02-24 | 2007-07-11 | 富士通株式会社 | ヒートシンクおよびそれを搭載した情報処理装置 |
US6125920A (en) * | 1997-10-16 | 2000-10-03 | Herbert; Edward | Fan with heat sink using stamped heat sink fins |
JP2001210763A (ja) * | 2000-01-27 | 2001-08-03 | Mitsubishi Electric Corp | 半導体モジュ−ル装置 |
US7017651B1 (en) * | 2000-09-13 | 2006-03-28 | Raytheon Company | Method and apparatus for temperature gradient control in an electronic system |
US7148452B2 (en) * | 2001-04-03 | 2006-12-12 | Emerson Electric Co. | Heat sink for printed circuit board components |
DE10140328B4 (de) * | 2001-08-16 | 2006-02-02 | Siemens Ag | Kühlanordnung zur Kühlung elektronischer Bauelemente |
US6580608B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Method and apparatus for thermally controlling multiple electronic components |
TW545623U (en) * | 2001-12-27 | 2003-08-01 | Chin-Wen Wang | Rotation type CPU cooling device |
GB2388469A (en) * | 2002-04-16 | 2003-11-12 | Chin-Wen Wang | Heat radiator |
JP2005328659A (ja) * | 2004-05-14 | 2005-11-24 | Sansha Electric Mfg Co Ltd | 電子負荷装置および電源装置の防塵冷却構造 |
EP1684344A3 (de) * | 2005-01-25 | 2006-10-18 | Coolit Systems Inc. | Kühlkörper |
CA2573941A1 (en) | 2007-01-15 | 2008-07-15 | Coolit Systems Inc. | Computer cooling system |
US7626822B2 (en) * | 2007-12-12 | 2009-12-01 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly for multiple electronic components |
US7796388B2 (en) * | 2008-03-17 | 2010-09-14 | Ut-Battelle, Llc | Direct cooled power electronics substrate |
FI122215B (fi) * | 2009-03-13 | 2011-10-14 | Abb Oy | Järjestely moottoriohjainta varten |
US8174826B2 (en) | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8279597B2 (en) | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
US8179674B2 (en) | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
US8358503B2 (en) | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
JP5695115B2 (ja) * | 2013-03-30 | 2015-04-01 | 三協立山株式会社 | ヒートシンク及びその製造方法 |
DE112015004112T5 (de) * | 2014-10-08 | 2017-07-20 | Remy Technologies Llc | Elektronikkühlturm einer sich axial erstreckenden elektrischen Maschine |
WO2016057558A1 (en) * | 2014-10-08 | 2016-04-14 | Remy Technologies, Llc | Centrally located control electronics for electric machine |
EP3018709B1 (de) * | 2014-11-04 | 2018-07-18 | SEMIKRON Elektronik GmbH & Co. KG | Stromrichtereinrichtung |
TWI539894B (zh) * | 2014-11-28 | 2016-06-21 | 財團法人工業技術研究院 | 功率模組 |
EP3113221B1 (de) * | 2015-07-02 | 2020-03-18 | Rohde & Schwarz GmbH & Co. KG | Passives kühlmodul |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE527420A (de) * | 1953-03-20 | |||
GB768103A (en) * | 1954-08-17 | 1957-02-13 | Gen Electric Co Ltd | Improvements in or relating to semiconductor devices |
US2998962A (en) * | 1957-09-10 | 1961-09-05 | Ind Co Kleinewefers Konst | Cylindrical radiation recuperator with upper and lower air distributor |
GB882788A (en) * | 1958-07-05 | 1961-11-22 | Reinold Hagen | Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material |
US2999971A (en) * | 1958-07-10 | 1961-09-12 | Siemens Ag | Power current rectifier with semiconducting rectifier units |
US3149666A (en) * | 1961-06-15 | 1964-09-22 | Wakefield Eng Inc | Cooler |
-
0
- NL NL291309D patent/NL291309A/xx unknown
- NL NL122287D patent/NL122287C/xx active
- BE BE630876D patent/BE630876A/xx unknown
-
1962
- 1962-08-29 US US220261A patent/US3277346A/en not_active Expired - Lifetime
-
1963
- 1963-03-28 GB GB12283/63A patent/GB976053A/en not_active Expired
- 1963-04-08 CH CH443763A patent/CH423994A/de unknown
- 1963-04-10 JP JP1890963A patent/JPS4015780B1/ja active Pending
- 1963-04-10 SE SE3990/63A patent/SE310220B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB976053A (en) | 1964-11-25 |
US3277346A (en) | 1966-10-04 |
NL122287C (de) | |
NL291309A (de) | |
SE310220B (de) | 1969-04-21 |
JPS4015780B1 (de) | 1965-07-22 |
CH423994A (de) | 1966-11-15 |