AU9547998A - Soldering method and apparatus - Google Patents

Soldering method and apparatus

Info

Publication number
AU9547998A
AU9547998A AU95479/98A AU9547998A AU9547998A AU 9547998 A AU9547998 A AU 9547998A AU 95479/98 A AU95479/98 A AU 95479/98A AU 9547998 A AU9547998 A AU 9547998A AU 9547998 A AU9547998 A AU 9547998A
Authority
AU
Australia
Prior art keywords
soldering method
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU95479/98A
Inventor
Ralph Miles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alphr Technology Ltd
Original Assignee
Alphr Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alphr Technology Ltd filed Critical Alphr Technology Ltd
Publication of AU9547998A publication Critical patent/AU9547998A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
AU95479/98A 1997-10-23 1998-10-16 Soldering method and apparatus Abandoned AU9547998A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB9722305.1A GB9722305D0 (en) 1997-10-23 1997-10-23 Method and apparatus
GB9722305 1997-10-23
PCT/GB1998/003095 WO1999021676A1 (en) 1997-10-23 1998-10-16 Soldering method and apparatus

Publications (1)

Publication Number Publication Date
AU9547998A true AU9547998A (en) 1999-05-17

Family

ID=10820916

Family Applications (1)

Application Number Title Priority Date Filing Date
AU95479/98A Abandoned AU9547998A (en) 1997-10-23 1998-10-16 Soldering method and apparatus

Country Status (3)

Country Link
AU (1) AU9547998A (en)
GB (1) GB9722305D0 (en)
WO (1) WO1999021676A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308817A1 (en) * 2003-02-27 2004-09-09 Endress + Hauser Gmbh + Co. Kg Printed circuit board and method for fixing wired components on the printed circuit board
EP1878527A1 (en) * 2006-07-10 2008-01-16 Linde Aktiengesellschaft Process and apparatus for reflow soldering with two different gases
DE102013217952B3 (en) 2013-09-09 2014-11-06 Ersa Gmbh Device for supplying a hot gas stream
JP7426771B2 (en) * 2018-04-11 2024-02-02 太陽誘電株式会社 Manufacturing method of multilayer ceramic capacitor
US10868401B1 (en) * 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE414666B (en) * 1973-08-22 1980-08-11 Fortune William S DEVICE FOR HEATING AIR.
ATE90247T1 (en) * 1987-08-31 1993-06-15 Siemens Ag SOLDERING HEAD FOR SOLDERING OR SOLDERING COMPONENTS BY HEATING BY HOT GAS, ESPECIALLY FOR SURFACE MOUNT COMPONENTS (SMD).
KR910005959B1 (en) * 1988-01-19 1991-08-09 니혼 덴네쯔 게이기 가부시끼가이샤 Reflow soldering device
US4971554A (en) * 1988-08-30 1990-11-20 Semiconductor Equipment Corporation Multi-nozzle surface mount rework system
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
DE19527398A1 (en) * 1995-07-27 1997-01-30 Philips Patentverwaltung Process for soldering components on a carrier film

Also Published As

Publication number Publication date
GB9722305D0 (en) 1997-12-17
WO1999021676A1 (en) 1999-05-06

Similar Documents

Publication Publication Date Title
AU6376098A (en) Receiving apparatus and receiving method
AU6378498A (en) Receiving apparatus and receiving method
AU9202698A (en) Exchange method and apparatus
AU7161598A (en) Goniometer-based body-tracking device and method
AU9370298A (en) Down/up-conversion apparatus and method
AU3970899A (en) Ferrographic method and apparatus
AU8700798A (en) Intravascular apparatus and method
AU5810399A (en) Matrix-inductor soldering apparatus and soldering process
AU6363898A (en) Receiving apparatus and method
EP1125316B8 (en) Component affixing method and apparatus
AUPM606494A0 (en) Apparatus and method
AU6433798A (en) Energy-depleted radiation apparatus and method
AU5498298A (en) Sintering method and sintering apparatus
AU2337697A (en) Welding apparatus and method
AU9547998A (en) Soldering method and apparatus
AUPO800397A0 (en) Supply method and apparatus (F1)
HK1019391A1 (en) Soldering method and apparatus
GB2326428B (en) Apparatus and method
AU7341998A (en) Perforating apparatus and method
AU6159898A (en) Plating apparatus and method
AUPO995597A0 (en) Halftoning method and apparatus
GB9805269D0 (en) Method and apparatus
AUPM904194A0 (en) Method and apparatus
AU1521399A (en) Crane apparatus and method
AU1326699A (en) Halftoning method and apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase